LFXP2-30E-6FTN256I

The LFXP2-30E-6FTN256I is an XP2-series FPGA combining a LUT-based FPGA fabric with on-chip flash configuration in Lattice’s flexiFLASH architecture. This device targets industrial-grade embedded systems that require instant-on reconfigurability, embedded memory, and a high I/O count in a compact 256-ball ftBGA package.

With 29,000 logic elements, approximately 0.4 Mbits of embedded memory (396,288 bits), and 201 available I/Os, the device is suited for designs that need dense logic, DSP acceleration and secure field updates while operating across an industrial temperature range.

Key Features

• flexiFLASH Architecture  Instant-on, infinitely reconfigurable flash-based configuration with FlashBAK and Serial TAG memory for on-chip non-volatile storage and design security.
• Live Update and Security  Support for Live Update technology including TransFR and optional 128-bit AES encryption for secure updates and dual-boot capability.
• Logic Capacity  Approximately 29,000 logic elements to implement medium-density FPGA designs.
• Embedded Memory  Approximately 0.4 Mbits (396,288 bits) of on-chip RAM for local data buffering and state storage.
• sysDSP and Multipliers  sysDSP blocks optimized for multiply-and-accumulate operations; XP2-30 devices include 7 sysDSP blocks and 28 18×18 multipliers for high-performance signal processing.
• Flexible I/O and Interfaces  Up to 201 I/Os with broad buffer support and pre-engineered source-synchronous interfaces including DDR/DDR2 up to 200 MHz and multi-lane LVDS options suitable for display and high-speed links.
• Clocking  Multiple analog PLLs (up to four) for clock multiply, divide and phase shifting to support complex clocking schemes.
• Package and Mounting  256-ball ftBGA package (supplier package: 256-FTBGA, 17×17 mm) designed for surface-mount assembly in space-constrained boards.
• Electrical and Environmental  Core supply range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C. RoHS-compliant.

Typical Applications

• Industrial Control  Industrial embedded systems that require industrial temperature operation and flexible I/O for sensor interfacing and real-time control tasks.
• Signal Processing and DSP  High-performance multiply-accumulate workloads that leverage the sysDSP blocks and 28 18×18 multipliers for filtering, transforms and real-time processing.
• Display and Imaging  Multi-lane LVDS and source-synchronous interfaces support display and imaging pipelines, including 7:1 LVDS display links.
• Embedded Memory-Intensive Designs  On-chip RAM and up to 201 I/Os enable local buffering, interface bridging and mid-density embedded system logic.
• Secure Field-Update Systems  Designs requiring secure, in-field firmware updates and dual-boot capability can use the Live Update and AES encryption features.

Unique Advantages

• Instant-on, Reconfigurable Flash:  flexiFLASH delivers non-volatile configuration with instant-on behavior and infinite reconfigurability to simplify deployment and updates.
• Secure Update Path:  TransFR live update technology with 128-bit AES enables secure remote updates and dual-boot strategies to reduce update risk.
• Balanced DSP and Logic Resources:  7 sysDSP blocks and 28 18×18 multipliers combined with 29,000 logic elements provide a balanced platform for processing-heavy embedded designs.
• Compact, High-I/O Package:  256-ball ftBGA (17×17 mm) delivers 201 I/Os in a compact form factor for space-constrained boards.
• Industrial Robustness:  Rated for −40 °C to 100 °C operation and RoHS-compliant, suitable for industrial environments.
• Flexible Clocking and Interfaces:  Multiple PLLs and a wide set of supported I/O standards simplify integration with memory interfaces and high-speed serial links.

Why Choose LFXP2-30E-6FTN256I?

The LFXP2-30E-6FTN256I positions itself as a mid-density, flash-configured FPGA optimized for embedded and industrial applications that need fast startup, field reconfigurability, and DSP acceleration. Its combination of approximately 29,000 logic elements, sysDSP resources, and roughly 0.4 Mbits of embedded memory enables a wide range of processing and interface functions within a compact 256-ball ftBGA footprint.

This device is appropriate for customers designing industrial-grade systems that require secure live updates, a high I/O count, and balanced logic and DSP capability. Long-term value comes from on-chip non-volatile configuration, field update features, and vendor-supported family tools and IP for efficient design integration.

Request a quote or submit a pricing and availability inquiry for LFXP2-30E-6FTN256I to begin evaluating this device for your next embedded design.