LFXP2-40E-6FN672I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA |
|---|---|
| Quantity | 1,552 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 540 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-6FN672I – XP2 FPGA, approximately 40,000 logic elements, 672-BBGA
The LFXP2-40E-6FN672I is a LatticeXP2-series field programmable gate array (FPGA) in a 672-ball fpBGA package designed for industrial applications. It combines a flexiFLASH™ architecture with embedded FPGA fabric to deliver instant-on, reconfigurable logic suitable for demanding I/O, memory-interface and DSP-centric designs.
With approximately 40,000 logic elements, roughly 0.9 Mbits of on-chip memory, extensive I/O (540 pins) and dedicated sysDSP resources, this device targets designs that require a balance of integration, secure updateability and flexible high-speed interfacing within an industrial temperature range.
Key Features
- Core Architecture — flexiFLASH™ Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK embedded memory and design security features.
- Logic Capacity Approximately 40,000 logic elements to implement complex programmable logic and control functions.
- Embedded Memory Approximately 0.9 Mbits of on-chip RAM available for embedded storage and buffering.
- sysDSP™ and Multipliers Dedicated sysDSP blocks and multiple 18×18 multipliers for high-performance multiply-accumulate operations and signal processing acceleration.
- Flexible I/O Up to 540 I/O pins with support for standards and source-synchronous interfaces used in high-speed memory and display applications.
- Clocking Multiple analog PLLs for clock multiply, divide and phase shifting to support complex timing architectures.
- Security & Live Update Live Update technology with secure update support and AES-based protection for in-field configuration management.
- Power Low-voltage operation with a supply range of 1.14 V to 1.26 V for core power.
- Package & Mounting 672-ball fpBGA (27 × 27 mm) package, surface mount, optimized for dense system integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
Typical Applications
- Display and Video Interfaces Use the device’s source-synchronous I/O and LVDS-capable interfaces to implement display drivers and high-speed video paths.
- Memory Interface Bridging Implement DDR/DDR2 and other memory interfaces using pre-engineered source-synchronous support and on-chip PLLs for timing control.
- Embedded Signal Processing Leverage sysDSP blocks and dedicated multipliers for acceleration of filtering, transforms and other DSP tasks.
- Industrial Control and Automation Industrial-grade temperature range and dense I/O enable custom control logic, protocol bridging and sensor-data aggregation in industrial equipment.
Unique Advantages
- Highly integrated solution: Combines flash-based configuration and FPGA fabric in a single device to reduce external components and simplify BOM.
- Instant-on reconfigurability: flexiFLASH architecture enables immediate start-up and in-field reconfiguration without external configuration memory.
- Secure, field-update capable: Live Update and encryption features allow secure, controlled updates of deployed systems.
- Rich I/O and interface support: Up to 540 I/Os and multiple PLLs facilitate complex, high-speed interfaces and mixed-standard designs.
- Industrial robustness: Specified for −40 °C to 100 °C operation and supplied in a compact 672-ball fpBGA for rugged system designs.
- Low-voltage core operation: 1.14 V to 1.26 V supply range supports power-sensitive applications and modern system power rails.
Why Choose LFXP2-40E-6FN672I?
The LFXP2-40E-6FN672I delivers a balanced combination of logic capacity, embedded memory and DSP resources within a flash-configured FPGA architecture. Its flexiFLASH approach, on-chip memory and sysDSP blocks make it well-suited for designs that require instant-on behavior, secure updates and hardware-accelerated processing while maintaining a compact package footprint.
This device is an appropriate choice for engineers building industrial-grade systems that demand extensive I/O, flexible interfacing and reliable operation across a wide temperature range. The integration of secure configuration and Live Update capabilities provides long-term value for applications requiring field upgrades and robust system lifecycle management.
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