LFXP15E-5FN484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 24 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-5FN484C – XP Field Programmable Gate Array (15,000 logic elements, 300 I/O, 484‑BBGA)

The LFXP15E-5FN484C is a non-volatile XP family FPGA from Lattice Semiconductor designed for applications requiring high I/O density and embedded memory. The device integrates approximately 15,000 logic elements and approximately 331,776 bits of on-chip RAM to support complex, memory‑intensive functions in commercial-grade systems.

Built for instant-on operation and in-field reconfiguration, this 484-ball BGA packaged device targets embedded systems, communication interfaces and other designs that benefit from flexible I/O standards, dedicated DDR support and system-level debugging and configuration features.

Key Features

  • Core Architecture  Non-volatile, reconfigurable FPGA architecture enabling instant-on operation and fast reconfiguration of SRAM-based logic.
  • Logic Capacity  Approximately 15,000 logic elements to implement medium-density logic and glue‑logic functions.
  • Embedded Memory  Approximately 331,776 bits (~0.324 Mbits) of on-chip RAM with support for both block and distributed memory configurations for data buffering and local storage.
  • I/O and Interfaces  Up to 300 I/O pins in a 484-ball BGA (supplier package 484‑FPBGA, 23×23 mm). Programmable I/O buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
  • Dedicated Memory Interface  Implements DDR interface support up to DDR333, suitable for high-bandwidth external memory connections.
  • Clocking  Up to four analog PLLs per device for clock multiply/divide and phase shifting.
  • Power  Core voltage supply specified from 1.14 V to 1.26 V. Includes a Sleep Mode mechanism for significant static current reduction.
  • Package & Thermal  484-BBGA package with commercial-grade operating temperature of 0°C to 85°C.
  • System-Level Support  IEEE 1149.1 boundary scan, JTAG configuration and onboard oscillator. Built-in capabilities for in-field logic update and internal logic analysis.
  • Reconfiguration Features  TransFR™ reconfiguration for in-field updates and system configuration via JTAG and configuration ports.

Typical Applications

  • High-speed memory interfaces  Use the device's dedicated DDR support and abundant embedded memory for DDR controller logic and external memory bridging.
  • Communications and networking  High I/O count and multi-standard I/O buffers make the device suitable for protocol bridging, interface aggregation and I/O-heavy front-end logic.
  • Embedded control and signal processing  Implement custom control logic, peripheral interfaces and local buffering using the device's logic elements and on-chip RAM.
  • Field-updatable systems  TransFR reconfiguration and instant-on capability enable in-field logic updates and fast restart behavior for deployed equipment.
  • Test, measurement and prototyping  Boundary-scan, onboard oscillator and internal logic analysis capabilities aid system bring-up, debugging and iterative development.

Unique Advantages

  • Instant-on non-volatile operation: Eliminates the need for external configuration memory and enables rapid power‑up.
  • Flexible, high-density I/O: Up to 300 I/Os and programmable sysIO buffers support a wide range of signaling standards to minimize additional interface components.
  • Embedded memory for buffering and local data: Approximately 331,776 bits of on-chip RAM provide immediate storage for low-latency functions and data paths.
  • In-field reconfiguration: TransFR capability and JTAG-based configuration let you update logic while the system remains in service.
  • Comprehensive clocking support: Up to four analog PLLs enable flexible clock management, frequency synthesis and phase adjustments within the device.
  • Low-power options: Sleep Mode offers substantial static current reduction for power-sensitive designs.

Why Choose LFXP15E-5FN484C?

The LFXP15E-5FN484C balances logic capacity, embedded memory and a high I/O count in a compact 484-ball BGA package, delivering a versatile platform for medium-density FPGA designs in commercial applications. Its non-volatile instant-on operation, in-field reconfiguration and extensive I/O standard support make it suitable for systems that require quick start-up, flexible interfacing and ongoing field updates.

Backed by Lattice's XP family architecture and system-level features such as boundary scan, multiple PLLs and DDR interface capability, this device is well-suited for designers seeking a commercially graded FPGA with integrated memory and robust configuration options. It provides a practical path for migrating or scaling designs within the XP family.

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