LFXP2-30E-6FN484I

The LFXP2-30E-6FN484I is a field-programmable gate array (FPGA) in a 484-ball BGA package, offering approximately 29,000 logic elements and 363 general-purpose I/Os. It combines LUT-based FPGA fabric with on-chip non-volatile flash architecture and embedded memory to address mid-density, industrial-grade applications that require instant-on reconfigurability and secure update capability.

Designed for embedded and system-level functions, the device targets applications that need flexible logic, DSP acceleration, and a broad I/O interface set while operating across an industrial temperature range and a tight core supply window.

Key Features

• FPGA Fabric and Density — Approximately 29,000 logic elements provide mid-range programmable logic resources suitable for complex control, glue-logic and datapath implementations.
• On-chip Memory — Total on-chip RAM of 396,288 bits (approximately 0.396 Mbits) for embedded and distributed memory requirements.
• sysDSP and Multipliers — Family sysDSP blocks and dedicated multipliers are supported (family-level sysDSP and multiplier resources apply to the XP2-30 series) for high-performance multiply-accumulate operations.
• I/O Flexibility — Up to 363 I/Os available in the 484-ball fpBGA package to support wide parallel interfaces and multi-protocol signaling.
• Non-volatile Configuration — flexiFLASH architecture in the XP2 family provides instant-on and infinitely reconfigurable single-chip flash-based configuration and secure update mechanisms.
• Clocking and PLLs — Multiple PLLs per device (family-level support) enable clock multiplication, division and phase shifting for system timing management.
• Industrial Grade Operation — Specified operating temperature range of −40°C to 100°C for deployment in industrial environments.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match tight system power requirements.
• Package — 484-ball fpBGA package (484-FPBGA, 23 × 23 mm) for compact board-level integration with high I/O count.
• Standards and Design Support — Family-level support for IEEE 1149.1 and IEEE 1532 and system-level features such as on-chip oscillator and dual-boot capability (as defined by the XP2 family).

Typical Applications

• Industrial Control — Implement real-time control logic, motor-control interfaces and sensor aggregation with industrial temperature capability and extensive I/O.
• Prototyping and System Glue — Bridge processors, peripherals and custom logic blocks where mid-range logic density and flexible I/O are required.
• Signal Processing Acceleration — Use family sysDSP resources and embedded multipliers for filtering, aggregation and local DSP tasks within embedded systems.
• Secure Field Update Systems — Leverage the family’s flash-based configuration and secure update technologies for devices requiring remote or field reconfiguration.

Unique Advantages

• Integrated Non-Volatile Configuration: Flash-based flexiFLASH architecture enables instant-on operation and reconfigurability without external configuration memory.
• Mid-range Compute and DSP: Around 29k logic elements and family sysDSP/multiplier resources reduce the need for external DSP chips for many embedded signal-processing tasks.
• High I/O Count in Compact Package: 363 I/Os in a 23 × 23 mm fpBGA footprint provide significant interface density while conserving PCB area.
• Industrial Temperature Range: Specified −40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
• Secure and Flexible System Updates: Family-level secure update features and dual-boot support simplify in-field firmware and configuration management.

Why Choose LFXP2-30E-6FN484I?

The LFXP2-30E-6FN484I provides a balanced combination of programmable logic capacity, on-chip memory and high I/O count in an industrial-grade fpBGA package. Its flash-based configuration and family-level system features deliver reconfigurability and secure update paths while the device’s power and temperature specifications align with demanding embedded and industrial designs.

This device is well suited for engineers building mid-density FPGA solutions that require DSP acceleration, robust I/O, compact packaging and on-chip non-volatile configuration. The XP2 family ecosystem and device-level features support long-term scalability and system-level reliability.

Request a quote or submit a pricing inquiry to check availability and integrate the LFXP2-30E-6FN484I into your next design.