LFXP2-5E-6M132I

The LFXP2-5E-6M132I is a LatticeXP2 family Field Programmable Gate Array (FPGA) featuring flexiFLASH architecture and on-chip non-volatile configuration. This device delivers instant-on reconfigurability, integrated embedded memory and DSP resources, and a compact 132-ball csBGA package targeted at industrial embedded designs.

Designed for mid-range logic and mixed-signal interfacing, the part is suited for applications that require in-system updates, secure boot options and a robust operating temperature range. Its combination of logic elements, embedded RAM and dedicated DSP blocks simplifies system integration for communications, display and industrial control use cases.

Key Features

• Core Logic  Approximately 5,000 logic elements providing mid-range programmable fabric for control, glue logic and custom IP implementation.
• Embedded Memory  Approximately 166 Kbits (169,984 bits) of on-chip RAM plus distributed RAM options for low-latency data storage and buffering.
• sysDSP & Multipliers  sysDSP blocks tailored for high-performance multiply–accumulate operations; the XP2-5 device includes three sysDSP blocks and twelve 18×18 multipliers for DSP acceleration.
• Flexible I/O  Package provides 86 user I/Os (132-ball csBGA footprint); sysIO buffer supports LVCMOS, LVTTL, SSTL, HSTL, PCI and a variety of differential standards including LVDS, Bus‑LVDS, MLVDS, LVPECL and RSDS as documented for the family.
• Pre‑engineered Source‑Synchronous Interfaces  Family support for DDR/DDR2 up to 200 MHz, 7:1 LVDS display links and XGMII simplifies high-speed memory and display interfacing.
• Configuration & Security  flexiFLASH architecture enables instant-on, infinitely reconfigurable single-chip operation with FlashBAK and Serial TAG memory; Live Update features include TransFR technology and secure updates with 128-bit AES encryption and dual-boot support.
• Clocking  sysCLOCK PLLs provide clock multiply/divide and phase shifting capabilities (family supports analog PLL resources).
• Power & Supply  Operates from a core voltage range of 1.14 V to 1.26 V, supporting standard low-voltage FPGA power domains.
• Package & Mounting  132-LFBGA / csBGA (8 × 8 mm) surface-mount package optimized for space-constrained boards; supplier device package listed as 132-CSBGA (8×8).
• Industrial Temperature Range  Specified for operation from −40 °C to 100 °C for industrial applications.
• Standards & System Support  Family-level system support includes IEEE 1149.1 and IEEE 1532 compliance and an on-chip oscillator for initialization and general use.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control  Reconfigurable control logic, sensor interfacing and field-updatable functions benefit from instant-on flexiFLASH and the −40 °C to 100 °C operating range.
• Display & Video Systems  Pre‑engineered 7:1 LVDS and source-synchronous interfaces support display link implementations and timing-critical video paths.
• Memory Interface & Bridge  DDR/DDR2 interface support and on-chip PLL resources allow use as memory controllers, interface bridges or protocol adaptors.
• DSP & Signal Processing  sysDSP blocks and dedicated 18×18 multipliers accelerate multiply–accumulate workloads for communications and real-time processing tasks.

Unique Advantages

• Instant‑on non‑volatile architecture: flexiFLASH enables single-chip, instantly active designs without external configuration memory.
• Integrated DSP resources: sysDSP blocks and multiple 18×18 multipliers reduce the need for external DSP components for common signal-processing tasks.
• Secure Live Update: TransFR technology with 128‑bit AES encryption and dual-boot support enables secure in-field firmware updates and rollback options.
• Broad I/O flexibility: Support for a wide set of single‑ended and differential standards simplifies interface design across sensors, memory and high‑speed links.
• Industrial robustness: Specified industrial temperature range and surface-mount csBGA package support reliable deployment in harsh environments.
• Compact, mid‑range integration: 5,000 logic elements, on-chip RAM and 86 I/Os deliver a balance of integration and board-area efficiency for embedded systems.

Why Choose LFXP2-5E-6M132I?

The LFXP2-5E-6M132I positions itself as a compact, mid-density FPGA with non-volatile instant-on capability, on-chip memory and DSP acceleration. Its combination of 5,000 logic elements, dedicated multipliers, flexible I/O standards and secure Live Update features makes it well suited for industrial embedded systems, display interfaces and memory bridge applications that require field reconfiguration and robust operation.

Engineers and procurement teams seeking a solution that balances programmable logic density, embedded memory and in-field update security will find this device attractive for designs that must scale across product variants while maintaining a small board footprint and industrial temperature resilience.

Request a quote or submit an RFQ to get pricing and availability for LFXP2-5E-6M132I.