LFXP2-30E-6FN484C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA |
|---|---|
| Quantity | 43 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-6FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA
The LFXP2-30E-6FN484C is a commercial-grade FPGA featuring Lattice's XP2 family architecture with non-volatile flash-based configuration. It combines flexible, flash-backed FPGA fabric with on-chip memory and advanced I/O to address system-level applications requiring reconfigurability, secure updates and rich interface support.
Typical use cases include communications and display interfaces, embedded system control and applications that benefit from in-field reconfiguration and secure device updates. The device delivers a balance of logic capacity, embedded memory and high pin-count I/O in a compact 484-ball fpBGA package.
Key Features
- flexiFLASH Architecture Flash-backed FPGA fabric providing instant-on, single-chip configuration and embedded FlashBAK memory for non-volatile storage.
- Live Update and Security Supports TransFR live update technology and secure updates with 128-bit AES encryption and dual-boot capability.
- Logic Capacity Approximately 29,000 logic elements for mid-density FPGA designs.
- Embedded Memory Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for embedded and distributed memory needs.
- sysDSP and Multipliers XP2 family sysDSP blocks and dedicated multipliers provide hardware support for multiply-accumulate operations and signal processing (family-level sysDSP/multiplier support as specified in the XP2 series).
- Flexible I/O High I/O count with 363 available pins in the 484-ball fpBGA package and support for a wide range of I/O standards as defined by the XP2 family.
- Power and Temperature Operates from a core voltage supply range of 1.14 V to 1.26 V and specified for commercial operating temperatures from 0 °C to 85 °C.
- Package and Mounting 484-ball fpBGA (23 × 23 mm) supplier package, surface-mount mounting for compact board integration.
- RoHS Compliant Manufactured to meet RoHS requirements.
Typical Applications
- Communications Equipment Implements protocol bridging, custom packet processing and interface glue logic where reconfigurable logic and secure updates are required.
- Display and Imaging Systems Supports source-synchronous and high-speed serial interfaces common in display pipelines and image processing front-ends.
- Embedded System Control Delivers mid-range logic capacity and embedded memory for commercial embedded control, interface bridging and system integration tasks.
- Secure Field-Upgradeable Designs Enables in-field firmware upgrades with AES-secured updates and dual-boot image support for maintenance and feature deployment.
Unique Advantages
- Highly integrated mid-density FPGA: Combines roughly 29,000 logic elements with on-chip RAM (396,288 bits) to reduce external memory and logic components.
- Secure, field-upgradable platform: Built-in Live Update and 128-bit AES encryption let designers deploy secure firmware updates without replacing hardware.
- Rich I/O in a compact package: 363 I/Os in a 484-ball fpBGA (23×23 mm) package provides broad external connectivity while keeping PCB footprint small.
- Low-voltage core: Operates at a 1.14 V–1.26 V core supply, enabling compatibility with low-voltage power domains.
- System-level support: Family-level features such as PLLs, pre-engineered source-synchronous interfaces and sysDSP blocks simplify implementation of timing-critical and signal-processing functions.
- Commercial temperature rating: Specified operation from 0 °C to 85 °C for a wide range of commercial electronic products.
Why Choose LFXP2-30E-6FN484C?
The LFXP2-30E-6FN484C positions itself as a flexible, flash-backed FPGA solution for commercial applications that need moderate logic density, embedded memory and substantial I/O in a compact surface-mount package. Its combination of on-chip non-volatile configuration, secure update capabilities and family-level DSP and interface features make it suitable for designs that require in-field reconfiguration and system-level integration.
Designers seeking scalable FPGA resources backed by a defined feature set—logic, memory, DSP capability and a high I/O count—will find this part well suited to communication interfaces, display subsystems and commercial embedded control applications where secure updates and compact board-level integration are priorities.
Request a quote or submit an inquiry to discuss pricing, availability and how the LFXP2-30E-6FN484C can fit into your next design.