LFXP2-5E-6MN132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

Quantity 1,712 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-6MN132C – XP2 Field Programmable Gate Array (FPGA) IC 86 169984 5000 132-LFBGA, CSPBGA

The LFXP2-5E-6MN132C is a flash-based Lattice XP2 FPGA providing on-chip non-volatile configuration and a reconfigurable logic fabric optimized for embedded designs. It combines approximately 5,000 logic elements, about 169,984 bits of on-chip RAM, and 86 I/Os in a 132-ball csBGA (8×8 mm) package to address compact, low-power digital processing and interface tasks.

Built around the XP2 flexiFLASH architecture, the device targets applications that require instant-on behavior, field updates and secure configuration while operating from a 1.14 V to 1.26 V supply over a commercial 0 °C to 85 °C temperature range.

Key Features

  • Flash-based flexiFLASH architecture — Instant-on, infinitely reconfigurable single-chip flash configuration with embedded FlashBAK memory and Serial TAG for on-chip storage and design security.
  • Live Update and Security — Supports TransFR live update technology, dual-boot with external SPI, and secure updates with 128-bit AES encryption.
  • Reconfigurable Logic — Approximately 5,000 logic elements (625 CLBs) for implementing custom logic, control and glue-logic functions.
  • Embedded and Distributed Memory — About 169,984 total RAM bits across embedded block RAM and distributed RAM for buffering and state storage.
  • sysDSP blocks and multipliers — Dedicated sysDSP resources and multiple 18×18 multiplier options for efficient multiply-accumulate operations.
  • Flexible I/O and Interface Support — 86 I/Os with support for a wide range of I/O standards and pre-engineered source-synchronous interfaces including DDR/DDR2 and multi-LVDS configurations.
  • Clocking — On-chip PLL resources for clock multiply, divide and phase shifting, supporting system timing and synchronization.
  • Package and Mounting — Surface-mount 132-LFBGA (csBGA 8×8 mm) package suitable for compact board designs; RoHS compliant and commercial grade.
  • Power and Environmental — Nominal operating supply range of 1.14 V to 1.26 V and specified for commercial temperature operation from 0 °C to 85 °C.

Typical Applications

  • Display and Video Interfaces — Pre-engineered 7:1 LVDS and other interface support simplify implementation of display pipelines and panel interfaces.
  • Memory and High-Speed Interfaces — Built-in source-synchronous interfaces for DDR/DDR2 up to supported frequencies enable memory controller and buffering applications.
  • Secure Field-Updatable Systems — Flash configuration and TransFR with AES encryption provide secure remote updates and dual-boot capability for in-field firmware management.
  • Embedded Control and Signal Processing — sysDSP blocks and dedicated multipliers accelerate multiply-accumulate workloads for control loops, motor control, and DSP tasks.

Unique Advantages

  • Instant-on, non-volatile operation: Flash-based flexiFLASH eliminates the need for external configuration memory for immediate startup.
  • Field update and security: TransFR live update and 128-bit AES encryption allow secure, managed firmware updates and dual-boot configurations.
  • Balanced integration: Combines logic, on-chip RAM and dedicated DSP resources in a compact 132-ball csBGA package to reduce BOM and board area.
  • Flexible I/O ecosystem: Broad I/O support and pre-engineered interfaces accelerate time-to-market for display, memory and high-speed link designs.
  • Design tool and IP support: The XP2 family is supported by Lattice design tools and pre-designed IP modules for efficient implementation and migration.

Why Choose LFXP2-5E-6MN132C?

The LFXP2-5E-6MN132C positions itself as a versatile, flash-configured FPGA for compact embedded systems that require instant-on capability, secure field updates and a balance of logic, memory and DSP resources. Its combination of approximately 5,000 logic elements, roughly 170 Kbits of on-chip RAM and 86 I/Os in a small csBGA package makes it well suited for designs where board space, secure updateability and interface flexibility matter.

Engineers designing communication endpoints, display controllers, memory-interface logic or secure embedded controllers will find the device’s configuration features, DSP resources and rich I/O support useful for scalable implementations backed by Lattice’s design tools and IP portfolio.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for LFXP2-5E-6MN132C.

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