LFXP2-8E-7FT256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA

Quantity 1,379 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-7FT256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA

The LFXP2-8E-7FT256C is a LatticeXP2-family FPGA combining LUT-based programmable logic with non-volatile flash configuration. This device provides instant-on reconfigurability, on-chip configuration storage and a high I/O count, making it suitable for embedded designs that require configurable logic, secure field updates and flexible I/O integration.

Targeted at commercial-grade applications, the device delivers approximately 8,000 logic elements, around 226 Kbits of on-chip RAM and 201 I/O pins in a compact 256-ball ftBGA package.

Key Features

  • Core Logic  Approximately 8,000 logic elements (LUT-based FPGA fabric) for implementing custom control, signal processing and glue-logic functions.
  • On-chip Memory  Approximately 226 Kbits of on-chip RAM to support embedded data buffering, state storage and small SRAM-based functions.
  • Non-volatile Configuration (flexiFLASH)  Family-level flexiFLASH architecture provides instant-on, infinitely reconfigurable single-chip flash configuration, FlashBAK and Serial TAG memory for stored configurations and design security.
  • Live Update & Security  Family-level Live Update support (TransFR) enables secure updates; includes 128-bit AES encryption and dual-boot capability with external SPI.
  • DSP Capability  XP2-8 family devices include sysDSP resources (XP2-8: 4 sysDSP blocks and 16 18×18 multipliers per the family table) for multiply–accumulate and mid-range signal-processing tasks.
  • I/O and Interfaces  201 available I/O pins accommodate multi-channel digital interfaces, source-synchronous and high-speed signaling supported by the family architecture.
  • Power  Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
  • Package & Mounting  Surface-mount 256-ball LBGA (supplier package: 256-FTBGA, 17×17 mm) for space-efficient board integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial electronic systems.
  • Regulatory  RoHS compliant.

Typical Applications

  • Embedded Control & Glue Logic  Implement custom control, protocol bridging and board-level sequencing using the device’s logic elements and abundant I/O.
  • Secure Field Update Systems  Use the family’s Live Update and 128-bit AES support to deploy and protect firmware or configuration updates.
  • Mid-range DSP and Signal Processing  Leverage the sysDSP blocks and 18×18 multipliers for acceleration of arithmetic-intensive tasks and real-time processing.
  • Display and Source-Synchronous Interfaces  The family’s pre-engineered source-synchronous interface support and high I/O count suit display drivers and high-speed parallel interfaces.

Unique Advantages

  • Instant-on, non‑volatile configuration: Flash-based flexiFLASH architecture enables immediate startup without external configuration memory.
  • Secure update capability: TransFR Live Update and 128‑bit AES encryption allow encrypted, managed field updates and dual-boot configurations.
  • Balanced compute and memory: ~8,000 logic elements paired with ~226 Kbits of on-chip RAM offers condensed logic+memory resources for mid-density designs.
  • High I/O density in a compact package: 201 I/Os in a 256-ball ftBGA (17×17 mm) footprint simplifies routing for multi-interface designs while minimizing board area.
  • Low-voltage core operation: Narrow VCC range (1.14–1.26 V) supports modern low-voltage system architectures.
  • Commercial-grade reliability: Specified operation from 0 °C to 85 °C for standard commercial applications and RoHS compliance for global deployment.

Why Choose LFXP2-8E-7FT256C?

The LFXP2-8E-7FT256C positions itself as a compact, flash-configurable FPGA option for commercial embedded designs that need reconfigurable logic, secure update capability and a high count of I/Os in a small footprint. It offers a practical balance of logic resources, on-chip RAM and sysDSP multipliers for mid-density signal processing and control tasks.

Designed within the LatticeXP2 family, this device benefits from family-level features and tooling support that simplify design implementation, configuration management and IP reuse—helping teams deliver scalable, maintainable designs with secure update paths.

Request a quote or submit an inquiry to get pricing and availability for LFXP2-8E-7FT256C for your next design.

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