LFXP2-30E-6F672C

The LFXP2-30E-6F672C is a LatticeXP2 family FPGA combining a flash-based configuration architecture with a mid-range logic fabric and abundant I/O. It targets embedded and interface-centric applications that require reconfigurability, on-chip memory, DSP acceleration and a high-density I/O footprint.

Built for commercial-grade systems, the device delivers approximately 29,000 logic elements, roughly 396,288 bits of on-chip RAM, and up to 472 user I/Os in a 672-ball fpBGA package, with secure update and instant-on configuration capabilities provided by the flexiFLASH architecture.

Key Features

• flexiFLASH™ non-volatile architecture – Instant-on operation with on-chip FlashBAK and Serial TAG memory for single-chip, infinitely reconfigurable designs and built-in design security.
• Live Update and secure configuration – TransFR live update technology with 128‑bit AES encryption and dual-boot support via external SPI for secure field updates and rollback capability.
• Logic fabric – Approximately 29,000 logic elements to implement mid-density logic and control functions.
• sysDSP™ and multipliers – Multiple sysDSP blocks (device-class sysDSP resources) and 18×18 multipliers to accelerate multiply-and-accumulate operations for signal processing tasks.
• Embedded and distributed memory – Approximately 396,288 bits of embedded RAM with additional distributed RAM resources to support buffering, FIFOs and on-chip data storage.
• Flexible I/O and interfaces – Up to 472 I/Os with support for a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL, RSDS) and pre-engineered source-synchronous interfaces including DDR/DDR2 and high-ratio LVDS channels.
• Clocking – Multiple on-chip PLLs for clock multiply, divide and phase shifting to support complex timing requirements.
• Package and mounting – 672-ball fpBGA (27 × 27 mm) surface-mount package for high I/O density in a compact footprint.
• Power and operating range – Nominal supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Display and video interfaces – Leverage high-ratio LVDS and pre-engineered source-synchronous interfaces for display link aggregation and panel driving.
• Memory interface bridging – Implement DDR/DDR2 interfaces and protocol bridging with on-chip memory and flexible I/O to connect processors and memory subsystems.
• Embedded signal processing – Use sysDSP blocks and on-chip multipliers for medium-complexity DSP tasks such as filtering, data aggregation and sensor preprocessing.
• Secure field-upgrade systems – Enable in-field firmware and FPGA image updates with AES-encrypted Live Update and dual-boot support for robust maintenance workflows.

Unique Advantages

• Instant-on, single-chip configuration – Flash-based flexiFLASH eliminates external configuration memory and enables immediate startup without external boot sources.
• High I/O density in a compact package – 472 I/Os in a 672-ball fpBGA provide broad system connectivity while minimizing PCB area.
• Integrated DSP resources – On-chip sysDSP blocks and dedicated multipliers reduce the need for external accelerators for many signal-processing functions.
• Secure, field-ready update path – TransFR and 128‑bit AES encryption support secure firmware and FPGA image updates in deployed systems.
• Flexible I/O standards – Broad I/O standard support simplifies system design by reducing external level-shifting and interface components.
• Commercial-grade, RoHS compliant – Designed for commercial applications with RoHS compliance and an operating range suited to typical embedded environments.

Why Choose LFXP2-30E-6F672C?

LFXP2-30E-6F672C positions itself as a mid-density, highly connected FPGA solution for embedded systems that require secure configuration management, on-chip DSP acceleration and extensive I/O. Its flash-based flexiFLASH architecture and Live Update capabilities make it suitable for products that need secure, field-updateable logic with immediate startup.

Engineers building interface-rich devices, display controllers, memory bridge solutions or moderate signal-processing applications will find the combination of approximately 29,000 logic elements, roughly 396,288 bits of embedded memory, sysDSP resources and 472 I/Os in a compact fpBGA package to be a practical balance of integration and performance. The device is supported by the LatticeXP2 family ecosystem and design flow for migration and IP reuse across projects.

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