LFXP20C-3FN484C

The LFXP20C-3FN484C is a non-volatile LatticeXP family FPGA offering approximately 20,000 logic elements, roughly 0.4 Mbits of on-chip RAM (405,504 bits) and up to 340 I/O in a 484-ball BGA (23 × 23 mm) package. Designed for commercial-grade, surface-mount applications, this device combines embedded memory, high I/O density and reconfigurable logic to support system-level functions such as interface bridging, memory controllers and I/O aggregation.

Its architecture emphasizes fast startup and in-field flexibility—features that simplify designs where instant availability, secure configuration and runtime updates are needed.

Key Features

• Non-volatile, instant-on architecture – Powers up in microseconds with no external configuration memory required, providing secure on-board configuration.
• In-field reconfiguration (TransFR™) – Supports runtime updates to SRAM-based logic while the system operates, enabling field upgrades and iterative feature deployment.
• Logic and memory resources – Approximately 20,000 logic elements and 405,504 bits of total on-chip RAM (distributed and block memory) for implementation of complex functions and buffering.
• High I/O capacity – Up to 340 user I/Os to support dense peripheral and bus interfacing in a compact 484-BBGA package.
• Flexible I/O standards – Programmable sysIO™ buffers support a wide range of interfaces listed in the device family data, enabling integration with LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI and other signaling standards.
• Dedicated memory interface – Implements interfaces up to DDR333 for direct connection to external DDR memory devices.
• Clock management – Up to four analog PLLs per device for clock multiplication, division and phase shifting to meet system timing requirements.
• Low-power modes – Sleep mode capability that can reduce static current substantially to support low-power system states.
• Voltage and temperature – Operates across a supply range of 1.71 V to 3.465 V and is specified for commercial operating temperatures (0 °C to 85 °C).
• Package and mounting – 484-ball FPBGA (23 × 23 mm) surface-mount package for compact board-level integration; RoHS compliant.

Typical Applications

• High-density I/O aggregation – Consolidate multiple peripheral interfaces or sensors into a single programmable device using the device's large I/O count and flexible sysIO buffers.
• Memory interface controllers – Implement DDR333-compatible memory controllers and related timing logic leveraging the dedicated DDR support and multiple PLLs.
• Protocol bridging and communications – Bridge disparate signaling standards and implement custom protocol logic using the FPGA's reconfigurable fabric and wide I/O standard support.
• Embedded system glue logic – Replace multi-chip glue logic with a single reconfigurable device to reduce BOM and simplify board routing.
• Prototyping and field upgrades – Rapidly iterate hardware logic and deploy in-field updates using fast reconfiguration and TransFR capability.

Unique Advantages

• Secure, instant-on configuration: Non-volatile architecture eliminates external configuration memory and enables immediate device availability at power-up.
• Runtime flexibility: TransFR reconfiguration and quick SRAM reprogramming let you update or partition logic without full system downtime.
• High integration density: ~20,000 logic elements and ~0.4 Mbits of embedded RAM provide capacity for complex functions while reducing overall component count.
• Wide interface support: Programmable I/O buffers and up to 340 I/Os accommodate a broad set of signaling standards and peripheral connections.
• Robust clocking: Up to four analog PLLs enable precise clock domain control for high-performance timing requirements.
• Commercial-ready packaging: 484-ball FPBGA (23 × 23 mm) surface-mount package and RoHS compliance simplify integration into mainstream electronics designs.

Why Choose LFXP20C-3FN484C?

The LFXP20C-3FN484C positions itself as a high-density, reconfigurable solution for commercial applications that demand large I/O counts, substantial on-chip memory and secure, non-volatile configuration. Its combination of instant-on behavior, in-field reconfiguration and multiple PLLs offers practical advantages for systems requiring rapid startup, flexible feature upgrades and robust clock management.

This FPGA is well suited to designers and integrators building communication interfaces, memory controllers, protocol bridges and compact embedded systems who need a single, programmable device to reduce BOM and accelerate time-to-market while maintaining the option for in-field updates.

If you would like pricing, availability or to request a formal quote for the LFXP20C-3FN484C, submit an inquiry or request a quote and our team will respond with details.