LFXP2-30E-5FN672I

The LFXP2-30E-5FN672I is an industrial-grade LatticeXP2 family FPGA combining a LUT-based programmable fabric with flash-based configuration and system-level features. It delivers a balance of logic capacity, on-chip memory, DSP resources and flexible I/O in a 672-ball BGA package for applications that require dense I/O and reconfigurable processing.

Designed for embedded systems, display and memory-interface designs, and secure field-update scenarios, the device emphasizes integration and reconfigurability while supporting industrial temperature operation and RoHS compliance.

Key Features

• Logic Capacity — Approximately 29,000 logic elements to implement mid-size FPGA designs and custom logic functions.
• On-chip Memory — Approximately 0.396 Mbits of embedded memory (396,288 bits) for buffering, FIFOs and small data structures.
• High I/O Count — 472 user I/Os available for high-density interface and board-level connectivity requirements.
• sysDSP and Multipliers — Includes sysDSP blocks (7 for the XP2-30 family) with up to 28 18×18 multipliers to accelerate multiply-accumulate and signal-processing tasks.
• flexiFLASH Architecture — Flash-based configuration with instant-on and infinite reconfigurability, including FlashBAK embedded block memory and Serial TAG memory.
• Live Update and Security — TransFR live-update technology with secure updates and 128-bit AES encryption, plus dual-boot support with external SPI.
• Clock Management — Up to four analog PLLs for clock multiply, divide and phase shifting to support complex timing domains.
• Flexible I/O Standards — sysIO buffer support for multiple standards including LVCMOS, LVTTL, SSTL, HSTL, PCI and various differential standards for high-speed interfaces.
• Memory Interface Support — Pre-engineered source-synchronous interfaces including DDR/DDR2 up to 200 MHz and multi-bit LVDS links for displays.
• Package and Mounting — 672-ball fpBGA package (product package case: 672-BBGA; supplier device package: 672-FPBGA, 27×27 mm) with surface-mount mounting.
• Operating Conditions — Industrial temperature range of -40 °C to 100 °C and supply operation across 1.14 V to 1.26 V (1.2 V class).
• Compliance — RoHS compliant.

Typical Applications

• Display and Imaging Systems — Use the 7:1 LVDS interfaces and high I/O count to drive display panels and manage high-speed video paths.
• Memory and High-Speed Interfaces — Implement DDR/DDR2 controller interfaces and source-synchronous links up to 200 MHz with integrated PLLs and flexible I/O.
• Embedded Signal Processing — Leverage sysDSP blocks and 18×18 multipliers for real-time DSP functions, filtering and motor-control algorithms.
• Secure Field-Upgradeable Systems — Enable secure, encrypted firmware updates and dual-boot configurations for in-field update workflows.
• High-Density I/O Control — Deploy in systems requiring large numbers of I/Os for sensors, buses and peripheral aggregation.

Unique Advantages

• Integrated Flash-Based Configuration: flexiFLASH architecture provides instant-on behavior and on-chip non-volatile configuration storage, simplifying system boot and update strategies.
• Secure Live Updates: TransFR technology with 128-bit AES supports secure, authenticated updates and dual-boot options to reduce deployment risk.
• DSP Acceleration: sysDSP blocks and dedicated multipliers reduce CPU load for arithmetic-heavy tasks, enabling more deterministic signal processing on-chip.
• High I/O Density in a Compact Package: 472 I/Os in a 672-ball fpBGA (27×27 mm) package enables dense connectivity without large board area.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Flexible Clocking and Interface Support: Up to four analog PLLs and broad sysIO standard support simplify timing design and interoperability with diverse peripherals.

Why Choose LFXP2-30E-5FN672I?

The LFXP2-30E-5FN672I positions itself as a versatile, flash-configured FPGA suitable for mid-range logic designs that require substantial I/O, integrated DSP capabilities and secure in-field update mechanisms. Its combination of approximately 29,000 logic elements, dedicated DSP resources and nearly 0.396 Mbits of on-chip memory supports complex embedded and interface-centric designs without excessive external components.

With industrial temperature ratings, a 672-ball fpBGA package, and flexible I/O and clocking resources, this device is well matched to engineers building robust, reconfigurable systems that must support secure updates, high-speed memory interfaces and dense peripheral connectivity.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-30E-5FN672I and to discuss how it fits your next design.