LFXP2-40E-5FN672I

IC FPGA 540 I/O 672FPBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA

Quantity 1,337 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O540Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits906240

Overview of LFXP2-40E-5FN672I – XP2 Field Programmable Gate Array (FPGA) IC 540 906240 40000 672-BBGA

The LFXP2-40E-5FN672I is a Lattice Semiconductor XP2 family FPGA featuring a flexiFLASH architecture that combines LUT-based programmable fabric with on-chip non-volatile Flash. This device delivers 40,000 logic elements, approximately 0.9 Mbits of on-chip RAM, and up to 540 I/O in a 672-ball fpBGA package targeted for industrial applications requiring high integration and reconfigurability.

Designed for systems that demand instant-on behavior, secure field updates and a mix of DSP, memory and high-speed I/O capabilities, the device is suited for embedded and industrial designs operating across a wide temperature and voltage range.

Key Features

  • Core / Architecture  flexiFLASH architecture with instant-on, infinitely reconfigurable single-chip Flash-based FPGA fabric and FlashBAK embedded block memory.
  • Logic Capacity  40,000 logic elements for mid-density FPGA implementations.
  • On-chip Memory  Total on-chip RAM of 906,240 bits (approximately 0.9 Mbits) providing embedded and distributed memory resources.
  • sysDSP and Multiply Resources  High-performance sysDSP blocks and multiple 18×18 multiplier resources for arithmetic-intensive functions (family sysDSP configuration supports up to 32 18×18 multipliers).
  • I/O Flexibility  Up to 540 user I/O pins with support for a wide range of I/O standards (family-level support includes LVDS, Bus-LVDS, MLVDS, LVPECL, LVCMOS, SSTL, HSTL and PCI signaling options).
  • Clocking  Multiple analog PLLs for clock multiply, divide and phase shifting (family supports up to four PLLs).
  • Secure Live Update  Live Update technology with secure update support including 128-bit AES encryption and dual-boot capability for secure field reconfiguration.
  • Power and Operating Range  Core supply range from 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C.
  • Package & Mounting  672-ball fpBGA (27 × 27 mm) surface-mount package for high I/O density and compact system integration.
  • Compliance  RoHS-compliant manufacturing.

Typical Applications

  • Industrial Automation  Control and interface functions that benefit from industrial temperature operation and high I/O counts for sensor and actuator connectivity.
  • Display and Imaging Systems  Source-synchronous and LVDS-capable I/O combined with DSP blocks make the device suitable for display interface and image-processing front-ends.
  • High-speed Communications & Networking  Dense I/O, PLL clocking and DSP resources support protocol bridging, packet processing and other networking functions.

Unique Advantages

  • Single-chip non-volatile FPGA: Combining Flash configuration with FPGA fabric provides instant-on operation and eliminates separate configuration memory.
  • High I/O density: Up to 540 I/Os in a 672-ball fpBGA reduces external I/O expansion and simplifies board-level routing for complex systems.
  • Integrated DSP and multiplier resources: sysDSP blocks and multiple 18×18 multipliers accelerate arithmetic-heavy tasks without external accelerators.
  • Secure field updates: Live Update with 128-bit AES and dual-boot support enables secure firmware and configuration management in deployed systems.
  • Industrial operating range: Rated for −40 °C to 100 °C, supporting designs that require extended temperature operation.
  • Compact, surface-mount packaging: 672-FPBGA (27 × 27 mm) package offers a high-density footprint for space-constrained applications.

Why Choose LFXP2-40E-5FN672I?

The LFXP2-40E-5FN672I positions performance, integration and field-upgradeability in a single, industrial-grade FPGA. With 40,000 logic elements, approximately 0.9 Mbits of on-chip RAM, robust DSP resources and up to 540 I/O, it addresses mid-density designs that require secure instant-on operation and flexible I/O signaling.

This device is well suited for engineering teams building embedded, industrial and communications products that require long-term configurability, secure updates and a compact, high-density package. Support for live update technology and an ecosystem of design tools and IP enables scalable development and maintenance over a product’s lifecycle.

Request a quote or submit a request for pricing and availability for the LFXP2-40E-5FN672I to evaluate integration into your next design.

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