LFXP15E-3FN484I

The LFXP15E-3FN484I is a LatticeXP family FPGA in a 484-ball BBGA package designed for industrial applications. It integrates approximately 15,000 logic elements, extensive embedded memory, and up to 300 I/O to support mid-density system designs that require non-volatile, reconfigurable logic.

This device targets embedded systems, industrial controllers and communications equipment where instant-on behavior, flexible I/O and in-field reconfiguration are valuable. The device combines non-volatile configuration, programmable I/O capabilities and system-level features to reduce system BOM and simplify deployment.

Key Features

• Core Logic — Approximately 15,000 logic elements providing mid-range implementation capacity for control, interface and signal-processing logic.
• Embedded Memory — Approximately 331,776 bits of on-chip RAM (embedded block RAM) plus distributed memory resources, enabling local data buffering and state storage without external SRAM.
• I/O Density — Up to 300 user I/Os in a 484-BBGA (23×23 mm) package, supporting complex multi-interface systems in a compact footprint.
• Non-Volatile, Instant-On Architecture — Family-level features include non-volatile configuration with instant-on behavior and no requirement for external configuration memory.
• In-Field Reconfiguration — Supports TransFR™ reconfiguration for in-field logic updates while the system operates, and reprogrammable SRAM logic.
• Power and Supply — Core voltage supply specified at 1.14 V to 1.26 V; device-level power modes include a Sleep Mode that can reduce static current significantly.
• Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability documented in the LatticeXP datasheet).
• Package & Mounting — 484-ball FPBGA (23×23 mm) surface-mount package, industrial grade and RoHS compliant for deployment across temperature extremes.
• Operating Range — Industrial operating temperature range from −40 °C to 100 °C suitable for demanding environments.

Typical Applications

• Industrial Control — Deterministic logic and I/O capacity for programmable controllers, motion control interfaces and machine automation.
• Communications Equipment — Protocol bridging, packet buffering and interface conversion using the device’s high I/O count and embedded RAM.
• Embedded Systems — Custom I/O handling, sensor aggregation and system glue logic where non-volatile instant-on and reconfiguration are beneficial.

Unique Advantages

• Non-volatile Instant-On: Eliminates the need for external configuration memory and enables microsecond-scale power-up of system logic.
• In-Field Reconfigurability: TransFR reconfiguration and programmable SRAM allow updates and feature changes without board-level hardware changes.
• High I/O Integration: 300 available I/Os in a compact 484-BBGA package reduce the need for external interface chips and simplify board routing.
• Industrial Thermal Range: Specified for −40 °C to 100 °C operation to meet robust deployment requirements in industrial environments.
• On-Chip Memory Resources: Hundreds of kilobits of embedded block RAM and distributed RAM support local buffering and state machine implementation without external memory.
• Power Management: Sleep mode and documented supply ranges allow designers to manage static current and meet system-level power targets.

Why Choose LFXP15E-3FN484I?

The LFXP15E-3FN484I delivers a balanced mix of logic capacity, embedded memory and high I/O density in an industrial-grade, RoHS-compliant FPBGA package. Its non-volatile instant-on architecture and in-field reconfiguration capability make it suited to applications that require rapid startup and ongoing firmware flexibility. With documented family features such as multiple PLLs, flexible I/O options and significant on-chip RAM, this device is ideal for designers seeking a compact, reconfigurable solution that reduces external component count and supports long-term scalability.

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