LFXP10C-5F388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 1,267 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-5F388C – XP Field Programmable Gate Array (FPGA), 10,000 logic elements, 244 I/Os, 388‑BBGA
The LFXP10C-5F388C from Lattice Semiconductor is a member of the LatticeXP non‑volatile FPGA family. It combines reconfigurable logic, embedded memory and flexible high‑performance I/Os in a single surface‑mount 388‑ball FBGA package for commercial‑temperature designs.
This device is intended for embedded designs that require instant‑on behavior, in‑field reconfiguration and a balance of logic capacity and on‑chip memory with extensive I/O options.
Key Features
- Core Logic – 10,000 logic elements organized across 1,216 logic blocks, providing the programmable fabric required for complex embedded functions.
- Embedded Memory – Approximately 0.22 Mbits of on‑chip RAM (221,184 bits) for distributed and block memory requirements within designs.
- I/O and Interfaces – Up to 244 I/Os supported in the 388‑ball package; programmable sysIO™ buffers support a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- Configuration and Security – Non‑volatile, instant‑on architecture that eliminates the need for external configuration memory and secures designs from bitstream read‑back; SRAM logic can be reconfigured in milliseconds.
- In‑Field Reconfiguration – TransFR™ reconfiguration enables logic updates while the system remains operational, supporting in‑field feature upgrades.
- Clocking – Up to four sysCLOCK™ analog PLLs per device for clock multiplication, division and phase shifting to meet complex timing requirements.
- Memory Interfaces – Dedicated DDR memory support with interfaces up to DDR333 (166 MHz) for external memory connectivity.
- Low Power and Sleep Mode – Sleep mode capability supporting up to 1000× static current reduction for power‑sensitive applications.
- Package and Electrical – 388‑ball FPBGA (23 × 23 mm) surface mount package; supply voltage range 1.71 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
- Standards and Tools – System‑level support includes IEEE 1149.1 boundary scan and onboard ispTRACY™ internal logic analyzer capability for debug and validation.
- Compliance – RoHS compliant.
Typical Applications
- Embedded control and interface logic – Use the FPGA as instant‑on programmable logic for control, glue logic and protocol conversion where on‑chip memory and flexible I/O standards are required.
- High‑performance I/O systems – Leverage 244 I/Os and broad sysIO™ standard support for boards that require multiple signaling standards including LVDS and SSTL.
- Field‑upgradeable products – Implement TransFR™ reconfiguration to deliver in‑field feature updates and rapid firmware improvements without complete system downtime.
- Memory interface subsystems – Use the device’s dedicated DDR support and on‑chip RAM for external memory controllers, buffering and packet handling tasks.
Unique Advantages
- Non‑volatile instant‑on operation: Eliminates external configuration memory and enables systems to power up and become operational in microseconds.
- In‑field reconfiguration capability: TransFR™ enables logic updates while the system continues to operate, simplifying upgrades and reducing service costs.
- Flexible I/O support: Programmable sysIO™ buffers cover a wide range of industry signaling standards, reducing the need for external level‑shifters or translators.
- Balanced logic and memory resources: 10,000 logic elements paired with approximately 0.22 Mbits of embedded RAM supports mid‑range designs that need both capacity and on‑chip data storage.
- Power management: Sleep mode provides significant static current reduction for energy‑sensitive applications.
- Debug and system support: IEEE 1149.1 boundary scan and ispTRACY™ internal logic analyzer capability streamline validation and bring‑up.
Why Choose LFXP10C-5F388C?
The LFXP10C-5F388C delivers a practical combination of non‑volatile, reconfigurable logic and flexible I/O in a commercial‑temperature 388‑ball FBGA package. Its instant‑on architecture and in‑field reconfiguration features make it suitable for embedded systems that require rapid startup, secure configuration and the ability to evolve in the field.
This device is well matched to engineers seeking a mid‑density FPGA solution with integrated memory, multiple PLLs and broad interface support, backed by Lattice’s system‑level features such as boundary scan and internal trace capabilities for efficient development and debug.
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