LFXP20C-3FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 955 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-3FN256C – XP Field Programmable Gate Array (FPGA) IC, 188 I/O, 20,000 Logic Elements, 256-BGA

The LFXP20C-3FN256C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It combines on-chip logic, embedded block RAM and flexible I/O in a compact 256-ball fpBGA (17 × 17 mm) package targeted at commercial embedded and consumer applications.

Designed for instant-on operation and in-field reconfiguration, this device delivers 20,000 logic elements, approximately 396 Kbits (405,504 bits) of embedded RAM, and 188 I/Os, making it suitable for applications that require secure configuration, fast startup and adaptable system-level interfaces.

Key Features

  • Core Capacity  20,000 logic elements (cells) suitable for mid-density logic integration and system glue logic.
  • Embedded Memory  Approximately 396 Kbits (405,504 bits) of on-chip RAM for data buffering, state storage and local memory needs.
  • I/O Flexibility  188 I/Os with a programmable sysIO™ buffer supporting a broad range of interface standards listed for the LatticeXP family, enabling mixed-signal and high-speed interconnects.
  • Non‑volatile, Instant‑On  Family-level ispXP™ non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory.
  • In‑Field Reconfiguration  TransFR™ reconfiguration enables logic updates while the system operates, supporting rapid field upgrades and iterative development.
  • Low Power Modes  Sleep mode capability (family-level) allows significant static current reduction for power-sensitive designs.
  • Clocking  Up to four analog PLLs (family-level) for clock multiplication, division and phase shifting to support diverse timing architectures.
  • Package & Mounting  256-ball fpBGA (256-FPBGA, 17 × 17 mm), surface-mount package optimized for compact PCB designs.
  • Electrical & Environmental  Voltage supply range: 1.71 V to 3.465 V; operating temperature: 0 °C to 85 °C; commercial grade and RoHS compliant.

Typical Applications

  • Embedded Control  Implement control sequencing, protocol bridging and system glue logic where instant-on and reconfigurability speed time-to-market.
  • Consumer & Commercial Electronics  User interface control, peripheral aggregation and mixed-signal interfacing using flexible I/O standards and on-chip memory.
  • Communications & Networking  Mid-density packet processing, protocol adaptors and interface conversion leveraging plentiful I/Os and configurable PLLs.
  • Instrumentation & Test  Signal conditioning front-ends and custom data handling where in-field updates and embedded RAM simplify iterative development.

Unique Advantages

  • Instant-on, non-volatile architecture: Eliminates external configuration memory and enables microsecond startup for faster system availability.
  • Field upgradability: TransFR reconfiguration supports in-system logic updates without removing the device or halting overall system operation.
  • Compact, high‑I/O package: 256-ball fpBGA (17 × 17 mm) provides 188 I/Os in a space-efficient surface-mount footprint to reduce overall BOM and PCB area.
  • Integrated memory for local buffering: Approximately 396 Kbits of embedded RAM reduces dependency on external memory for many mid-range designs.
  • Flexible clocking and interfaces: Up to four PLLs and a broad family-level sysIO feature set allow tight timing control and support for diverse serial/parallel interfaces.
  • Commercial-grade, RoHS compliant: Rated for 0 °C to 85 °C with RoHS compliance for standard commercial deployments and supply-chain compatibility.

Why Choose LFXP20C-3FN256C?

The LFXP20C-3FN256C pairs mid-range logic capacity with substantial embedded memory and a high I/O count in a compact 256-ball fpBGA package, offering a balanced solution for commercial embedded systems that require instant-on capability and secure, non-volatile configuration. Its family-level features—non-volatile instant-on, in-field reconfiguration, programmable I/O standards and multi-PLL support—provide design flexibility while minimizing external components.

This device suits design teams building adaptable, compact systems that benefit from rapid startup, field-upgradable logic and integrated memory resources, backed by LatticeXP family features and RoHS compliance for standard commercial applications.

Request a quote or submit an inquiry to receive pricing, lead time and availability information for the LFXP20C-3FN256C.

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