LFXP2-8E-7FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA |
|---|---|
| Quantity | 1,379 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-7FT256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA
The LFXP2-8E-7FT256C is a LatticeXP2-family FPGA combining LUT-based programmable logic with non-volatile flash configuration. This device provides instant-on reconfigurability, on-chip configuration storage and a high I/O count, making it suitable for embedded designs that require configurable logic, secure field updates and flexible I/O integration.
Targeted at commercial-grade applications, the device delivers approximately 8,000 logic elements, around 226 Kbits of on-chip RAM and 201 I/O pins in a compact 256-ball ftBGA package.
Key Features
- Core Logic Approximately 8,000 logic elements (LUT-based FPGA fabric) for implementing custom control, signal processing and glue-logic functions.
- On-chip Memory Approximately 226 Kbits of on-chip RAM to support embedded data buffering, state storage and small SRAM-based functions.
- Non-volatile Configuration (flexiFLASH) Family-level flexiFLASH architecture provides instant-on, infinitely reconfigurable single-chip flash configuration, FlashBAK and Serial TAG memory for stored configurations and design security.
- Live Update & Security Family-level Live Update support (TransFR) enables secure updates; includes 128-bit AES encryption and dual-boot capability with external SPI.
- DSP Capability XP2-8 family devices include sysDSP resources (XP2-8: 4 sysDSP blocks and 16 18×18 multipliers per the family table) for multiply–accumulate and mid-range signal-processing tasks.
- I/O and Interfaces 201 available I/O pins accommodate multi-channel digital interfaces, source-synchronous and high-speed signaling supported by the family architecture.
- Power Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
- Package & Mounting Surface-mount 256-ball LBGA (supplier package: 256-FTBGA, 17×17 mm) for space-efficient board integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial electronic systems.
- Regulatory RoHS compliant.
Typical Applications
- Embedded Control & Glue Logic Implement custom control, protocol bridging and board-level sequencing using the device’s logic elements and abundant I/O.
- Secure Field Update Systems Use the family’s Live Update and 128-bit AES support to deploy and protect firmware or configuration updates.
- Mid-range DSP and Signal Processing Leverage the sysDSP blocks and 18×18 multipliers for acceleration of arithmetic-intensive tasks and real-time processing.
- Display and Source-Synchronous Interfaces The family’s pre-engineered source-synchronous interface support and high I/O count suit display drivers and high-speed parallel interfaces.
Unique Advantages
- Instant-on, non‑volatile configuration: Flash-based flexiFLASH architecture enables immediate startup without external configuration memory.
- Secure update capability: TransFR Live Update and 128‑bit AES encryption allow encrypted, managed field updates and dual-boot configurations.
- Balanced compute and memory: ~8,000 logic elements paired with ~226 Kbits of on-chip RAM offers condensed logic+memory resources for mid-density designs.
- High I/O density in a compact package: 201 I/Os in a 256-ball ftBGA (17×17 mm) footprint simplifies routing for multi-interface designs while minimizing board area.
- Low-voltage core operation: Narrow VCC range (1.14–1.26 V) supports modern low-voltage system architectures.
- Commercial-grade reliability: Specified operation from 0 °C to 85 °C for standard commercial applications and RoHS compliance for global deployment.
Why Choose LFXP2-8E-7FT256C?
The LFXP2-8E-7FT256C positions itself as a compact, flash-configurable FPGA option for commercial embedded designs that need reconfigurable logic, secure update capability and a high count of I/Os in a small footprint. It offers a practical balance of logic resources, on-chip RAM and sysDSP multipliers for mid-density signal processing and control tasks.
Designed within the LatticeXP2 family, this device benefits from family-level features and tooling support that simplify design implementation, configuration management and IP reuse—helping teams deliver scalable, maintainable designs with secure update paths.
Request a quote or submit an inquiry to get pricing and availability for LFXP2-8E-7FT256C for your next design.

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