LFXP2-30E-7F672C

The LFXP2-30E-7F672C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeXP2 family. It combines a LUT-based FPGA fabric with on-chip non-volatile flash architecture and series-level features such as flexiFLASH and Live Update technology.

Designed for applications requiring a balance of logic density, embedded memory and high I/O count, this device delivers 29,000 logic elements, approximately 0.387 Mbits of on-chip RAM and 472 I/Os in a 672-ball fpBGA (27 × 27 mm) surface-mount package.

Key Features

• Core Logic  29,000 logic elements provide the programmable fabric capacity for mid-range logic and control implementations.
• Embedded Memory  Approximately 0.387 Mbits (396,288 bits) of on-chip RAM for embedded data storage and buffering.
• sysDSP and Multipliers  LatticeXP2 family sysDSP blocks are supported; the XP2-30 device includes sysDSP resources and 28 18×18 multipliers for high-performance multiply-accumulate operations.
• I/O and Interfaces  Up to 472 user I/Os enable dense external connectivity and support for source-synchronous interfaces and high-pin-count designs.
• Non-volatile Configuration and Secure Update  flexiFLASH architecture provides single-chip, instant-on operation with Live Update features including TransFR technology, dual-boot capability and 128-bit AES encryption for secure updates.
• Power and Voltage  Operates from a core voltage range of 1.14 V to 1.26 V, enabling designs targeting the LatticeXP2 family voltage domain.
• Package and Mounting  672-ball fpBGA (27 × 27 mm) supplier package (672-FPBGA) in a surface-mount form factor for compact, high-density applications.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature and RoHS compliant for commercial electronics deployment.

Typical Applications

• Display and Video Interfaces  High I/O count and pre-engineered LVDS interface support in the LatticeXP2 family make this device suitable for display bridge and video interface tasks.
• Memory and High-Speed Bus Bridging  Support for DDR/DDR2 source-synchronous interfaces and abundant I/O enables protocol bridging and external memory interface designs.
• Secure Field Updates and Configuration Management  flexiFLASH and Live Update technologies, including 128-bit AES encryption and dual-boot, support secure in-field reconfiguration and firmware updates.

Unique Advantages

• Instant-on, single-chip flash architecture: flexiFLASH provides non-volatile configuration without external configuration memory, simplifying BOM and startup behavior.
• Secure update capability: Live Update with TransFR and 128-bit AES supports encrypted updates and dual-boot strategies for safer deployments.
• High I/O density: 472 available I/Os in a 672-ball fpBGA package enables complex board-level connectivity and integration.
• DSP acceleration: sysDSP resources and multiple 18×18 multipliers provide efficient multiply-accumulate performance for signal processing tasks.
• Compact, surface-mount package: 672-FPBGA (27 × 27 mm) offers a small footprint for space-constrained, high-density system designs.
• Commercial-grade operating range: Rated 0 °C to 85 °C for standard commercial electronics environments and RoHS compliant for regulatory alignment.

Why Choose LFXP2-30E-7F672C?

The LFXP2-30E-7F672C positions itself as a mid-density FPGA that balances programmable logic capacity, on-chip RAM and extensive I/O in a compact fpBGA package. Its integration of flexiFLASH non-volatile configuration and Live Update security features supports designs that need secure, field-updatable logic without external configuration components.

This device is well suited to engineers building display interfaces, protocol bridges, embedded controllers and other systems that require significant I/O, DSP resources and secure reconfiguration within a commercial temperature range. The LatticeXP2 family ecosystem and documented device features provide a clear upgrade path and consistent design flow for projects targeting this class of FPGA.

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