LFXP2-40E-5FN484C

The LFXP2-40E-5FN484C is a LatticeXP2 family FPGA in a 484-ball fpBGA package (23 × 23 mm) featuring a flexiFLASH architecture. It combines a LUT-based FPGA fabric with embedded flash and dedicated sysDSP blocks for high-performance signal processing, and is aimed at commercial applications that require dense logic, significant on-chip memory and a high I/O count.

This device offers instant-on, reconfigurable operation and hardware resources suited to video/display interfaces, memory interface controllers and compute-accelerated logic blocks where up to 40,000 logic elements, extensive embedded memory and 363 I/Os are required.

Key Features

• Logic Fabric — Approximately 40,000 logic elements (LUT-based FPGA fabric) providing substantial capacity for complex logic and control functions.
• Embedded Memory — 906,240 bits of total on-chip RAM (approximately 0.9 Mbits) combining embedded block RAM and distributed RAM for buffers, FIFOs and on-chip data storage.
• sysDSP Blocks and Multipliers — Eight sysDSP blocks with support for up to thirty-two 18×18 multipliers, enabling high-performance multiply-accumulate operations for DSP tasks.
• I/O and Packaging — 363 user I/Os in a 484-ball fpBGA (484-FPBGA, 23×23 mm) surface-mount package, supporting dense board-level connectivity.
• Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
• flexiFLASH Configuration — Instant-on, single-chip flash-based configuration with FlashBAK memory and Serial TAG memory for design security and persistent configuration.
• Live Update and Security — TransFR live update technology with support for secure updates (128-bit AES encryption) and dual-boot capability.
• Interfaces — Pre-engineered source-synchronous interfaces including DDR/DDR2 support (up to 200 MHz) and multi-channel LVDS options suitable for display and high-speed data links.
• Power and Temperature — Operates with a core supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant and provided in a surface-mount fpBGA package for production PCB assembly.

Typical Applications

• Video and Display Interfaces — High-speed LVDS and 7:1 LVDS pre-engineered interfaces make the device suitable for display timing, serialization and receive/drive applications.
• Memory Interface Controllers — DDR/DDR2 interface support (up to 200 MHz) enables use as memory controllers, buffering and protocol bridging in systems that require on-chip logic and SRAM management.
• Signal Processing and DSP Acceleration — sysDSP blocks and 18×18 multipliers provide hardware acceleration for filtering, transforms and other multiply-accumulate workloads.
• I/O-Intensive Control — The high I/O count (363 I/Os) and flexible sysIO buffer support make the device suitable for systems requiring many peripheral connections and mixed signaling.

Unique Advantages

• Instant-on, Single-Chip Flash Architecture: flexiFLASH provides immediate availability after power-up and on-chip nonvolatile configuration storage, reducing external component count.
• Secure Field Updates: TransFR live update capability with 128-bit AES encryption enables secure firmware updates and dual-boot configurations for robust maintenance.
• High DSP Throughput: Multiple sysDSP blocks and a large number of dedicated multipliers deliver deterministic hardware acceleration for compute-heavy functions.
• High Integration Density: 40,000 logic elements and approximately 0.9 Mbits of embedded memory reduce the need for external logic and buffering, simplifying BOM and board layout.
• Flexible Clocking and I/O: Up to four PLLs and broad I/O support, including source-synchronous interfaces, simplify timing closure for multi-domain systems.
• Production-Ready Packaging: 484-ball fpBGA (23 × 23 mm) surface-mount package supports high-density board designs while maintaining a high count of accessible I/Os.

Why Choose LFXP2-40E-5FN484C?

The LFXP2-40E-5FN484C combines a large LUT-based FPGA fabric with flash-based configuration, dedicated DSP resources and substantial on-chip memory to address designs that need dense logic, high I/O count and secure update capability. Its voltage range and commercial temperature rating suit a wide range of commercial embedded applications.

Supported by the LatticeXP2 family feature set and the available design ecosystem, this part is well suited for engineers building display interfaces, memory controllers, signal processing accelerators and other I/O- or compute-intensive systems where integration, secure updates and on-chip memory are required.

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