LFXP2-30E-6FN484C

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

Quantity 43 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-6FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

The LFXP2-30E-6FN484C is a commercial-grade FPGA featuring Lattice's XP2 family architecture with non-volatile flash-based configuration. It combines flexible, flash-backed FPGA fabric with on-chip memory and advanced I/O to address system-level applications requiring reconfigurability, secure updates and rich interface support.

Typical use cases include communications and display interfaces, embedded system control and applications that benefit from in-field reconfiguration and secure device updates. The device delivers a balance of logic capacity, embedded memory and high pin-count I/O in a compact 484-ball fpBGA package.

Key Features

  • flexiFLASH Architecture  Flash-backed FPGA fabric providing instant-on, single-chip configuration and embedded FlashBAK memory for non-volatile storage.
  • Live Update and Security  Supports TransFR live update technology and secure updates with 128-bit AES encryption and dual-boot capability.
  • Logic Capacity  Approximately 29,000 logic elements for mid-density FPGA designs.
  • Embedded Memory  Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for embedded and distributed memory needs.
  • sysDSP and Multipliers  XP2 family sysDSP blocks and dedicated multipliers provide hardware support for multiply-accumulate operations and signal processing (family-level sysDSP/multiplier support as specified in the XP2 series).
  • Flexible I/O  High I/O count with 363 available pins in the 484-ball fpBGA package and support for a wide range of I/O standards as defined by the XP2 family.
  • Power and Temperature  Operates from a core voltage supply range of 1.14 V to 1.26 V and specified for commercial operating temperatures from 0 °C to 85 °C.
  • Package and Mounting  484-ball fpBGA (23 × 23 mm) supplier package, surface-mount mounting for compact board integration.
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • Communications Equipment  Implements protocol bridging, custom packet processing and interface glue logic where reconfigurable logic and secure updates are required.
  • Display and Imaging Systems  Supports source-synchronous and high-speed serial interfaces common in display pipelines and image processing front-ends.
  • Embedded System Control  Delivers mid-range logic capacity and embedded memory for commercial embedded control, interface bridging and system integration tasks.
  • Secure Field-Upgradeable Designs  Enables in-field firmware upgrades with AES-secured updates and dual-boot image support for maintenance and feature deployment.

Unique Advantages

  • Highly integrated mid-density FPGA: Combines roughly 29,000 logic elements with on-chip RAM (396,288 bits) to reduce external memory and logic components.
  • Secure, field-upgradable platform: Built-in Live Update and 128-bit AES encryption let designers deploy secure firmware updates without replacing hardware.
  • Rich I/O in a compact package: 363 I/Os in a 484-ball fpBGA (23×23 mm) package provides broad external connectivity while keeping PCB footprint small.
  • Low-voltage core: Operates at a 1.14 V–1.26 V core supply, enabling compatibility with low-voltage power domains.
  • System-level support: Family-level features such as PLLs, pre-engineered source-synchronous interfaces and sysDSP blocks simplify implementation of timing-critical and signal-processing functions.
  • Commercial temperature rating: Specified operation from 0 °C to 85 °C for a wide range of commercial electronic products.

Why Choose LFXP2-30E-6FN484C?

The LFXP2-30E-6FN484C positions itself as a flexible, flash-backed FPGA solution for commercial applications that need moderate logic density, embedded memory and substantial I/O in a compact surface-mount package. Its combination of on-chip non-volatile configuration, secure update capabilities and family-level DSP and interface features make it suitable for designs that require in-field reconfiguration and system-level integration.

Designers seeking scalable FPGA resources backed by a defined feature set—logic, memory, DSP capability and a high I/O count—will find this part well suited to communication interfaces, display subsystems and commercial embedded control applications where secure updates and compact board-level integration are priorities.

Request a quote or submit an inquiry to discuss pricing, availability and how the LFXP2-30E-6FN484C can fit into your next design.

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