LFXP2-30E-6F484C

The LFXP2-30E-6F484C is a LatticeXP2 family flash-based FPGA featuring a LUT-based fabric combined with on-chip non-volatile flash (flexiFLASH) architecture. It delivers instant-on, reconfigurable logic with integrated DSP, embedded memory and flexible I/O to address embedded systems, display and high-speed interface designs.

With 29,000 logic elements, 363 general-purpose I/Os and a 484-ball fpBGA (23 × 23 mm) package, this commercial-grade device targets applications that require moderate logic density, secure live updates and compact, surface-mount integration.

Key Features

• Core Architecture LUT-based FPGA fabric with flexiFLASH architecture for instant-on and infinitely reconfigurable single-chip operation.
• Logic Capacity Approximately 29,000 logic elements to implement mid-range FPGA functions and system glue logic.
• Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 total RAM bits) for distributed and embedded storage.
• sysDSP and Multipliers Family-level sysDSP blocks provide high-performance multiply-and-accumulate capability; the XP2-30 family includes multiple DSP blocks and 18×18 multipliers for signal-processing tasks.
• Flexible I/O 363 I/Os with support for a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS) enabling high-speed interfaces and display connectivity.
• Source-Synchronous Interfaces Pre-engineered DDR/DDR2 interfaces supporting operation up to 200 MHz and 7:1 LVDS lanes for display applications.
• System-Level Security & Update Family features include FlashBAK memory, Secure TransFR live-update technology, 128-bit AES encryption and dual-boot capabilities for secure field updates.
• Clocks & PLLs Up to four analog PLLs (sysCLOCK) per device for clock multiply/divide and phase shifting as provided by the LatticeXP2 family.
• Power & Packaging Operates from a supply range of 1.14 V to 1.26 V; supplied in a 484-ball fpBGA (23 × 23 mm) surface-mount package. RoHS compliant.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.

Typical Applications

• Display Interfaces Supports multi-lane LVDS and pre-engineered source-synchronous interfaces useful for display bridging and timing control.
• Memory Interface & Bridge DDR/DDR2 interface support up to 200 MHz enables system memory controllers and protocol bridging for embedded systems.
• Embedded Signal Processing sysDSP blocks and dedicated multipliers make the device suitable for compact signal-processing tasks and MAC-intensive algorithms.
• Compact Embedded Systems High I/O count in a 23 × 23 mm fpBGA package provides dense connectivity for space-constrained surface-mount designs.

Unique Advantages

• Instant-on, single-chip configuration: flexiFLASH architecture enables immediate start-up and on-chip non-volatile configuration without external memory.
• Secure field updates: Live Update (TransFR) and 128-bit AES encryption support secure, dual-boot update strategies to simplify in-field firmware management.
• Integrated DSP capability: Built-in sysDSP blocks and 18×18 multipliers accelerate common signal-processing workloads, reducing external components.
• Broad I/O standards support: Flexible sysIO buffer options let a single device interface with a wide range of logic and high-speed signaling standards.
• Compact, high-density package: 484-ball fpBGA (23 × 23 mm) delivers high I/O count (363 pins) in a compact footprint for PCB space savings.
• Commercial operating range with RoHS compliance: Designed for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Why Choose LFXP2-30E-6F484C?

The LFXP2-30E-6F484C combines mid-range logic density with on-chip flash configuration, DSP acceleration and a high count of flexible I/Os in a compact fpBGA package—making it well suited to embedded designers building display interfaces, memory bridges and signal-processing subsystems. Its family-level features for secure live updates and integrated PLLs provide system-level capability while keeping board-level complexity low.

Designed for teams that require scalable FPGA functionality with a robust design tool ecosystem and pre-engineered IP options, this XP2 device provides a balanced mix of performance, connectivity and reconfigurability for commercial embedded products.

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