LFXP20C-3FN484I

The LFXP20C-3FN484I is a LatticeXP family field programmable gate array (FPGA) IC offering 20,000 logic elements in a non-volatile, infinitely reconfigurable architecture. Designed for industrial-grade systems, it delivers high I/O density, on-chip embedded memory, and flexible voltage operation for system-level logic, high-speed I/O interfacing, and in-field reconfiguration.

This device combines instant-on non-volatile configuration, sleep-mode power reduction, and in-system reconfiguration capabilities to support robust embedded and industrial applications that require fast startup and reliable, secure configuration.

Key Features

• Core Capacity — 20,000 logic elements with a total of 2,464 logic blocks, enabling implementation of complex logic and control functions.
• On-chip Memory — Approximately 0.405 Mbits of total RAM bits for embedded and distributed memory resources to support data buffering and local storage.
• High I/O Density — Up to 340 user I/Os to support dense peripheral and interface routing in the 484-ball FPBGA package.
• Non-volatile, Instant-on Configuration — Built-in non-volatile configuration for instant-on behavior and no requirement for external configuration memory.
• In-field Reconfiguration — Supports TransFR™ reconfiguration for updating logic while the system is operating and JTAG/system configuration programming.
• Power Management — Sleep mode support allows significant static current reduction for lower-power standby operation.
• Flexible I/O Buffering — Programmable sysIO™ buffers supporting a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
• Dedicated Memory Interface — Implements dedicated DDR memory interfaces up to DDR333 (166 MHz) for external memory support.
• Clocking — Up to four analog PLLs per device for clock multiply, divide and phase shifting.
• Industrial-grade Operation — Rated for operation from −40 °C to 100 °C and supplied in a 484-FPBGA (23 × 23 mm) package.
• Wide Voltage Range — Supports core and I/O operation across a 1.71 V to 3.465 V supply range.
• Package — 484-ball BGA in a 23 × 23 mm footprint for surface-mount board integration.

Typical Applications

• Industrial Control — Implement motor control, PLC logic, and coordination functions leveraging the device's industrial temperature rating and high I/O count.
• High-speed Interface Bridging — Use the programmable sysIO buffers and up to 340 I/Os to implement protocol conversion, bus bridging and complex interface logic.
• Memory Interface and Buffering — Deploy DDR333-compatible interfaces and on-chip RAM for buffering and memory controller logic in embedded systems.
• Field-updatable Systems — Apply TransFR in-field reconfiguration to update functionality or fix firmware while the system remains operational.

Unique Advantages

• Instant-on Non-Volatile Architecture — Eliminates the need for external configuration memory and provides secure, fast startup behavior measured in microseconds.
• High Integration — Combines 20,000 logic elements, substantial embedded RAM, and up to 340 I/Os in a single 484-BBGA package to reduce BOM and board area.
• Flexible Interface Support — Wide-ranging programmable I/O standards enable compatibility with numerous legacy and modern signaling options without external level-shifting.
• Field Reconfigurability — Supports in-field logic updates to extend product life, add features, or correct behavior without hardware replacement.
• Industrial Reliability — Specified for −40 °C to 100 °C operation to meet demanding environmental requirements for industrial deployments.
• Power-efficient Standby — Sleep mode delivers substantial static current reduction for energy-aware designs.

Why Choose LFXP20C-3FN484I?

The LFXP20C-3FN484I positions itself as a versatile, industrial-grade FPGA solution combining non-volatile instant-on configuration with substantial logic and memory resources. Its high I/O count, flexible I/O standards, and dedicated DDR support make it suitable for systems that require dense interfacing and reliable field updates.

Designers targeting industrial automation, embedded systems, and interface-rich applications will find the device’s combination of integration, configurable I/O, and in-field reconfiguration capabilities beneficial for reducing system complexity and extending product lifecycle while maintaining robust environmental performance.

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