LFXP2-40E-6F484C

The LFXP2-40E-6F484C is an XP2 family Field Programmable Gate Array (FPGA) IC designed for applications that require a balance of programmable logic, embedded memory and high I/O density. It integrates 40,000 logic elements and approximately 0.906 Mbits of embedded memory with 363 I/O to support complex glue-logic, data buffering and interface tasks.

Packaged in a 484-ball BGA (484-FPBGA, 23×23) and specified for commercial temperature operation, this surface-mount FPGA operates from 1.14 V to 1.26 V and is RoHS compliant, making it suitable for a wide range of commercial electronic designs that need reconfigurable logic and on-chip memory.

Key Features

• Core Logic  40,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.906 Mbits of on-chip RAM for data buffering, FIFOs and small on-chip storage needs.
• I/O Capacity  363 I/O pins to support multiple interfaces, wide parallel buses or dense signal routing to peripherals.
• Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage system domains.
• Package and Mounting  484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant for regulated markets and environmentally conscious designs.

Typical Applications

• Custom Logic and Glue Code  Implement custom protocol bridges, state machines and interface logic to reduce external component count and simplify PCB design.
• High-Density I/O Interfaces  Manage multiple parallel or serial interfaces where a large number of I/O pins is required for peripherals or external devices.
• On-Chip Data Buffering  Use the embedded RAM for small buffering, FIFO structures and temporary storage close to logic paths to reduce external memory needs.
• Embedded System Control  Integrate control and supervisory functions within a single programmable device to consolidate system-level logic.

Unique Advantages

• High Logic Density: 40,000 logic elements allow implementation of sizable custom logic functions without external CPLDs or additional FPGAs.
• Integrated Memory: Approximately 0.906 Mbits of embedded RAM reduces dependence on external memory for small to medium buffering tasks.
• Extensive I/O: 363 I/O pins enable complex interconnects and support for multiple peripherals directly from the FPGA.
• Compact BGA Packaging: 484-ball BGA (23×23) provides a high-pin-count solution in a space-efficient footprint for dense board designs.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial product requirements while simplifying qualification in commercial deployments.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronics manufacturing.

Why Choose LFXP2-40E-6F484C?

LFXP2-40E-6F484C offers a balanced combination of programmable logic, embedded memory and high I/O count in a single surface-mount BGA package. Its 40,000 logic elements and approximately 0.906 Mbits of on-chip RAM make it well suited to consolidating glue logic, buffering and control functions within compact commercial electronic designs.

This part is targeted at designers who need reconfigurable logic with substantial I/O capacity and integrated memory while maintaining a low-voltage supply domain and standard commercial temperature operation. Its packaging and RoHS compliance support streamlined board-level integration and manufacturing.

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