LFXP2-5E-6FTN256I

The LFXP2-5E-6FTN256I is an industrial-grade FPGA based on the LatticeXP2 family flexiFLASH architecture, combining a LUT-based programmable fabric with on-chip non-volatile flash. It delivers 5,000 logic elements, approximately 169,984 bits of embedded RAM, and up to 172 I/O in a 256-ball ftBGA package for compact, board-level integration.

Designed for industrial applications that require wide operating conditions and secure, reconfigurable logic, this device targets system control, interface bridging and display or memory interface tasks where instant-on, reconfigurability and factory-grade temperature support are important.

Key Features

• Core Architecture LUT-based FPGA fabric with flexiFLASH non-volatile integration for instant-on and on-chip flash-based configuration.
• Logic Capacity 5,000 logic elements (LUTs) suitable for medium-density control and signal-processing functions.
• Embedded Memory Approximately 169,984 bits of on-chip RAM for distributed and embedded memory needs.
• sysDSP and Multipliers Family-level sysDSP blocks and 18×18 multiplier support are part of the XP2 architecture for multiply-accumulate operations (refer to family data for block counts).
• I/O Flexibility Up to 172 I/O pins with flexible buffer support for LVCMOS, LVTTL and multiple differential standards for interfacing diverse peripherals and high-speed links.
• Power Operates from a supply range of 1.14 V to 1.26 V (nominal 1.2 V), enabling low-voltage system designs.
• Package and Mounting Surface-mount 256-ball ftBGA (17 × 17 mm) package for high-density board layouts.
• Industrial Temperature Grade Rated for −40 °C to 100 °C to meet extended-temperature industrial deployments.
• Secure Update and Configuration Family technologies include secure update and dual-boot mechanisms (see family datasheet for details on TransFR and encryption features).

Typical Applications

• Industrial Control Deterministic logic and I/O density for motor control, PLC adjuncts and supervisory control where extended temperature operation is required.
• Interface Bridging Use as a protocol or bus bridge between processors, memory interfaces and peripherals leveraging flexible I/O standards and on-chip memories.
• Display and High-Speed I/O Implement source-synchronous display interfaces and differential signaling for imaging or display controller tasks supported by the XP2 family I/O features.
• Embedded System Glue Logic Compact footprint and instant-on configuration make this device suited for consolidating glue logic, control sequencing and peripheral management.

Unique Advantages

• Instant-on, Non-volatile Configuration: flexiFLASH architecture provides on-chip flash configuration for immediate startup without external configuration memory.
• Industrial Temperature Range: −40 °C to 100 °C rating enables deployment in challenging environmental conditions common to industrial systems.
• Balanced Integration: 5,000 logic elements, substantial embedded RAM and up to 172 I/O in a 17 × 17 mm ftBGA reduce board-level component count and BOM complexity.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with modern low-power system rails.
• Flexible I/O and Memory Resources: Multiple I/O standards and on-chip RAM support a range of peripheral interfaces and buffering needs without external SRAM in many configurations.
• Design Ecosystem Support: Family documentation and design flows enable migration and reuse across other LatticeXP2 devices (refer to family datasheet for software and IP support).

Why Choose LFXP2-5E-6FTN256I?

The LFXP2-5E-6FTN256I positions itself as a compact, industrial-grade FPGA option for medium-density logic designs requiring reliable, instant-on operation and flexible I/O. Its combination of 5,000 logic elements, on-chip flash configuration, approximately 169,984 bits of embedded RAM and a 256-ball ftBGA package makes it suitable for embedded control, interface bridging and display-related functions where board space and environmental robustness matter.

With support from the XP2 family architecture and associated design resources, this device offers a pathway for scalable designs and design reuse across compatible density options within the family, helping teams streamline development and long-term product sustainment.

Request a quote or submit an inquiry to receive pricing, availability and support information for the LFXP2-5E-6FTN256I.