LFXP2-5E-6MN132C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,712 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 86 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-6MN132C – XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA
The LFXP2-5E-6MN132C is a flash-based Lattice XP2 FPGA providing on-chip non-volatile configuration and a reconfigurable logic fabric optimized for embedded designs. It combines approximately 5,000 logic elements, about 169,984 bits of on-chip RAM, and 86 I/Os in a 132-ball csBGA (8×8 mm) package to address compact, low-power digital processing and interface tasks.
Built around the XP2 flexiFLASH architecture, the device targets applications that require instant-on behavior, field updates and secure configuration while operating from a 1.14 V to 1.26 V supply over a commercial 0 °C to 85 °C temperature range.
Key Features
- Flash-based flexiFLASH architecture — Instant-on, infinitely reconfigurable single-chip flash configuration with embedded FlashBAK memory and Serial TAG for on-chip storage and design security.
- Live Update and Security — Supports TransFR live update technology, dual-boot with external SPI, and secure updates with 128-bit AES encryption.
- Reconfigurable Logic — Approximately 5,000 logic elements (625 CLBs) for implementing custom logic, control and glue-logic functions.
- Embedded and Distributed Memory — About 169,984 total RAM bits across embedded block RAM and distributed RAM for buffering and state storage.
- sysDSP blocks and multipliers — Dedicated sysDSP resources and multiple 18×18 multiplier options for efficient multiply-accumulate operations.
- Flexible I/O and Interface Support — 86 I/Os with support for a wide range of I/O standards and pre-engineered source-synchronous interfaces including DDR/DDR2 and multi-LVDS configurations.
- Clocking — On-chip PLL resources for clock multiply, divide and phase shifting, supporting system timing and synchronization.
- Package and Mounting — Surface-mount 132-LFBGA (csBGA 8×8 mm) package suitable for compact board designs; RoHS compliant and commercial grade.
- Power and Environmental — Nominal operating supply range of 1.14 V to 1.26 V and specified for commercial temperature operation from 0 °C to 85 °C.
Typical Applications
- Display and Video Interfaces — Pre-engineered 7:1 LVDS and other interface support simplify implementation of display pipelines and panel interfaces.
- Memory and High-Speed Interfaces — Built-in source-synchronous interfaces for DDR/DDR2 up to supported frequencies enable memory controller and buffering applications.
- Secure Field-Updatable Systems — Flash configuration and TransFR with AES encryption provide secure remote updates and dual-boot capability for in-field firmware management.
- Embedded Control and Signal Processing — sysDSP blocks and dedicated multipliers accelerate multiply-accumulate workloads for control loops, motor control, and DSP tasks.
Unique Advantages
- Instant-on, non-volatile operation: Flash-based flexiFLASH eliminates the need for external configuration memory for immediate startup.
- Field update and security: TransFR live update and 128-bit AES encryption allow secure, managed firmware updates and dual-boot configurations.
- Balanced integration: Combines logic, on-chip RAM and dedicated DSP resources in a compact 132-ball csBGA package to reduce BOM and board area.
- Flexible I/O ecosystem: Broad I/O support and pre-engineered interfaces accelerate time-to-market for display, memory and high-speed link designs.
- Design tool and IP support: The XP2 family is supported by Lattice design tools and pre-designed IP modules for efficient implementation and migration.
Why Choose LFXP2-5E-6MN132C?
The LFXP2-5E-6MN132C positions itself as a versatile, flash-configured FPGA for compact embedded systems that require instant-on capability, secure field updates and a balance of logic, memory and DSP resources. Its combination of approximately 5,000 logic elements, roughly 170 Kbits of on-chip RAM and 86 I/Os in a small csBGA package makes it well suited for designs where board space, secure updateability and interface flexibility matter.
Engineers designing communication endpoints, display controllers, memory-interface logic or secure embedded controllers will find the device’s configuration features, DSP resources and rich I/O support useful for scalable implementations backed by Lattice’s design tools and IP portfolio.
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