LFXP20C-3FN256I

The LFXP20C-3FN256I is a Lattice Semiconductor XP family FPGA delivering non-volatile, infinitely reconfigurable logic in a 256-ball fpBGA (17 × 17 mm) package. This industrial-grade device integrates approximately 20,000 logic elements and roughly 0.405 Mbits of on-chip RAM, with 188 user I/Os and a wide VCC operating window of 1.71 V to 3.465 V.

Designed for systems that require instant-on configuration, in-field reconfiguration and industrial temperature operation (−40 °C to 100 °C), the device targets embedded designs needing flexible I/O, integrated memory resources and on-chip clock management.

Key Features

• Core Architecture  Non-volatile LatticeXP family FPGA technology with infinitely reconfigurable logic and instant-on configuration.
• Logic Capacity  Approximately 20,000 logic elements supported by 2,464 logic blocks, enabling medium-density combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.405 Mbits of on-chip RAM for distributed and block memory use within designs.
• I/O and Voltage Flexibility  188 I/O pins and a supply range of 1.71 V to 3.465 V; the LatticeXP family supports a wide range of I/O standards for interface flexibility.
• Clocking and Timing  On-device analog PLLs for clock multiply, divide and phase shifting to support complex timing requirements.
• Configuration and Security  Non-volatile configuration with no external configuration memory required, enabling rapid power-up and enhanced bitstream security.
• Power and Low-Power Modes  Sleep mode capability to reduce static current draw significantly for lower standby power.
• Package and Thermal  256-FPBGA (17 × 17 mm) surface-mount package rated for industrial operation from −40 °C to 100 °C.
• Compliance  RoHS compliant for environmental sustainability.

Typical Applications

• Instant-on embedded systems  Use the non-volatile, instant-on FPGA for systems that require immediate operation after power-up without external configuration memory.
• In-field reconfigurable designs  Implement logic updates and feature changes in deployed systems using the device’s reconfiguration capabilities.
• Interfaces and protocol bridging  Leverage 188 I/Os and flexible I/O standards to implement protocol conversion, bus bridging and custom interface logic.
• Low-power standby systems  Employ the sleep mode to minimize static current in standby or battery-backed applications.
• Memory-controller and DDR support  Use embedded memory and on-chip clocking resources to implement memory interfaces and buffering in system designs.

Unique Advantages

• Non-volatile instant-on operation: Eliminates the need for external configuration memory and shortens system boot time.
• Industrial temperature rating: Designed for −40 °C to 100 °C operation to meet industrial environment requirements.
• Mid-range integration: Approximately 20k logic elements with 188 I/Os and embedded RAM reduce external component count and simplify board design.
• Flexible power support: Wide supply range (1.71 V–3.465 V) accommodates multiple system voltage domains.
• On-chip clock management: Integrated PLLs enable robust clocking schemes without external components.
• RoHS compliant: Meets current environmental regulatory requirements for lead-free assemblies.

Why Choose LFXP20C-3FN256I?

The LFXP20C-3FN256I offers a compact, industrial-grade FPGA solution for designs demanding non-volatile configuration, flexible I/O and a mid-range logic and memory footprint. Its instant-on behavior, sleep mode and on-chip clocking make it suitable for embedded systems where fast power-up, energy efficiency and reconfigurability are important.

Engineers seeking a field-programmable, RoHS-compliant device with available design tool and IP support from the LatticeXP family will find this part well-suited to applications requiring a balance of logic capacity, I/O density and industrial temperature performance.

Request a quote or submit an inquiry today to evaluate LFXP20C-3FN256I for your next design.