LFXP15E-5FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA |
|---|---|
| Quantity | 1,398 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-5FN388C – XP FPGA, 15K Logic Elements, 388-BBGA
The LFXP15E-5FN388C is a commercial-grade, non-volatile LatticeXP family FPGA featuring approximately 15,000 logic elements and 331,776 bits of on-chip memory. Its architecture combines reconfigurable logic, embedded block RAM and flexible I/O to support system-level designs that require instant-on behavior, in-field reconfiguration and a compact 388-ball fpBGA package (23 × 23 mm).
Designed for applications that demand integrated memory, high I/O density and configurable interfaces, this device delivers system flexibility with low component count and RoHS-compliant construction. Key operating parameters include a supply voltage range of 1.14 V to 1.26 V and an ambient temperature range of 0 °C to 85 °C.
Key Features
- Core Logic — Approximately 15,000 logic elements provide the programmable fabric for custom logic integration and data-path implementation.
- FPGA Architecture Density — 1,932 architecture units (PFU/PFF total) reflect the LatticeXP LFXP15 family density and routing resources for mid-range designs.
- Embedded Memory — 331,776 bits of on-chip RAM (approximately 0.33 Mbits) across distributed and block RAM resources for FIFO, buffer and local storage needs.
- I/O and Interface Flexibility — 268 I/O pins in a 388-ball fpBGA (23 × 23 mm) footprint enable high-density external connectivity and protocol bridging.
- Dedicated DDR Support & PLLs — Family-level support for dedicated DDR interfaces and up to four analog PLLs per device provide clock management and memory interface capability.
- Non-Volatile, Instant-On — ispXP non-volatile technology eliminates the need for external configuration memory and enables microsecond power-up for faster system availability.
- In-Field Reconfiguration & Security — TransFR reconfiguration and programmable non-volatile/SRAM configuration through system and JTAG ports support in-field updates and design protection.
- Low-Power Modes — Sleep mode capability offers significant static current reduction for energy-conscious designs.
- Package & Mounting — 388-BBGA (388-FPBGA, 23 × 23 mm) surface-mount package for compact board-level integration.
- Commercial Temperature & Power — Rated for 0 °C to 85 °C operation with a core supply range of 1.14 V to 1.26 V; RoHS-compliant.
Typical Applications
- Embedded Systems — Implement hardware-accelerated functions, glue logic and custom control within compact system designs using integrated logic and memory.
- Memory Interface & Controllers — Use on-chip RAM and dedicated DDR support with PLL clocking for memory buffering and controller implementations.
- Protocol Bridging & High-Density I/O — 268 I/Os in a 388-ball fpBGA package enable bridging between peripherals and host interfaces or aggregation of multiple I/O streams.
- Field-Updatable Products — TransFR reconfiguration supports in-field logic updates and feature additions without external configuration storage.
Unique Advantages
- Integrated Non-Volatile Configuration: Eliminates external configuration memory and enables fast, secure startup without a bitstream stored off-chip.
- Compact, High-Density Package: 388-ball fpBGA (23 × 23 mm) delivers 268 I/Os and a small PCB footprint for space-constrained designs.
- Balanced Logic and Memory: ~15,000 logic elements combined with approximately 0.33 Mbits of embedded RAM reduce the need for external SRAM/FPGA glue logic.
- Flexible Clocking and DDR Support: Multiple PLLs and family-level DDR interface capability simplify timing control and memory interfacing.
- Energy-Aware Operation: Sleep mode provides substantial static current reduction for lower standby power in battery-assisted or energy-sensitive applications.
- Design Security and In-Field Updates: Non-volatile configuration with in-system reprogramming options supports secure, maintainable products.
Why Choose LFXP15E-5FN388C?
The LFXP15E-5FN388C combines a mid-range logic capacity with a generous complement of embedded memory and high I/O density in a compact 388-ball fpBGA package. Its non-volatile instant-on architecture and in-field reconfiguration capabilities are well suited to products that require secure startup, fast availability and the option to update logic in deployed systems. The device’s commercial temperature rating and RoHS compliance make it appropriate for a wide range of commercial electronic systems.
Engineers looking for a balanced FPGA solution—providing integrated memory, flexible I/O and system-level features such as PLLs and DDR support—will find the LFXP15E-5FN388C appropriate for applications that benefit from reduced BOM, compact packaging and secure, updatable logic.
Request a quote or submit an inquiry to get pricing and availability for the LFXP15E-5FN388C and determine how it fits into your next system design.

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