LFXP2-5E-6FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA |
|---|---|
| Quantity | 1,286 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 172 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-6FT256C – XP2 Field Programmable Gate Array (FPGA) IC, 172 I/O, 5,000 logic elements, 256-LBGA
The LFXP2-5E-6FT256C is a commercial-grade FPGA from the LatticeXP2 family that pairs a LUT-based FPGA fabric with non-volatile flash in a flexiFLASH architecture. It provides instant-on, reconfigurable logic with on-chip memory and programmable I/O for commercial embedded designs.
With 5,000 logic elements, approximately 0.17 Mbits of on-chip RAM and 172 I/O in a 256-ball ftBGA (17 × 17 mm) package, this device is suited for compact, interface-rich systems that require embedded memory, DSP capability and flexible configuration options.
Key Features
- Programmable Fabric and Flash Architecture LatticeXP2 flexiFLASH architecture provides instant-on, infinitely reconfigurable logic with on-chip Flash-based configuration and design security features described for the XP2 family.
- Logic Capacity 5,000 logic elements (LUT-based fabric) suitable for mid-density logic implementations.
- Embedded Memory Total on-chip RAM: 169,984 bits (approximately 0.17 Mbits) for distributed and embedded storage.
- DSP Resources Family sysDSP blocks and multiple 18×18 multiplier resources are part of the LatticeXP2 architecture to support multiply-accumulate and signal-processing tasks.
- Flexible I/O 172 I/O pins with family-level support for multiple standards (LVCMOS, LVDS, SSTL, HSTL, PCI and others in the XP2 family) to simplify interfacing with memory, displays and high-speed peripherals.
- Clocking and PLLs Multiple analog PLLs available in the family for clock multiplication, division and phase shifting.
- Configuration and Security Family features include SPI boot flash interface, dual-boot options and secure update capabilities with AES encryption and TransFR live update technology.
- Package and Mounting 256-ball ftBGA (256-LBGA package case), surface-mount mounting; supplier device package identified as 256-FTBGA (17×17 mm).
- Power and Temperature Operating supply range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded controllers — Compact system control and interface logic where instant-on configuration and on-chip flash are required.
- Signal processing and DSP acceleration — Use of sysDSP blocks and on-chip multipliers for mid-range multiply-accumulate workloads.
- Memory and bus interfacing — Pre-engineered source-synchronous interfaces in the XP2 family enable DDR/DDR2 memory interface implementations and protocol bridging.
- Display and video interfaces — Family-level support for multi-lane LVDS and other source-synchronous interfaces for display and imaging pipelines.
Unique Advantages
- Instant-on non-volatile configuration — Flash-based flexiFLASH architecture eliminates the need for external configuration memory at power-up.
- Balanced mid-range resources — 5,000 logic elements, substantial embedded RAM and DSP blocks provide a blend of logic, memory and arithmetic capability for mid-density designs.
- Flexible I/O standards — Broad family I/O support simplifies integration with a wide range of peripherals and memory interfaces.
- Secure update options — Family technologies for secure firmware updates and dual-boot support allow field updates with built-in security primitives.
- Compact ftBGA package — 256-ball ftBGA (17 × 17 mm) provides a high I/O count in a compact surface-mount form factor.
Why Choose LFXP2-5E-6FT256C?
The LFXP2-5E-6FT256C positions itself as a compact, flash-configurable FPGA for commercial embedded systems that demand a combination of mid-range logic capacity, embedded memory and DSP acceleration. Its 172 I/O in a 256-ball ftBGA and family-level I/O flexibility make it practical for interface-dense designs where on-chip configuration and secure updates are important.
Designed for developers who need reconfigurable logic with integrated non-volatile configuration, this device offers scalability within the LatticeXP2 family and leverages a mature ecosystem of family features for timing, clocking and pre-engineered interfaces.
Request a quote or submit a pricing inquiry to evaluate LFXP2-5E-6FT256C for your next embedded or interface-focused design.

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