LFXP2-40E-5FN484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA |
|---|---|
| Quantity | 12 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-5FN484I – XP2 FPGA, 40k logic elements, 363 I/O, 484-BBGA
The LFXP2-40E-5FN484I is a LatticeXP2 family field programmable gate array (FPGA) in a 484-ball fpBGA package, targeted at industrial applications. It combines a flash-based flexiFLASH architecture with a LUT-based FPGA fabric to deliver instant-on reconfigurability, on-chip non-volatile configuration and embedded DSP and memory resources for signal processing, interface bridging and system control.
This device is well suited to designs that require a high I/O count, significant on-chip memory and DSP resources while operating over an industrial temperature range with a 1.14 V to 1.26 V supply range.
Key Features
- Logic Capacity Approximately 40,000 logic elements for implementing complex FPGA logic and control functions.
- Embedded Memory Total on-chip memory of 906,240 bits (approximately 0.91 Mbits) to support buffers, state machines and embedded data storage.
- sysDSP and Multipliers Built-in sysDSP blocks and dedicated multipliers for high-performance multiply-accumulate operations; XP2-40 devices include multiple sysDSP blocks and 18×18 multiplier resources as part of the LatticeXP2 family architecture.
- Flexible I/O Up to 363 user I/Os on the 484-ball fpBGA (23 × 23 mm) package, supporting a wide range of standards for interface connectivity.
- flexiFLASH Configuration Flash-based configuration with instant-on behavior, on-chip FlashBAK memory and Serial TAG memory for secure, reconfigurable single-chip solutions.
- Live Update and Security Live Update technology with TransFR and support for secure updates (128-bit AES encryption) and dual-boot image capability as described for the LatticeXP2 family.
- Clocking Multiple analog PLLs (sysCLOCK) to enable clock multiplication, division and phase shifting for system timing flexibility.
- High-speed Interface Support Pre-engineered interfaces include DDR/DDR2 memory interfaces up to 200 MHz, 7:1 LVDS display interfaces and XGMII for high-speed communications as provided by the family architecture.
- Package and Mounting 484-FPBGA (23 × 23 mm) surface-mount package for dense board integration and up to 363 available I/Os.
- Industrial Temperature Range Rated for operation from -40°C to 100°C for use in industrial environments.
Typical Applications
- Industrial Control and Automation Use the device for real-time control, protocol bridging and I/O aggregation where industrial temperature operation and robust I/O counts are required.
- Embedded Signal Processing Leverage sysDSP blocks and dedicated multipliers for filtering, sensor fusion and other multiply-accumulate tasks inside compact FPGA-based processing subsystems.
- Memory and Interface Controllers Implement DDR/DDR2 memory controllers, bus bridges and high-speed interface logic using the device’s on-chip memory and pre-engineered interface support.
- Display and Video Interfaces Drive LVDS-based display interfaces and other source-synchronous links using the LatticeXP2 family’s pre-engineered 7:1 LVDS support and flexible I/O buffers.
- High-speed Communications Support packet processing and protocol termination using XGMII-capable interfaces and abundant I/O resources for board-level connectivity.
Unique Advantages
- Flash-based Instant-On: flexiFLASH configuration enables immediate startup without external configuration memory, simplifying system boot sequences.
- Integrated DSP Resources: sysDSP blocks and dedicated multipliers reduce the need for external DSP chips for common signal processing tasks.
- High I/O Density in a Compact Package: 363 I/Os in a 484-ball fpBGA (23 × 23 mm) provide extensive external connectivity while minimizing PCB area.
- Secure Field Updates: Live Update features with secure update options (128-bit AES) and dual-boot support help manage remote firmware revisions and rollback strategies.
- Industrial Reliability: Rated operation from -40°C to 100°C supports deployment in demanding industrial environments.
- Design Ecosystem: Part of the LatticeXP2 family with available design tools and IP enabling migration and reuse across device densities.
Why Choose LFXP2-40E-5FN484I?
The LFXP2-40E-5FN484I positions itself as a highly integrated FPGA solution for industrial and communications-focused designs that require substantial logic capacity, on-chip memory and DSP functionality alongside a large number of I/Os. Its flash-based configuration, secure update capabilities and family-level design support make it suitable for systems where instant-on and reconfigurability are important.
This device is ideal for engineers building embedded signal processing blocks, interface controllers or high-density I/O subsystems who need a combination of performance, compact packaging and industrial temperature operation, together with the LatticeXP2 family’s design tools and IP resources for scalable development.
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