LFXP2-40E-5FN484I

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA

Quantity 12 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-5FN484I – XP2 FPGA, 40k logic elements, 363 I/O, 484-BBGA

The LFXP2-40E-5FN484I is a LatticeXP2 family field programmable gate array (FPGA) in a 484-ball fpBGA package, targeted at industrial applications. It combines a flash-based flexiFLASH architecture with a LUT-based FPGA fabric to deliver instant-on reconfigurability, on-chip non-volatile configuration and embedded DSP and memory resources for signal processing, interface bridging and system control.

This device is well suited to designs that require a high I/O count, significant on-chip memory and DSP resources while operating over an industrial temperature range with a 1.14 V to 1.26 V supply range.

Key Features

  • Logic Capacity  Approximately 40,000 logic elements for implementing complex FPGA logic and control functions.
  • Embedded Memory  Total on-chip memory of 906,240 bits (approximately 0.91 Mbits) to support buffers, state machines and embedded data storage.
  • sysDSP and Multipliers  Built-in sysDSP blocks and dedicated multipliers for high-performance multiply-accumulate operations; XP2-40 devices include multiple sysDSP blocks and 18×18 multiplier resources as part of the LatticeXP2 family architecture.
  • Flexible I/O  Up to 363 user I/Os on the 484-ball fpBGA (23 × 23 mm) package, supporting a wide range of standards for interface connectivity.
  • flexiFLASH Configuration  Flash-based configuration with instant-on behavior, on-chip FlashBAK memory and Serial TAG memory for secure, reconfigurable single-chip solutions.
  • Live Update and Security  Live Update technology with TransFR and support for secure updates (128-bit AES encryption) and dual-boot image capability as described for the LatticeXP2 family.
  • Clocking  Multiple analog PLLs (sysCLOCK) to enable clock multiplication, division and phase shifting for system timing flexibility.
  • High-speed Interface Support  Pre-engineered interfaces include DDR/DDR2 memory interfaces up to 200 MHz, 7:1 LVDS display interfaces and XGMII for high-speed communications as provided by the family architecture.
  • Package and Mounting  484-FPBGA (23 × 23 mm) surface-mount package for dense board integration and up to 363 available I/Os.
  • Industrial Temperature Range  Rated for operation from -40°C to 100°C for use in industrial environments.

Typical Applications

  • Industrial Control and Automation  Use the device for real-time control, protocol bridging and I/O aggregation where industrial temperature operation and robust I/O counts are required.
  • Embedded Signal Processing  Leverage sysDSP blocks and dedicated multipliers for filtering, sensor fusion and other multiply-accumulate tasks inside compact FPGA-based processing subsystems.
  • Memory and Interface Controllers  Implement DDR/DDR2 memory controllers, bus bridges and high-speed interface logic using the device’s on-chip memory and pre-engineered interface support.
  • Display and Video Interfaces  Drive LVDS-based display interfaces and other source-synchronous links using the LatticeXP2 family’s pre-engineered 7:1 LVDS support and flexible I/O buffers.
  • High-speed Communications  Support packet processing and protocol termination using XGMII-capable interfaces and abundant I/O resources for board-level connectivity.

Unique Advantages

  • Flash-based Instant-On:  flexiFLASH configuration enables immediate startup without external configuration memory, simplifying system boot sequences.
  • Integrated DSP Resources:  sysDSP blocks and dedicated multipliers reduce the need for external DSP chips for common signal processing tasks.
  • High I/O Density in a Compact Package:  363 I/Os in a 484-ball fpBGA (23 × 23 mm) provide extensive external connectivity while minimizing PCB area.
  • Secure Field Updates:  Live Update features with secure update options (128-bit AES) and dual-boot support help manage remote firmware revisions and rollback strategies.
  • Industrial Reliability:  Rated operation from -40°C to 100°C supports deployment in demanding industrial environments.
  • Design Ecosystem:  Part of the LatticeXP2 family with available design tools and IP enabling migration and reuse across device densities.

Why Choose LFXP2-40E-5FN484I?

The LFXP2-40E-5FN484I positions itself as a highly integrated FPGA solution for industrial and communications-focused designs that require substantial logic capacity, on-chip memory and DSP functionality alongside a large number of I/Os. Its flash-based configuration, secure update capabilities and family-level design support make it suitable for systems where instant-on and reconfigurability are important.

This device is ideal for engineers building embedded signal processing blocks, interface controllers or high-density I/O subsystems who need a combination of performance, compact packaging and industrial temperature operation, together with the LatticeXP2 family’s design tools and IP resources for scalable development.

Request a quote or submit a purchase inquiry to get pricing, availability and technical assistance for LFXP2-40E-5FN484I.

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