LFXP15E-3FN484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 634 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-3FN484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

The LFXP15E-3FN484C is a LatticeXP family FPGA offered in a 484-ball BGA (23×23 mm) surface-mount package. It integrates 15,000 logic elements, extensive on-chip memory and flexible I/O to support a wide range of embedded system designs that require non‑volatile, reconfigurable logic and fast system bring-up.

Designed for commercial applications, this device delivers instant-on non‑volatile operation, multiple PLLs for clock management and dedicated memory resources to enable high‑function implementations within a compact package.

Key Features

  • Core Architecture — Non‑volatile ispXP technology Instant-on operation with no external configuration memory required; supports in‑field reconfiguration and design security.
  • Logic Capacity 15,000 logic elements (corresponding to the LFXP15 family density) with an internal fabric organized for scalable designs.
  • Embedded Memory Approximately 0.33 Mbits (324 Kbits / 331,776 total RAM bits) of on‑chip RAM, supporting both embedded block and distributed memory styles.
  • I/O and Package Up to 300 user I/Os in a 484‑BBGA (23×23 mm) surface‑mount package, enabling dense routing and high pin‑count system interfaces.
  • Clocking Up to four analog sysCLOCK™ PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
  • Flexible I/O Standards Programmable sysIO™ buffer support across a wide range of interfaces (including multiple LVCMOS, SSTL, HSTL, LVDS and related standards as specified for the LatticeXP family).
  • Dedicated Memory Interface Dedicated DDR memory support (device family supports interfaces up to DDR333) for system memory and buffering applications.
  • Power and Temperature Low-voltage core supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.
  • Power Management Features Sleep mode capability for substantial static current reduction and TransFR™ reconfiguration for in‑field logic updates while the system operates.

Typical Applications

  • High‑density interface bridging: Use the 300 I/Os and programmable sysIO buffers to implement protocol translation and multi‑standard interface glue logic.
  • Memory controller and buffering: Leverage the device’s on‑chip RAM and dedicated DDR interface support for memory controllers, frame buffers and data path staging.
  • Embedded system control: Instant‑on non‑volatile operation and reconfigurability make the device suitable for embedded controllers and system supervisors.
  • Field‑updatable logic: TransFR reconfiguration enables in‑field feature upgrades and bug fixes without full system downtime.

Unique Advantages

  • Instant-on non‑volatile operation: Eliminates the need for external configuration memory and speeds system boot‑up.
  • Compact, high‑pin package: 484‑BBGA (23×23 mm) provides 300 I/Os in a small footprint for space‑constrained designs.
  • Balanced on‑chip memory and logic: Approximately 0.33 Mbits of embedded RAM combined with 15,000 logic elements supports data‑intensive functions without excessive external RAM.
  • Robust clocking and timing control: Up to four analog PLLs enable complex clock domain management and precise timing adjustments.
  • In‑field reconfigurability: TransFR and reconfigurable SRAM-based logic permit updates and feature enhancements after deployment.
  • Commercial-grade readiness: Specified for 0 °C to 85 °C operation with RoHS compliance for standard commercial deployments.

Why Choose LFXP15E-3FN484C?

The LFXP15E-3FN484C combines the LatticeXP family’s non‑volatile architecture with a high logic capacity, substantial embedded memory and a large I/O count in a compact 484‑BBGA package. Its mix of instant‑on behavior, in‑field reconfiguration and flexible I/O makes it well suited to embedded designs that need rapid startup, upgradeability and a broad set of interface options.

This device is ideal for designers seeking a commercially graded, reconfigurable FPGA that balances logic density, on‑chip memory and system-level features such as multiple PLLs and dedicated DDR support to simplify system design and reduce external component count.

Request a quote or submit an inquiry to receive pricing and availability for LFXP15E-3FN484C and discuss how it fits your next design.

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