LFXP2-5E-6QN208C

The LFXP2-5E-6QN208C is an XP2 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range programmable logic resource with on-chip memory and a substantial number of I/O pins in a 208‑lead BFQFP surface-mount package.

With 5,000 logic elements, approximately 0.17 Mbits of embedded memory (169,984 bits), and 146 I/Os, this device addresses commercial designs that require moderate logic integration and significant I/O capacity while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C operating temperature.

Key Features

• Logic Capacity  Approximately 5,000 logic elements suitable for mid-range programmable logic tasks and custom glue-logic implementation.
• Embedded Memory  Approximately 0.17 Mbits of on-chip RAM (169,984 bits) to support buffering, state storage, and small data structures within the FPGA fabric.
• I/O Density  146 general-purpose I/O pins to support multiple external interfaces, sensor arrays, or parallel connections in I/O‑rich systems.
• Power  Operates from a 1.14 V to 1.26 V supply, matching designs that use low-voltage FPGA cores and power rails.
• Package & Mounting  208‑BFQFP package (208‑lead PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly and dense board layouts.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant to support lead‑free, environmentally conscious manufacturing processes.

Typical Applications

• Embedded Control  Implement control logic and state machines in commercial embedded systems using the device's logic and memory resources.
• I/O Aggregation & Interface Bridging  Aggregate signals or bridge between multiple interfaces where a high pin count and flexible logic are required.
• Custom Glue Logic  Replace discrete logic with a single programmable device to simplify board design and reduce BOM count.
• Prototyping & Evaluation  Evaluate mid-range FPGA-based designs that need reprogrammable logic and modest embedded memory during development cycles.

Unique Advantages

• Balanced Logic and Memory  Combines roughly 5,000 logic elements with ~0.17 Mbits of RAM to support both control and small-data buffering needs on a single device.
• High I/O Count  146 I/Os enable direct connections to multiple peripherals and sensors, reducing the need for additional interface chips.
• Compact Surface-Mount Package  208‑lead BFQFP in a 28 × 28 mm footprint supports high-density PCB implementations while remaining compatible with surface-mount assembly processes.
• Low-Voltage Core Supply  Designed to operate within a 1.14 V to 1.26 V supply window, aligning with low-voltage core rails commonly used in modern systems.
• Commercial Temperature Rating  Specified for 0 °C to 85 °C operation to meet the environmental needs of typical commercial products.
• RoHS Compliant  Supports lead‑free manufacturing and regulatory requirements for many consumer and commercial electronics projects.

Why Choose LFXP2-5E-6QN208C?

The LFXP2-5E-6QN208C positions itself as a practical, mid-range FPGA option for commercial designs that need a balance of programmable logic, embedded memory, and a high I/O count in a surface-mount package. Its specification set—5,000 logic elements, 169,984 bits of on-chip RAM, 146 I/Os, and a 208‑BFQFP package—makes it suitable for designs that consolidate discrete logic, manage multiple external interfaces, or implement compact custom control functions.

For engineers and procurement teams building commercial electronic products, this FPGA offers predictable operating conditions and RoHS compliance, providing a stable platform for development, prototyping, and volume designs where mid-level integration and I/O capability are key requirements.

Request a quote or submit your requirements today to receive pricing and availability for the LFXP2-5E-6QN208C.