LFXP2-40E-6FN484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA |
|---|---|
| Quantity | 1,259 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-6FN484I – XP2 Field Programmable Gate Array (FPGA) IC 363 906240 40000 484-BBGA
The LFXP2-40E-6FN484I is an XP2-series FPGA from Lattice Semiconductor Corporation that combines a LUT-based programmable fabric with on-chip flash configuration. It integrates a substantial logic capacity and embedded memory with flexible I/O and configuration features suited for industrial-grade embedded systems and advanced interface applications.
Built on the LatticeXP2 family architecture, the device is optimized for reconfigurable designs requiring instant-on configuration, secure updates and a dense I/O footprint in a 484-ball fpBGA package.
Key Features
- Core Architecture (flexiFLASH) Instant-on, infinitely reconfigurable single-chip flash-based architecture with FlashBAK and Serial TAG memory for on-chip storage and design security.
- Logic Capacity 40,000 logic elements enabling complex programmable logic implementations.
- Embedded Memory Approximately 0.906 Mbits of on-chip RAM (total RAM bits: 906,240) combining embedded and distributed memory resources.
- sysDSP and Multipliers High-performance DSP resources with up to eight sysDSP blocks and support for 32 18×18 multipliers for multiply-accumulate functions.
- Flexible I/O 363 I/O pins with support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and high-speed differential options such as LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
- Pre‑engineered Interfaces Source-synchronous interfaces and memory interfaces including DDR/DDR2 support up to 200 MHz and 7:1 LVDS display links.
- Configuration & Live Update Live Update technology with TransFR, secure updates using 128-bit AES encryption and support for dual-boot with external SPI boot flash.
- Power, Package & Temperature Low-voltage operation with VCC supply range 1.14 V to 1.26 V; housed in a 484-ball fpBGA (23 × 23 mm) surface-mount package; industrial temperature grade from −40 °C to 100 °C.
- System Support Up to four analog PLLs, on-chip oscillator, IEEE 1149.1 and IEEE 1532 compliance for system-level integration and test.
Typical Applications
- Display and Video Interfaces — 7:1 LVDS support and source-synchronous I/O enable panel and display interface designs.
- Memory Interface Controllers — DDR/DDR2 interface capability up to 200 MHz for bridging and memory controller functions.
- Industrial Control and Automation — Industrial temperature range and flexible I/O make the device suitable for sensor aggregation, motor control logic and real-time control tasks.
- Secure Remote Update Systems — Live Update and 128-bit AES encryption support secure field updates and dual-boot deployment strategies.
Unique Advantages
- Highly integrated programmable fabric: 40,000 logic elements with substantial on-chip memory reduce external component count and board complexity.
- On-chip nonvolatile configuration: flexiFLASH architecture provides instant-on operation and embedded FlashBAK memory for reliable single-chip configuration.
- DSP-ready resources: sysDSP blocks and multiple 18×18 multipliers accelerate signal processing and math-intensive functions without external accelerators.
- Extensive I/O flexibility: 363 I/Os and broad standard support allow direct interfacing to a wide range of legacy and high-speed peripherals.
- Secure, maintainable systems: TransFR Live Update and 128-bit AES encryption support secure firmware updates and reliable field maintenance workflows.
- Industrial robustness: Surface-mount 484-ball fpBGA package and −40 °C to 100 °C operating range support deployment in industrial environments.
Why Choose LFXP2-40E-6FN484I?
The LFXP2-40E-6FN484I positions itself as a versatile, flash-configured FPGA that balances substantial logic capacity, embedded memory and DSP resources with flexible I/O and secure configuration features. Its LatticeXP2 family architecture provides instant-on operation and Live Update capabilities that simplify deployment and in-field maintenance.
This device is well suited for engineers designing industrial embedded systems, high-speed interface bridges, display controllers and secure update-capable products that require a compact, high-density fpBGA solution with broad I/O support and industrial temperature operation.
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