LFXP20C-3FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 955 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-3FN256C – XP Field Programmable Gate Array (FPGA) IC, 188 I/O, 20,000 Logic Elements, 256-BGA
The LFXP20C-3FN256C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It combines on-chip logic, embedded block RAM and flexible I/O in a compact 256-ball fpBGA (17 × 17 mm) package targeted at commercial embedded and consumer applications.
Designed for instant-on operation and in-field reconfiguration, this device delivers 20,000 logic elements, approximately 396 Kbits (405,504 bits) of embedded RAM, and 188 I/Os, making it suitable for applications that require secure configuration, fast startup and adaptable system-level interfaces.
Key Features
- Core Capacity 20,000 logic elements (cells) suitable for mid-density logic integration and system glue logic.
- Embedded Memory Approximately 396 Kbits (405,504 bits) of on-chip RAM for data buffering, state storage and local memory needs.
- I/O Flexibility 188 I/Os with a programmable sysIO™ buffer supporting a broad range of interface standards listed for the LatticeXP family, enabling mixed-signal and high-speed interconnects.
- Non‑volatile, Instant‑On Family-level ispXP™ non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory.
- In‑Field Reconfiguration TransFR™ reconfiguration enables logic updates while the system operates, supporting rapid field upgrades and iterative development.
- Low Power Modes Sleep mode capability (family-level) allows significant static current reduction for power-sensitive designs.
- Clocking Up to four analog PLLs (family-level) for clock multiplication, division and phase shifting to support diverse timing architectures.
- Package & Mounting 256-ball fpBGA (256-FPBGA, 17 × 17 mm), surface-mount package optimized for compact PCB designs.
- Electrical & Environmental Voltage supply range: 1.71 V to 3.465 V; operating temperature: 0 °C to 85 °C; commercial grade and RoHS compliant.
Typical Applications
- Embedded Control Implement control sequencing, protocol bridging and system glue logic where instant-on and reconfigurability speed time-to-market.
- Consumer & Commercial Electronics User interface control, peripheral aggregation and mixed-signal interfacing using flexible I/O standards and on-chip memory.
- Communications & Networking Mid-density packet processing, protocol adaptors and interface conversion leveraging plentiful I/Os and configurable PLLs.
- Instrumentation & Test Signal conditioning front-ends and custom data handling where in-field updates and embedded RAM simplify iterative development.
Unique Advantages
- Instant-on, non-volatile architecture: Eliminates external configuration memory and enables microsecond startup for faster system availability.
- Field upgradability: TransFR reconfiguration supports in-system logic updates without removing the device or halting overall system operation.
- Compact, high‑I/O package: 256-ball fpBGA (17 × 17 mm) provides 188 I/Os in a space-efficient surface-mount footprint to reduce overall BOM and PCB area.
- Integrated memory for local buffering: Approximately 396 Kbits of embedded RAM reduces dependency on external memory for many mid-range designs.
- Flexible clocking and interfaces: Up to four PLLs and a broad family-level sysIO feature set allow tight timing control and support for diverse serial/parallel interfaces.
- Commercial-grade, RoHS compliant: Rated for 0 °C to 85 °C with RoHS compliance for standard commercial deployments and supply-chain compatibility.
Why Choose LFXP20C-3FN256C?
The LFXP20C-3FN256C pairs mid-range logic capacity with substantial embedded memory and a high I/O count in a compact 256-ball fpBGA package, offering a balanced solution for commercial embedded systems that require instant-on capability and secure, non-volatile configuration. Its family-level features—non-volatile instant-on, in-field reconfiguration, programmable I/O standards and multi-PLL support—provide design flexibility while minimizing external components.
This device suits design teams building adaptable, compact systems that benefit from rapid startup, field-upgradable logic and integrated memory resources, backed by LatticeXP family features and RoHS compliance for standard commercial applications.
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