LFXP2-5E-7FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA |
|---|---|
| Quantity | 154 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 172 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 169984 |
Overview of LFXP2-5E-7FT256C – XP2 FPGA, 5k logic elements, 172 I/O, 256-LBGA
The LFXP2-5E-7FT256C is a LatticeXP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This device pairs a LUT-based FPGA fabric with non-volatile flash configuration and embedded resources to enable instant-on, reconfigurable logic in a compact 256-ball ftBGA package.
With 5,000 logic elements, 172 general-purpose I/O, and 169,984 bits of on-chip RAM, the device targets cost-sensitive commercial applications that need moderate logic density, flexible I/O and on-chip memory in a surface-mount 256-LBGA (17×17) footprint. It operates from a 1.14 V to 1.26 V supply and is rated for commercial temperatures (0 °C to 85 °C).
Key Features
- flexiFLASH Architecture Instant-on, single-chip flash configuration with FlashBAK and Serial TAG memory for on‑chip non-volatile configuration storage and design security.
- Live Update & Secure Configuration Supports TransFR live update technology, dual-boot with external SPI and secure updates with 128‑bit AES encryption as described for the LatticeXP2 family.
- Logic & DSP Resources Contains 5,000 logic elements and includes sysDSP resources (family-level support: multiple sysDSP blocks and 18×18 multipliers) for high-performance multiply-accumulate functions.
- Embedded Memory 169,984 bits of on-chip RAM plus distributed memory resources for buffering, state machines and small data structures.
- Flexible I/O 172 I/O pins with family-level sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and a range of differential standards including LVDS and LVPECL.
- Clocking & Interfaces Family support for up to four analog PLLs, pre-engineered source-synchronous interfaces (DDR/DDR2 up to 200 MHz, 7:1 LVDS for displays), and common bus interfaces such as XGMII.
- Package & Supply Surface-mount 256-LBGA (supplier device package: 256-FTBGA, 17×17 mm) and a nominal supply range of 1.14 V to 1.26 V.
- Compliance RoHS compliant; commercially graded with an operating temperature range of 0 °C to 85 °C.
Typical Applications
- Display and Video Interfaces Use pre-engineered 7:1 LVDS and source-synchronous interfaces for panel link and display bridge applications.
- Memory and Interface Bridging Implement DDR/DDR2 interface glue logic and protocol adaptation with on-chip RAM and PLL-based clocking.
- Communications and Networking Provide moderate-density packet processing, protocol offload or interface conversion leveraging sysDSP blocks and flexible I/O standards.
- Embedded Control and Prototyping Integrate custom control logic, sensor aggregation and user interface management using 5,000 logic elements and abundant I/O.
Unique Advantages
- Instant-on, non-volatile configuration: Flash-based flexiFLASH removes the need for external volatile configuration storage and supports immediate startup.
- Secure and flexible updates: Live Update with TransFR and 128-bit AES encryption enable secure, field-updateable designs with dual-boot capability.
- Balanced compute and memory: 5,000 logic elements combined with 169,984 bits of on-chip RAM and sysDSP resources provide a versatile mix for control, interface and DSP tasks.
- Wide I/O flexibility: A broad set of supported I/O standards lets a single device interface to many common peripherals and signaling types.
- Compact package: 256-ball ftBGA (17×17 mm) offers a small PCB footprint for space-constrained commercial products.
- Design ecosystem support: Part of the LatticeXP2 family with family-level IP and design tool support for faster development and migration.
Why Choose LFXP2-5E-7FT256C?
The LFXP2-5E-7FT256C delivers a practical balance of logic density, on-chip memory and flexible I/O in a compact, commercial-grade ftBGA package. It is suitable for designers who need instant-on flash configuration, secure update capability and a moderate set of DSP and memory resources without external configuration complexity.
As a member of the LatticeXP2 family, this device benefits from family-level features such as flexiFLASH architecture, Live Update technologies and pre-engineered interfaces, enabling scalable designs and access to Lattice-provided IP and tools for efficient implementation.
Request a quote or submit an inquiry to get pricing and availability for the LFXP2-5E-7FT256C and to discuss how it fits your next design.

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