LFXP2-40E-5FN672I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA |
|---|---|
| Quantity | 1,337 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 540 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 906240 |
Overview of LFXP2-40E-5FN672I – XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA
The LFXP2-40E-5FN672I is a Lattice Semiconductor XP2 family FPGA featuring a flexiFLASH architecture that combines LUT-based programmable fabric with on-chip non-volatile Flash. This device delivers 40,000 logic elements, approximately 0.9 Mbits of on-chip RAM, and up to 540 I/O in a 672-ball fpBGA package targeted for industrial applications requiring high integration and reconfigurability.
Designed for systems that demand instant-on behavior, secure field updates and a mix of DSP, memory and high-speed I/O capabilities, the device is suited for embedded and industrial designs operating across a wide temperature and voltage range.
Key Features
- Core / Architecture flexiFLASH architecture with instant-on, infinitely reconfigurable single-chip Flash-based FPGA fabric and FlashBAK embedded block memory.
- Logic Capacity 40,000 logic elements for mid-density FPGA implementations.
- On-chip Memory Total on-chip RAM of 906,240 bits (approximately 0.9 Mbits) providing embedded and distributed memory resources.
- sysDSP and Multiply Resources High-performance sysDSP blocks and multiple 18×18 multiplier resources for arithmetic-intensive functions (family sysDSP configuration supports up to 32 18×18 multipliers).
- I/O Flexibility Up to 540 user I/O pins with support for a wide range of I/O standards (family-level support includes LVDS, Bus-LVDS, MLVDS, LVPECL, LVCMOS, SSTL, HSTL and PCI signaling options).
- Clocking Multiple analog PLLs for clock multiply, divide and phase shifting (family supports up to four PLLs).
- Secure Live Update Live Update technology with secure update support including 128-bit AES encryption and dual-boot capability for secure field reconfiguration.
- Power and Operating Range Core supply range from 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C.
- Package & Mounting 672-ball fpBGA (27 × 27 mm) surface-mount package for high I/O density and compact system integration.
- Compliance RoHS-compliant manufacturing.
Typical Applications
- Industrial Automation Control and interface functions that benefit from industrial temperature operation and high I/O counts for sensor and actuator connectivity.
- Display and Imaging Systems Source-synchronous and LVDS-capable I/O combined with DSP blocks make the device suitable for display interface and image-processing front-ends.
- High-speed Communications & Networking Dense I/O, PLL clocking and DSP resources support protocol bridging, packet processing and other networking functions.
Unique Advantages
- Single-chip non-volatile FPGA: Combining Flash configuration with FPGA fabric provides instant-on operation and eliminates separate configuration memory.
- High I/O density: Up to 540 I/Os in a 672-ball fpBGA reduces external I/O expansion and simplifies board-level routing for complex systems.
- Integrated DSP and multiplier resources: sysDSP blocks and multiple 18×18 multipliers accelerate arithmetic-heavy tasks without external accelerators.
- Secure field updates: Live Update with 128-bit AES and dual-boot support enables secure firmware and configuration management in deployed systems.
- Industrial operating range: Rated for −40 °C to 100 °C, supporting designs that require extended temperature operation.
- Compact, surface-mount packaging: 672-FPBGA (27 × 27 mm) package offers a high-density footprint for space-constrained applications.
Why Choose LFXP2-40E-5FN672I?
The LFXP2-40E-5FN672I positions performance, integration and field-upgradeability in a single, industrial-grade FPGA. With 40,000 logic elements, approximately 0.9 Mbits of on-chip RAM, robust DSP resources and up to 540 I/O, it addresses mid-density designs that require secure instant-on operation and flexible I/O signaling.
This device is well suited for engineering teams building embedded, industrial and communications products that require long-term configurability, secure updates and a compact, high-density package. Support for live update technology and an ecosystem of design tools and IP enables scalable development and maintenance over a product’s lifecycle.
Request a quote or submit a request for pricing and availability for the LFXP2-40E-5FN672I to evaluate integration into your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016