LFXP2-40E-6F672C

The LFXP2-40E-6F672C is a flash-based Lattice XP2 FPGA delivering 40,000 logic elements and up to 540 user I/Os in a 672-ball BGA package. It combines a flexiFLASH architecture with on-chip embedded memory and dedicated sysDSP resources to address commercial embedded applications that require dense logic, rich I/O connectivity and embedded DSP capability.

Designed for commercial-grade systems, the device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C temperature range, offering a compact surface-mount solution for interface, processing and control functions.

Key Features

• Core architecture flexiFLASH single-chip architecture with instant-on and infinitely reconfigurable flash-based configuration, providing non-volatile on-chip storage and design security features.
• Live Update and security Supports TransFR live update technology, secure updates with 128-bit AES encryption and dual-boot configuration options with external SPI.
• Logic density Approximately 40,000 logic elements suitable for mid-to-high density FPGA designs.
• Embedded memory Approximately 0.91 Mbits of total on-chip RAM to support embedded data buffering and state storage.
• sysDSP blocks and multipliers Up to eight sysDSP blocks with up to thirty-two 18×18 multipliers (each block can support one 36×36 multiplier or multiple 18×18/9×9 configurations) for multiply-accumulate and DSP workloads.
• Clocking Up to four analog PLLs per device for clock multiply, divide and phase shifting.
• Flexible I/O Up to 540 I/Os with sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and high-speed differential standards including LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
• Pre-engineered interfaces Built-in support for DDR/DDR2 memory interfaces up to 200 MHz, 7:1 LVDS display interfaces and XGMII for common synchronous interfaces.
• Package and mounting 672-ball fpBGA package (27 × 27 mm) / 672-BBGA, surface-mount mounting type for compact board-level integration.
• Power and environmental Operates from 1.14 V to 1.26 V and is rated for commercial temperature range (0 °C to 85 °C). RoHS compliant.
• System-level support Includes on-chip oscillator, IEEE 1149.1 and IEEE 1532 compliance, and embedded Soft Error Detect (SED) macro as part of system integration features.

Typical Applications

• High-speed interface bridging Use the device’s abundant I/Os and pre-engineered source-synchronous interfaces (DDR/DDR2, LVDS) to implement memory interfaces and protocol bridging on compact boards.
• Display and video front-ends 7:1 LVDS support and flexible I/O make the device suitable for display interface and timing control functions.
• Signal processing and MAC acceleration sysDSP blocks and 18×18 multipliers enable multiply-accumulate tasks for DSP functions and data stream processing.
• Embedded control and system management Flash-based instant-on configuration, on-chip oscillator and secure update capabilities support embedded control, monitoring and secure update workflows in commercial systems.

Unique Advantages

• Flash-based instant-on: flexiFLASH architecture provides non-volatile configuration for immediate startup without external configuration memory.
• Secure, field-updateable designs: TransFR live update and 128-bit AES encryption enable secure firmware/bitstream updates and dual-boot strategies.
• Integrated DSP resources: Dedicated sysDSP blocks and multiple 18×18 multipliers accelerate compute-intensive tasks while conserving fabric resources.
• Extensive I/O and protocol support: Up to 540 I/Os and a broad set of supported standards simplify external device interfacing and reduce the need for additional components.
• Compact packaging for high I/O count: 672-ball fpBGA (27 × 27 mm) provides a high pin-count, surface-mount footprint for space-constrained boards.
• Design ecosystem support: Family-level support includes Lattice Diamond design software and pre-engineered IP to accelerate development and migration.

Why Choose LFXP2-40E-6F672C?

The LFXP2-40E-6F672C positions itself as a commercial-grade, mid-to-high density FPGA that balances abundant I/O, embedded memory and dedicated DSP resources in a single, flash-configured device. Its combination of flexiFLASH instant-on capability, secure live update features and extensive interface support makes it a practical choice for embedded systems that require field configurability, interface density and DSP acceleration.

This device is well-suited to engineers and procurement teams building commercial embedded platforms that need scalable logic density, robust I/O options and a compact BGA package. The Lattice XP2 family ecosystem and design tools support density migration and accelerate development across product iterations.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LFXP2-40E-6F672C.