LFXP2-40E-5F484I

The LFXP2-40E-5F484I is an XP2-family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a LUT-based FPGA fabric with non-volatile flash in a flexiFLASH architecture to deliver instant-on, reconfigurable logic for embedded systems and signal-processing applications.

This device targets designs that require high logic density, a large I/O count, integrated DSP resources and secure update capabilities. Its 484-ball fpBGA package with 363 I/Os, industrial temperature range and low-voltage supply make it suitable for demanding embedded and industrial applications.

Key Features

• Core Architecture — flexiFLASH Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK embedded block memory and Serial TAG memory for on-chip non-volatile storage and design security.
• Live Update & Security TransFR live update technology with secure updates using 128-bit AES encryption and support for dual-boot with external SPI.
• Logic Density Approximately 40,000 logic elements (LUT-based fabric) for mid-to-high-density logic integration.
• Embedded Memory Approximately 0.91 Mbits of total on-chip RAM (906,240 bits) plus family-level distributed RAM support for memory-intensive functions.
• sysDSP & Multipliers sysDSP block support with the XP2-40 family offering eight sysDSP blocks and up to 32 18×18 multipliers for high-performance multiply–accumulate workloads.
• Flexible I/O & Interfaces sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS; pre-engineered source-synchronous interfaces include DDR/DDR2 support and multi-lane LVDS for displays.
• Clock Management Up to four analog PLLs per device for clock multiply, divide and phase shifting.
• Power and Packaging Surface-mount 484-BBGA (supplier package: 484-FPBGA, 23×23 mm) with operating VCC range of 1.14 V to 1.26 V and RoHS compliance.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.

Typical Applications

• High-performance signal processing — Use sysDSP blocks and 18×18 multipliers for DSP tasks such as filtering, FFTs and other multiply–accumulate workloads.
• Memory interface controllers — Implement DDR/DDR2 interfaces with the device’s pre-engineered source-synchronous support for memory controllers and buffering logic.
• Display and video interfaces — Multi-lane LVDS and 7:1 LVDS interface support enables display bridge and video-processing implementations.
• Secure remote updates — TransFR live update technology with 128-bit AES supports secure firmware or bitstream updates and dual-boot strategies.

Unique Advantages

• Integrated non-volatile FPGA fabric: flexiFLASH provides instant-on operation and on-chip flash storage, reducing external memory dependencies.
• DSP-capable architecture: Multiple sysDSP blocks and numerous 18×18 multipliers enable efficient hardware acceleration of compute-intensive functions.
• Broad I/O standard support: Flexible sysIO buffers accommodate a wide range of interface standards, simplifying board-level integration.
• High I/O density in a compact package: 363 available I/Os in a 484-ball fpBGA (23×23 mm) package allow dense connectivity for complex systems.
• Industrial temperature and low-voltage operation: −40 °C to 100 °C rating and 1.14–1.26 V supply provide suitability for industrial embedded applications with low-voltage power domains.
• Secure update and system resilience: Built-in TransFR and AES encryption support controlled, secure field updates and dual-boot configurations.

Why Choose LFXP2-40E-5F484I?

The LFXP2-40E-5F484I delivers a balanced combination of logic density, embedded memory and DSP resources within a flexiFLASH architecture that supports secure, instant-on operation. With flexible I/O standards, multiple PLLs and a high I/O count in a compact fpBGA package, it is well suited to embedded systems, industrial controllers, display and memory-interface designs that require reconfigurable logic and secure update capability.

Engineers can leverage the XP2 family capabilities for scalable designs that need mid-range FPGA resources, integrated non-volatile storage and robust I/O flexibility, while maintaining operation across industrial temperature ranges.

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