LFXP10E-4FN388I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 276 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10E-4FN388I – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
The LFXP10E-4FN388I is a non-volatile, reconfigurable FPGA from the Lattice XP family designed for industrial applications. It integrates approximately 10,000 logic elements and flexible I/O in a compact 388-ball fpBGA package, delivering a balance of integration and configurability for embedded systems and industrial designs.
With instant-on non-volatile architecture, on-chip embedded memory and extensive I/O capability, this device targets systems that require fast startup, in-field reconfiguration and robust operation across a wide temperature range.
Key Features
- Core Capacity — 10,000 logic elements arranged across 1,216 internal logic blocks, providing substantial programmable logic for mid-density designs.
- Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for embedded and distributed memory resources.
- I/O Resources — 244 user I/Os to support diverse peripheral interfaces and system connectivity.
- Non-volatile, Instant-on Architecture — Device powers up and configures without external configuration memory; supports in-field reconfiguration and secured bitstream storage.
- Flexible I/O Standards — Family-level support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and related standards.
- Clocking and Memory Controllers — Up to four analog PLLs per device and dedicated DDR memory interface support (family-level capability).
- Low-Voltage Core — Core supply specified between 1.14 V and 1.26 V for low-voltage operation.
- Package and Mounting — 388-ball fpBGA (23 × 23 mm) supplier package (388-FPBGA) optimized for surface-mount assembly.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Automation — Control and interface functions that benefit from reconfigurable logic, extended temperature range and high I/O counts.
- Communications and Networking — Protocol adaptation, interface bridging and deterministic startup using the device’s flexible I/O and instant-on capability.
- Embedded Systems — System integration where on-chip memory, multiple PLLs and reconfigurability simplify board-level design.
- Field Upgradable Equipment — Products requiring in-field logic updates and secure, non-volatile configuration storage.
Unique Advantages
- Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and enables rapid system startup.
- High Integration in a Compact Package: 10,000 logic elements and 244 I/Os in a 388-ball fpBGA reduce board area and BOM complexity.
- Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in demanding environments.
- Flexible I/O and Memory Support: Wide family-level I/O standard support and embedded RAM simplify interface and buffering designs.
- Low-Voltage Core: Core supply specified at 1.14–1.26 V for compatibility with modern low-voltage system architectures.
- RoHS Compliant: Aligns with environmental and manufacturing requirements.
Why Choose LFXP10E-4FN388I?
The LFXP10E-4FN388I positions itself as a mid-density, industrial-grade FPGA offering a combination of non-volatile instant-on operation, significant logic capacity and broad I/O capability in a compact 388-ball fpBGA package. It is well-suited for engineers designing embedded and industrial systems that require secure configuration, in-field reconfiguration and reliable operation across a wide temperature range.
For development and production teams, the device’s mix of embedded memory, multiple PLLs and flexible I/O standards provides a scalable platform for migrating or consolidating logic functions while keeping board-level complexity and component count under control.
Request a quote or submit a purchasing inquiry to receive pricing, availability and lead-time information for the LFXP10E-4FN388I. Our team will assist with technical and procurement details to support your design and production timelines.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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