LFXP2-40E-6FN672I

IC FPGA 540 I/O 672FPBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA

Quantity 1,552 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O540Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-6FN672I – XP2 FPGA, approximately 40,000 logic elements, 672-BBGA

The LFXP2-40E-6FN672I is a LatticeXP2-series field programmable gate array (FPGA) in a 672-ball fpBGA package designed for industrial applications. It combines a flexiFLASH™ architecture with embedded FPGA fabric to deliver instant-on, reconfigurable logic suitable for demanding I/O, memory-interface and DSP-centric designs.

With approximately 40,000 logic elements, roughly 0.9 Mbits of on-chip memory, extensive I/O (540 pins) and dedicated sysDSP resources, this device targets designs that require a balance of integration, secure updateability and flexible high-speed interfacing within an industrial temperature range.

Key Features

  • Core Architecture — flexiFLASH™ Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK embedded memory and design security features.
  • Logic Capacity Approximately 40,000 logic elements to implement complex programmable logic and control functions.
  • Embedded Memory Approximately 0.9 Mbits of on-chip RAM available for embedded storage and buffering.
  • sysDSP™ and Multipliers Dedicated sysDSP blocks and multiple 18×18 multipliers for high-performance multiply-accumulate operations and signal processing acceleration.
  • Flexible I/O Up to 540 I/O pins with support for standards and source-synchronous interfaces used in high-speed memory and display applications.
  • Clocking Multiple analog PLLs for clock multiply, divide and phase shifting to support complex timing architectures.
  • Security & Live Update Live Update technology with secure update support and AES-based protection for in-field configuration management.
  • Power Low-voltage operation with a supply range of 1.14 V to 1.26 V for core power.
  • Package & Mounting 672-ball fpBGA (27 × 27 mm) package, surface mount, optimized for dense system integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.

Typical Applications

  • Display and Video Interfaces Use the device’s source-synchronous I/O and LVDS-capable interfaces to implement display drivers and high-speed video paths.
  • Memory Interface Bridging Implement DDR/DDR2 and other memory interfaces using pre-engineered source-synchronous support and on-chip PLLs for timing control.
  • Embedded Signal Processing Leverage sysDSP blocks and dedicated multipliers for acceleration of filtering, transforms and other DSP tasks.
  • Industrial Control and Automation Industrial-grade temperature range and dense I/O enable custom control logic, protocol bridging and sensor-data aggregation in industrial equipment.

Unique Advantages

  • Highly integrated solution: Combines flash-based configuration and FPGA fabric in a single device to reduce external components and simplify BOM.
  • Instant-on reconfigurability: flexiFLASH architecture enables immediate start-up and in-field reconfiguration without external configuration memory.
  • Secure, field-update capable: Live Update and encryption features allow secure, controlled updates of deployed systems.
  • Rich I/O and interface support: Up to 540 I/Os and multiple PLLs facilitate complex, high-speed interfaces and mixed-standard designs.
  • Industrial robustness: Specified for −40 °C to 100 °C operation and supplied in a compact 672-ball fpBGA for rugged system designs.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range supports power-sensitive applications and modern system power rails.

Why Choose LFXP2-40E-6FN672I?

The LFXP2-40E-6FN672I delivers a balanced combination of logic capacity, embedded memory and DSP resources within a flash-configured FPGA architecture. Its flexiFLASH approach, on-chip memory and sysDSP blocks make it well-suited for designs that require instant-on behavior, secure updates and hardware-accelerated processing while maintaining a compact package footprint.

This device is an appropriate choice for engineers building industrial-grade systems that demand extensive I/O, flexible interfacing and reliable operation across a wide temperature range. The integration of secure configuration and Live Update capabilities provides long-term value for applications requiring field upgrades and robust system lifecycle management.

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