LFXP2-30E-5FTN256C

The LFXP2-30E-5FTN256C is a flash-based FPGA from Lattice Semiconductor’s LatticeXP2 family, combining a LUT-based programmable fabric with non-volatile on-chip flash. It delivers a balanced mix of logic density, embedded memory and DSP resources for commercial embedded designs requiring reconfigurability, secure updates and source-synchronous interfaces.

Targeted for commercial systems, the device offers instant-on flash architecture, on-chip RAM, dedicated DSP blocks and flexible I/O, enabling applications such as display interfaces, memory controllers and signal-processing tasks within a 256-ball ftBGA (17×17) package.

Key Features

• Core Logic — Approximately 29,000 logic elements to implement medium-density FPGA designs and custom logic functions.
• Flash-based Architecture (flexiFLASH) — Instant-on, infinitely reconfigurable single-chip flash architecture with FlashBAK embedded block memory and Serial TAG memory for design security and non-volatile configuration.
• Live Update & Security — TransFR live update technology with support for secure updates and 128-bit AES encryption and dual-boot with external SPI, enabling field update strategies.
• Embedded Memory — Approximately 396,288 bits of on-chip RAM for distributed and embedded memory requirements.
• sysDSP Blocks & Multipliers — Dedicated sysDSP resources (XP2-30 family level) with multiple blocks and 18×18 multiplier support for high-performance multiply-accumulate operations.
• Flexible I/O — Up to 201 user I/Os with support for a wide range of standards in the LatticeXP2 family (including LVDS, DDR/DDR2 source-synchronous interfaces and other signaling classes as supported by the family).
• Clocking — Multiple analog PLLs (family support) for clock multiplication, division and phase shifting to support complex timing domains.
• Power & Temperature — Operates from 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.
• Package & Mounting — 256-ball ftBGA (17×17 mm) / 256-LBGA package, surface-mountable for compact board designs.
• Compliance — RoHS compliant.

Typical Applications

• Display and video interfaces — Pre-engineered 7:1 LVDS and source-synchronous interface support in the LatticeXP2 family enables display bridging and timing-critical video transport.
• Memory interface and buffering — DDR/DDR2 source-synchronous interface capability supports memory controller and buffer implementations in commercial systems.
• Signal processing and acceleration — sysDSP blocks and multiple 18×18 multipliers support on-chip multiply-accumulate workloads for digital signal processing tasks.
• Embedded control and glue logic — Reconfigurable logic and on-chip RAM allow implementation of custom control, protocol bridging and interface glue in compact embedded designs.

Unique Advantages

• Instant-on, non-volatile configuration: Flash-based flexiFLASH architecture provides immediate startup without external configuration memory.
• Field update with security: Live Update (TransFR) and 128-bit AES encryption enable secure, in-field firmware updates and dual-boot strategies.
• Balanced compute and memory: ~29,000 logic elements combined with ~396 Kbits of on-chip RAM and dedicated DSP blocks deliver an efficient platform for mixed logic and signal processing tasks.
• Flexible, high-pin-count I/O: 201 available I/Os in a compact 256-ball ftBGA package support a wide range of external interfaces and high-density board layouts.
• Commercial-grade operating conditions: Designed for 0 °C to 85 °C operation and supplied within a 1.14 V–1.26 V power range for predictable integration into commercial systems.
• RoHS compliant: Meets current lead-free environmental requirements for commercial electronics manufacturing.

Why Choose LFXP2-30E-5FTN256C?

The LFXP2-30E-5FTN256C positions itself as a mid-density, flash-configured FPGA that combines instant-on non-volatile configuration, substantial on-chip memory and dedicated DSP resources in a compact 256-ball ftBGA package. It is well-suited for commercial embedded designs that require reconfigurability, secure field updates and a mix of interface, memory and signal-processing capability.

Engineers designing display interfaces, memory controllers, embedded signal processing blocks or custom control logic will find the device’s balance of logic density, embedded RAM and sysDSP resources useful for reducing external components while maintaining flexibility. The LatticeXP2 family ecosystem provides configuration and update options that help future-proof commercial designs.

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