LFXP2-5E-6FT256C

IC FPGA 172 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA

Quantity 1,286 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O172Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-6FT256C – XP2 Field Programmable Gate Array (FPGA) IC, 172 I/O, 5,000 logic elements, 256-LBGA

The LFXP2-5E-6FT256C is a commercial-grade FPGA from the LatticeXP2 family that pairs a LUT-based FPGA fabric with non-volatile flash in a flexiFLASH architecture. It provides instant-on, reconfigurable logic with on-chip memory and programmable I/O for commercial embedded designs.

With 5,000 logic elements, approximately 0.17 Mbits of on-chip RAM and 172 I/O in a 256-ball ftBGA (17 × 17 mm) package, this device is suited for compact, interface-rich systems that require embedded memory, DSP capability and flexible configuration options.

Key Features

  • Programmable Fabric and Flash Architecture LatticeXP2 flexiFLASH architecture provides instant-on, infinitely reconfigurable logic with on-chip Flash-based configuration and design security features described for the XP2 family.
  • Logic Capacity 5,000 logic elements (LUT-based fabric) suitable for mid-density logic implementations.
  • Embedded Memory Total on-chip RAM: 169,984 bits (approximately 0.17 Mbits) for distributed and embedded storage.
  • DSP Resources Family sysDSP blocks and multiple 18×18 multiplier resources are part of the LatticeXP2 architecture to support multiply-accumulate and signal-processing tasks.
  • Flexible I/O 172 I/O pins with family-level support for multiple standards (LVCMOS, LVDS, SSTL, HSTL, PCI and others in the XP2 family) to simplify interfacing with memory, displays and high-speed peripherals.
  • Clocking and PLLs Multiple analog PLLs available in the family for clock multiplication, division and phase shifting.
  • Configuration and Security Family features include SPI boot flash interface, dual-boot options and secure update capabilities with AES encryption and TransFR live update technology.
  • Package and Mounting 256-ball ftBGA (256-LBGA package case), surface-mount mounting; supplier device package identified as 256-FTBGA (17×17 mm).
  • Power and Temperature Operating supply range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 85 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Embedded controllers — Compact system control and interface logic where instant-on configuration and on-chip flash are required.
  • Signal processing and DSP acceleration — Use of sysDSP blocks and on-chip multipliers for mid-range multiply-accumulate workloads.
  • Memory and bus interfacing — Pre-engineered source-synchronous interfaces in the XP2 family enable DDR/DDR2 memory interface implementations and protocol bridging.
  • Display and video interfaces — Family-level support for multi-lane LVDS and other source-synchronous interfaces for display and imaging pipelines.

Unique Advantages

  • Instant-on non-volatile configuration — Flash-based flexiFLASH architecture eliminates the need for external configuration memory at power-up.
  • Balanced mid-range resources — 5,000 logic elements, substantial embedded RAM and DSP blocks provide a blend of logic, memory and arithmetic capability for mid-density designs.
  • Flexible I/O standards — Broad family I/O support simplifies integration with a wide range of peripherals and memory interfaces.
  • Secure update options — Family technologies for secure firmware updates and dual-boot support allow field updates with built-in security primitives.
  • Compact ftBGA package — 256-ball ftBGA (17 × 17 mm) provides a high I/O count in a compact surface-mount form factor.

Why Choose LFXP2-5E-6FT256C?

The LFXP2-5E-6FT256C positions itself as a compact, flash-configurable FPGA for commercial embedded systems that demand a combination of mid-range logic capacity, embedded memory and DSP acceleration. Its 172 I/O in a 256-ball ftBGA and family-level I/O flexibility make it practical for interface-dense designs where on-chip configuration and secure updates are important.

Designed for developers who need reconfigurable logic with integrated non-volatile configuration, this device offers scalability within the LatticeXP2 family and leverages a mature ecosystem of family features for timing, clocking and pre-engineered interfaces.

Request a quote or submit a pricing inquiry to evaluate LFXP2-5E-6FT256C for your next embedded or interface-focused design.

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