LFXP10C-4FN256I

The LFXP10C-4FN256I is a Lattice XP family field programmable gate array (FPGA) in a 256‑ball fpBGA (17×17 mm) package. It provides approximately 10,000 logic elements and embedded block RAM suitable for industrial temperature applications, delivering reconfigurable, non‑volatile logic and flexible I/O for a wide range of embedded designs.

Targeted at industrial systems that require instant-on behavior, in-field reconfiguration and a broad voltage operating window, this device combines non‑volatile configuration, on-chip memory and configurable I/O to simplify system integration and shorten development cycles.

Key Features

• Core Architecture  Approximately 10,000 logic elements organized across 1,216 logic blocks, enabling medium-density logic implementations.
• Non‑volatile, Reconfigurable  Built on ispXP technology: non‑volatile configuration with instant‑on capability and no external configuration memory required; supports reconfiguration of SRAM‑based logic in milliseconds.
• Embedded Memory  Approximately 221,184 total RAM bits (≈216 Kbits) of embedded block RAM plus distributed RAM resources for data buffering and state storage.
• Flexible I/O  Up to 188 I/Os in the 256‑fpBGA package with programmable sysIO buffers supporting multiple interface standards listed in the family data sheet (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others).
• Clocking  Up to four analog PLLs on device for clock multiply/divide and phase shifting.
• Memory Interfaces  Dedicated DDR memory support capable of interfacing up to DDR333 (166 MHz) as specified for the family.
• Low Power & Power Management  Sleep mode technology for significant static current reduction as described in the family data.
• Package and Mounting  256‑ball fpBGA (17 × 17 mm) surface‑mount package optimized for compact, high‑I/O designs.
• Voltage & Temperature  Wide supply range from 1.71 V to 3.465 V and industrial operating range from −40 °C to 100 °C.
• System Support  On‑chip features for system integration including non‑volatile configuration and JTAG programmability as documented in the family data sheet.
• Compliance  RoHS‑compliant.

Typical Applications

• Industrial Control  Deterministic, reconfigurable logic and industrial temperature operation make this FPGA suitable for motor control loops, PLC peripherals and machine automation I/O processing.
• Communications Interfaces  Flexible I/O standards and dedicated DDR support allow implementation of protocol bridging, interface translation and buffering for networked equipment.
• Embedded Processing  On‑chip block RAM and distributed memory support local data processing, lookup tables and glue logic in embedded systems and instrumentation.
• In‑field Upgradable Systems  Non‑volatile instant‑on capability plus in‑field reconfiguration features enable remote updates and iterative feature upgrades without external configuration memory.

Unique Advantages

• Non‑volatile instant‑on operation: Eliminates external configuration memory and reduces boot time by powering up in microseconds as described in the family documentation.
• In‑field reconfiguration: Supports fast SRAM reconfiguration and TransFR reconfiguration for updating logic while a system is operating.
• Flexible I/O and interface support: Programmable sysIO buffers and a broad list of supported signaling standards ease integration with mixed‑voltage systems and legacy interfaces.
• Integrated clock management: Up to four PLLs provide on‑device clock multiply/divide and phase shift capabilities for precise timing control.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compact, high‑I/O package: 256‑ball fpBGA offers a small footprint while delivering up to 188 I/Os for dense connectivity.

Why Choose LFXP10C-4FN256I?

The LFXP10C-4FN256I balances medium density logic resources with non‑volatile configuration and flexible I/O to address industrial embedded designs that require fast startup, field programmability and robust operating range. Its combination of approximately 10,000 logic elements, on‑chip block RAM and multiple PLLs supports data buffering, timing control and interface logic in a single device.

This FPGA is suited to engineering teams looking to reduce board complexity by avoiding external configuration memory, implement in‑field updates, and support a range of I/O standards while maintaining industrial temperature capability and RoHS compliance.

Request a quote or submit an RFQ to receive pricing and availability information for the LFXP10C-4FN256I.