LFXP2-5E-6FTN256C

The LFXP2-5E-6FTN256C is a flash-based XP2 Field Programmable Gate Array (FPGA) in a 256-ball ftBGA package, designed for commercial embedded applications. Built on the LatticeXP2 flexiFLASH architecture, it delivers instant-on, reconfigurable FPGA capability with integrated memory and DSP resources for interface bridging, signal processing and custom logic implementation.

Key Features

• Core Capacity — 5,000 logic elements (LUT-based fabric) for implementing custom logic, glue functions and moderate-density designs.
• On‑Chip Memory — Approximately 170 Kbits of embedded memory (total on-chip RAM bits: 169,984) suitable for buffering, small FIFOs and local data storage.
• DSP Resources — Family sysDSP blocks and 18×18 multipliers are available in the LatticeXP2 family to accelerate multiply-accumulate workloads and signal processing tasks.
• I/O Flexibility — 172 user I/Os supporting a wide range of interfaces; package options and I/O-rich pinout enable source-synchronous and high-speed interface implementations.
• Configuration & Security — flexiFLASH architecture with instant-on, reconfigurability and family-level features such as dual-boot and secure update capabilities (AES-128 encryption supported by family).
• Power — Operates from a low supply range of 1.14 V to 1.26 V, compatible with 1.2 V system rails.
• Package & Mounting — 256-ball ftBGA (17 × 17 mm) surface-mount package; compact footprint for space-constrained boards.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature suitable for commercial embedded systems.
• Compliance — RoHS compliant.

Typical Applications

• Consumer Electronics — Custom logic, display bridging and peripheral aggregation where compact package and instant-on reconfigurability speed product feature updates.
• Communications & Networking — Protocol conversion, interface bridging and pre-engineered source-synchronous interfaces leveraging the device’s flexible I/O and memory resources.
• Embedded Control & Signal Processing — DSP-accelerated tasks and moderate-rate data processing using the on-chip multipliers and embedded memory.
• Prototyping & Systems Integration — Rapid hardware iteration and field updates using flash-based configuration and dual-boot/secure update family features.

Unique Advantages

• Instant-on, reconfigurable flash architecture: flexiFLASH-based configuration enables immediate startup and in-field reprogramming without external volatile configuration storage.
• Balanced integration of logic, memory and DSP: 5,000 logic elements combined with approximately 170 Kbits of embedded RAM and family DSP blocks provide a compact, capable platform for mid-density designs.
• Flexible I/O in a compact package: 172 I/Os in a 256-ball ftBGA (17×17 mm) package reduce board area while supporting varied interface standards and source-synchronous designs.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) for compatibility with 1.2 V power domains common in modern systems.
• Commercial-grade operating range: Rated 0 °C to 85 °C and RoHS compliant for mainstream embedded and consumer deployments.

Why Choose LFXP2-5E-6FTN256C?

The LFXP2-5E-6FTN256C provides a practical balance of logic capacity, on-chip memory and DSP capability in a compact 256-ball ftBGA package. Its flash-based LatticeXP2 architecture enables instant-on operation and field reconfiguration, making it a strong choice for commercial embedded systems that require flexible I/O, secure updates and moderate signal-processing resources.

This device is suited to engineers and designers implementing interface bridging, display and communications logic, or custom control functions who value a compact footprint, low-voltage operation and the ability to update firmware in the field.

Request a quote or submit an inquiry to check availability, pricing and lead times for the LFXP2-5E-6FTN256C. Our team can provide procurement details and volume pricing information.