LFXP2-30E-7FN672C

The LFXP2-30E-7FN672C is a commercial-grade FPGA from Lattice Semiconductor combining a LUT-based FPGA fabric with on-chip non-volatile flash in a flexiFLASH architecture. It delivers instant-on reconfigurability, integrated memory and DSP resources, and a high I/O count in a compact 672-ball fpBGA (27 × 27 mm) package.

Designed for applications that require dense I/O, embedded memory and secure live updates, this device is suitable for systems-level functions such as interface bridging, display and memory interfaces, and mid-range embedded processing where a commercial-grade temperature range and 1.14–1.26 V core supply are acceptable.

Key Features

• flexiFLASH architecture — Instant-on, infinitely reconfigurable single-chip architecture with on-chip flash and flash-backed block memory for persistent configuration and design security.
• Live Update and Security — Support for secure updates with 128-bit AES encryption and dual-boot capability for robust firmware management.
• Logic Capacity — Approximately 29,000 logic elements to implement medium-complexity FPGA functions.
• Embedded Memory — Approximately 0.396 Mbits of on-chip RAM for embedded storage and buffering needs.
• sysDSP blocks and multipliers — Integrated DSP resources including multiple 18×18 multiplier options for multiply-accumulate operations.
• I/O and Interface Support — Up to 472 I/Os with flexible sysIO buffer support for a wide range of standards, plus pre-engineered interfaces such as DDR/DDR2 (up to 200 MHz) and multi-lane LVDS for display and high-speed links.
• Clocking — Multiple analog PLLs for clock multiply/divide and phase shifting to support complex timing requirements.
• Package and Mounting — 672-BBGA (672-FPBGA, 27 × 27 mm) surface-mount package providing high I/O density in a compact footprint.
• Commercial Temperature and Power — Rated for 0 °C to 85 °C operation with a core supply range of 1.14 V to 1.26 V.
• Standards and System Support — Flash-based configuration options including SPI boot flash interface and soft error detect macros for system reliability.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Display interfaces and imaging — Multi-lane LVDS support and source-synchronous interface options enable display bridging and panel interface functions.
• Memory controllers and buffering — Pre-engineered DDR/DDR2 interface support and integrated RAM simplify implementation of memory-interfacing logic.
• Embedded signal processing — sysDSP blocks and hardware multipliers provide efficient multiply-accumulate capability for mid-range DSP tasks.
• High-density I/O bridging — Up to 472 I/Os in a 672-ball fpBGA package suit applications needing many external interfaces in a compact area.

Unique Advantages

• Flash-based instant-on operation: On-chip flash configuration enables immediate startup without external configuration memory.
• Secure live updates: Built-in support for encrypted firmware updates and dual-boot reduces field update risk and simplifies maintenance.
• Balanced logic and memory: Around 29,000 logic elements paired with approximately 0.396 Mbits of embedded RAM offers a balanced resource set for control, interface and mid-level processing tasks.
• High I/O density in a compact package: 472 I/Os in a 27 × 27 mm 672-ball fpBGA supports dense board designs while minimizing PCB area.
• Flexible I/O standards: sysIO buffer support for a broad set of signaling standards enables interoperability with diverse peripherals and subsystems.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.

Why Choose LFXP2-30E-7FN672C?

The LFXP2-30E-7FN672C positions itself as a mid-density, flash-configured FPGA delivering instant-on reconfigurability, secure update capability and a well-rounded mix of logic, memory and DSP resources. Its high I/O count and compact 672-ball fpBGA package make it a practical choice for designs that need many external interfaces without expanding PCB area.

This device is well suited to development teams and product designs that require persistent on-chip configuration, flexible interface options and the ability to update field firmware securely, all within a commercial temperature window and a 1.14–1.26 V core supply envelope.

Request a quote or submit a procurement inquiry to get pricing and availability for the LFXP2-30E-7FN672C. Our team can provide lead-time information and support for your design requirements.