LFXP2-5E-6TN144I

The LFXP2-5E-6TN144I is a Lattice XP2 family FPGA in a 144-pin LQFP package designed for industrial embedded applications. It combines a flash-based flexiFLASH architecture with reconfigurable FPGA fabric to enable instant-on, secure updates and on-chip non-volatile configuration.

Targeted at industrial and embedded designs, this device delivers approximately 5,000 logic elements, flexible I/O, and embedded memory suited for control, interface bridging, and secure firmware-update applications while operating across a broad industrial temperature range.

Key Features

• flexiFLASH Architecture Instant-on flash-based configuration with on-chip FlashBAK memory and design security features; supports infinitely reconfigurable single-chip deployments.
• Live Update and Security Supports Live Update technologies including TransFR with secure update capability and 128-bit AES encryption for protected firmware image management and dual-boot options.
• Logic Capacity Approximately 5,000 logic elements for implementing medium-complexity control, glue logic, and peripheral integration tasks.
• Embedded Memory Total on-chip RAM of 169,984 bits (approximately 170 Kbits) for distributed and embedded storage needs.
• sysDSP and Multipliers Integrated sysDSP blocks and 18×18 multiplier resources (family-level support) for multiply-accumulate and DSP-oriented processing tasks.
• Flexible I/O Up to 100 user I/Os in the 144-pin package with family-level support for a wide range of I/O standards and source-synchronous interfaces.
• Clocking On-chip PLLs for clock multiply/divide and phase shifting, enabling tailored clocking architectures for embedded systems.
• Package and Mounting 144-LQFP package case (supplier device package: 144-TQFP, 20×20) optimized for surface-mount assembly.
• Power and Temperature Operates from 1.14 V to 1.26 V and is specified for industrial temperature operation from −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Control logic, sensor aggregation and interface bridging where industrial temperature range and on-chip non-volatile configuration are required.
• Secure Field Upgrades — Embedded devices that require secure, encrypted firmware image updates and dual-boot capability for serviceability.
• Interface and Protocol Bridging — Implement pre-engineered source-synchronous interfaces and protocol glue logic in a compact LQFP package.
• DSP-Enhanced Embedded Systems — Use sysDSP blocks and hardware multipliers for localized signal processing, filtering, and compute tasks within control systems.

Unique Advantages

• Instant-on Non-Volatile Configuration: Flash-based flexiFLASH provides on-chip configuration without external volatile storage, simplifying board-level design.
• Secure Update Path: Built-in Live Update and AES encryption support enable protected firmware lifecycle management for fielded devices.
• Balanced Integration: Combines ~5,000 logic elements with ~170 Kbits of embedded RAM and DSP resources, reducing external component count for mid-range designs.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and supplied in a standard surface-mount LQFP package suited to industrial assemblies.
• Low-Voltage Operation: Narrow supply range around nominal 1.2 V supports low-power system architectures and consistent device behavior.
• Compact Package with Generous I/O: 144-pin LQFP delivers 100 I/Os for peripheral connectivity in space-constrained designs.

Why Choose LFXP2-5E-6TN144I?

The LFXP2-5E-6TN144I positions itself as a practical, flash-configured FPGA for industrial embedded systems that need secure, instant-on configurability and a balance of logic, memory, and DSP capability. Its combination of on-chip flash, DSP resources, flexible I/O and industrial temperature rating makes it suitable for designs that require field-upgradeability, integrated DSP acceleration, and reliable operation across demanding environments.

Engineers and procurement teams will find this device appropriate for mid-complexity designs where reducing external BOM, enabling secure firmware management, and maintaining operation over a wide temperature range are priorities.

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