LFXP15E-3FN484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 634 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-3FN484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA
The LFXP15E-3FN484C is a LatticeXP family FPGA offered in a 484-ball BGA (23×23 mm) surface-mount package. It integrates 15,000 logic elements, extensive on-chip memory and flexible I/O to support a wide range of embedded system designs that require non‑volatile, reconfigurable logic and fast system bring-up.
Designed for commercial applications, this device delivers instant-on non‑volatile operation, multiple PLLs for clock management and dedicated memory resources to enable high‑function implementations within a compact package.
Key Features
- Core Architecture — Non‑volatile ispXP technology Instant-on operation with no external configuration memory required; supports in‑field reconfiguration and design security.
- Logic Capacity 15,000 logic elements (corresponding to the LFXP15 family density) with an internal fabric organized for scalable designs.
- Embedded Memory Approximately 0.33 Mbits (324 Kbits / 331,776 total RAM bits) of on‑chip RAM, supporting both embedded block and distributed memory styles.
- I/O and Package Up to 300 user I/Os in a 484‑BBGA (23×23 mm) surface‑mount package, enabling dense routing and high pin‑count system interfaces.
- Clocking Up to four analog sysCLOCK™ PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
- Flexible I/O Standards Programmable sysIO™ buffer support across a wide range of interfaces (including multiple LVCMOS, SSTL, HSTL, LVDS and related standards as specified for the LatticeXP family).
- Dedicated Memory Interface Dedicated DDR memory support (device family supports interfaces up to DDR333) for system memory and buffering applications.
- Power and Temperature Low-voltage core supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.
- Power Management Features Sleep mode capability for substantial static current reduction and TransFR™ reconfiguration for in‑field logic updates while the system operates.
Typical Applications
- High‑density interface bridging: Use the 300 I/Os and programmable sysIO buffers to implement protocol translation and multi‑standard interface glue logic.
- Memory controller and buffering: Leverage the device’s on‑chip RAM and dedicated DDR interface support for memory controllers, frame buffers and data path staging.
- Embedded system control: Instant‑on non‑volatile operation and reconfigurability make the device suitable for embedded controllers and system supervisors.
- Field‑updatable logic: TransFR reconfiguration enables in‑field feature upgrades and bug fixes without full system downtime.
Unique Advantages
- Instant-on non‑volatile operation: Eliminates the need for external configuration memory and speeds system boot‑up.
- Compact, high‑pin package: 484‑BBGA (23×23 mm) provides 300 I/Os in a small footprint for space‑constrained designs.
- Balanced on‑chip memory and logic: Approximately 0.33 Mbits of embedded RAM combined with 15,000 logic elements supports data‑intensive functions without excessive external RAM.
- Robust clocking and timing control: Up to four analog PLLs enable complex clock domain management and precise timing adjustments.
- In‑field reconfigurability: TransFR and reconfigurable SRAM-based logic permit updates and feature enhancements after deployment.
- Commercial-grade readiness: Specified for 0 °C to 85 °C operation with RoHS compliance for standard commercial deployments.
Why Choose LFXP15E-3FN484C?
The LFXP15E-3FN484C combines the LatticeXP family’s non‑volatile architecture with a high logic capacity, substantial embedded memory and a large I/O count in a compact 484‑BBGA package. Its mix of instant‑on behavior, in‑field reconfiguration and flexible I/O makes it well suited to embedded designs that need rapid startup, upgradeability and a broad set of interface options.
This device is ideal for designers seeking a commercially graded, reconfigurable FPGA that balances logic density, on‑chip memory and system-level features such as multiple PLLs and dedicated DDR support to simplify system design and reduce external component count.
Request a quote or submit an inquiry to receive pricing and availability for LFXP15E-3FN484C and discuss how it fits your next design.

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