LFXP15E-4FN256C

The LFXP15E-4FN256C is a non-volatile XP Field Programmable Gate Array (FPGA) device from Lattice Semiconductor, delivering 15,000 logic elements in a 256-ball fpBGA (17 × 17 mm) package. Designed for commercial embedded systems, the device combines reconfigurable logic, on-chip memory and flexible I/O to address a range of system-level functions.

Key attributes include instant-on non-volatile operation, in-field reconfiguration capabilities, approximately 0.332 Mbits of embedded memory and a 1.14–1.26 V core voltage range. The device is specified for commercial operating temperatures (0 °C to 85 °C) and provides 188 I/O pins for system interfacing.

Key Features

• Core Logic  Approximately 15,000 logic elements enabling medium-density integration for control, glue-logic and custom processing functions.
• Architecture & Reconfiguration  Non-volatile, infinitely reconfigurable XP architecture with instant-on behavior and TransFR™ reconfiguration for in-field logic updates while the system operates.
• Embedded Memory  Total on-chip RAM of 331,776 bits (approximately 0.332 Mbits) available as a mix of embedded block RAM and distributed RAM.
• I/O Flexibility  188 I/O pins in a 256-ball fpBGA package, supporting a wide range of system interfacing requirements.
• Clocking and Timing  Up to four analog PLLs per device for clock multiply, divide and phase shifting to support diverse timing needs.
• Power and Low-Power Modes  Core supply range of 1.14 V to 1.26 V and a sleep mode capability to significantly reduce static current for lower-power standby operation.
• System-Level Support  Onboard features for system debug and configuration including IEEE 1149.1 boundary scan and internal trace/debug capabilities as described for the LatticeXP family.
• Package & Temperature  256-ball fpBGA (17 × 17 mm) surface-mount package, commercial grade operation from 0 °C to 85 °C.

Typical Applications

• Commercial Embedded Systems  Custom control and data-path implementations that benefit from reconfigurable logic and on-chip memory.
• Interfaces and Bridge Functions  High pin-count I/O (188 pins) supports protocol bridging, peripheral interfacing and glue logic in mixed-signal systems.
• Memory Interfaces  Device architecture and available PLLs support implementations that interface with external memory subsystems.
• In-field Updatable Systems  TransFR™ reconfiguration enables logic updates in deployed equipment without removing the device from the system.

Unique Advantages

• Instant-on non-volatile operation:  Powers up quickly without external configuration memory, simplifying board-level design and startup sequence.
• In-field reconfiguration:  TransFR™ support allows logic updates while the system remains operational, enabling field upgrades and feature changes.
• Substantial on-chip RAM:  Approximately 0.332 Mbits of embedded memory reduces reliance on external RAM for many applications.
• Flexible I/O in compact package:  188 I/Os in a 256-ball fpBGA (17 × 17 mm) provide a high I/O count in a space-efficient footprint.
• Multiple PLLs for robust clocking:  Up to four analog PLLs provide clock multiplication, division and phase shifting for complex timing architectures.
• Commercial temperature rating:  Specified operation from 0 °C to 85 °C for applications targeting commercial environments.

Why Choose LFXP15E-4FN256C?

The LFXP15E-4FN256C positions itself as a compact, reconfigurable solution that balances logic density, embedded memory and a high I/O count for commercial embedded designs. Its non-volatile XP architecture and in-field reconfiguration capabilities provide design flexibility for products that require rapid startup and remote updates.

With integrated clocking resources, diagnostic support from the LatticeXP family and a well-defined power and temperature envelope, this FPGA is suited to customers seeking a scalable, reprogrammable building block for medium-density system functions and interface-heavy designs.

Request a quote or submit a pricing inquiry for LFXP15E-4FN256C to receive availability and lead-time information for your project.