LFXP2-5E-7FT256C

IC FPGA 172 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA

Quantity 154 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O172Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs625Number of Logic Elements/Cells5000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits169984

Overview of LFXP2-5E-7FT256C – XP2 FPGA, 5k logic elements, 172 I/O, 256-LBGA

The LFXP2-5E-7FT256C is a LatticeXP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This device pairs a LUT-based FPGA fabric with non-volatile flash configuration and embedded resources to enable instant-on, reconfigurable logic in a compact 256-ball ftBGA package.

With 5,000 logic elements, 172 general-purpose I/O, and 169,984 bits of on-chip RAM, the device targets cost-sensitive commercial applications that need moderate logic density, flexible I/O and on-chip memory in a surface-mount 256-LBGA (17×17) footprint. It operates from a 1.14 V to 1.26 V supply and is rated for commercial temperatures (0 °C to 85 °C).

Key Features

  • flexiFLASH Architecture  Instant-on, single-chip flash configuration with FlashBAK and Serial TAG memory for on‑chip non-volatile configuration storage and design security.
  • Live Update & Secure Configuration  Supports TransFR live update technology, dual-boot with external SPI and secure updates with 128‑bit AES encryption as described for the LatticeXP2 family.
  • Logic & DSP Resources  Contains 5,000 logic elements and includes sysDSP resources (family-level support: multiple sysDSP blocks and 18×18 multipliers) for high-performance multiply-accumulate functions.
  • Embedded Memory  169,984 bits of on-chip RAM plus distributed memory resources for buffering, state machines and small data structures.
  • Flexible I/O  172 I/O pins with family-level sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and a range of differential standards including LVDS and LVPECL.
  • Clocking & Interfaces  Family support for up to four analog PLLs, pre-engineered source-synchronous interfaces (DDR/DDR2 up to 200 MHz, 7:1 LVDS for displays), and common bus interfaces such as XGMII.
  • Package & Supply  Surface-mount 256-LBGA (supplier device package: 256-FTBGA, 17×17 mm) and a nominal supply range of 1.14 V to 1.26 V.
  • Compliance  RoHS compliant; commercially graded with an operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Display and Video Interfaces  Use pre-engineered 7:1 LVDS and source-synchronous interfaces for panel link and display bridge applications.
  • Memory and Interface Bridging  Implement DDR/DDR2 interface glue logic and protocol adaptation with on-chip RAM and PLL-based clocking.
  • Communications and Networking  Provide moderate-density packet processing, protocol offload or interface conversion leveraging sysDSP blocks and flexible I/O standards.
  • Embedded Control and Prototyping  Integrate custom control logic, sensor aggregation and user interface management using 5,000 logic elements and abundant I/O.

Unique Advantages

  • Instant-on, non-volatile configuration: Flash-based flexiFLASH removes the need for external volatile configuration storage and supports immediate startup.
  • Secure and flexible updates: Live Update with TransFR and 128-bit AES encryption enable secure, field-updateable designs with dual-boot capability.
  • Balanced compute and memory: 5,000 logic elements combined with 169,984 bits of on-chip RAM and sysDSP resources provide a versatile mix for control, interface and DSP tasks.
  • Wide I/O flexibility: A broad set of supported I/O standards lets a single device interface to many common peripherals and signaling types.
  • Compact package: 256-ball ftBGA (17×17 mm) offers a small PCB footprint for space-constrained commercial products.
  • Design ecosystem support: Part of the LatticeXP2 family with family-level IP and design tool support for faster development and migration.

Why Choose LFXP2-5E-7FT256C?

The LFXP2-5E-7FT256C delivers a practical balance of logic density, on-chip memory and flexible I/O in a compact, commercial-grade ftBGA package. It is suitable for designers who need instant-on flash configuration, secure update capability and a moderate set of DSP and memory resources without external configuration complexity.

As a member of the LatticeXP2 family, this device benefits from family-level features such as flexiFLASH architecture, Live Update technologies and pre-engineered interfaces, enabling scalable designs and access to Lattice-provided IP and tools for efficient implementation.

Request a quote or submit an inquiry to get pricing and availability for the LFXP2-5E-7FT256C and to discuss how it fits your next design.

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