LFXP20C-4F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 266 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-4F256C – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

The LFXP20C-4F256C is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, delivered in a 256-ball fpBGA (17 × 17 mm) surface-mount package. It integrates 2,464 logic blocks (20,000 logic elements), approximately 405,504 bits of on-chip RAM, and 188 I/Os to support reconfigurable system logic with dense I/O and embedded memory.

This device is designed for applications that require instant-on configuration, flexible I/O standards, and in-field reconfigurability while operating over a commercial temperature range and a wide supply range.

Key Features

  • Core / Logic  2,464 logic blocks and 20,000 logic elements provide capacity for mid-range FPGA designs and complex glue logic integration.
  • Embedded Memory  Approximately 405,504 bits of on-chip RAM (embedded block and distributed memory) for buffering, FIFOs and local data storage.
  • I/O and Package  188 programmable I/Os in a 256-FPBGA (17 × 17 mm) package; surface-mount mounting for compact board integration.
  • Non-volatile Configuration  ispXP non-volatile technology enables instant-on power-up without external configuration memory and provides design security.
  • Reconfiguration and Power Modes  TransFR™ in-field reconfiguration for updating logic while the system operates, plus a Sleep Mode that enables up to 1000× static current reduction.
  • Clocking and Memory Interfaces  Up to four analog PLLs for clock multiply/divide and phase shifting; dedicated DDR memory support up to DDR333 (166 MHz).
  • Flexible sysIO™ Buffers  Programmable I/O buffer support for a wide range of signaling standards as defined by the family architecture.
  • Supply and Temperature  Supply range: 1.71 V to 3.465 V. Operating temperature: 0 °C to 85 °C. Commercial grade and RoHS compliant.
  • System Level Support  IEEE 1149.1 boundary-scan (JTAG), ispTRACY internal logic analyzer capability, and on-board oscillator support for configuration.

Typical Applications

  • Embedded systems  Instant-on non-volatile configuration and on-chip memory are well suited for embedded control, signal preprocessing, and system glue logic.
  • Memory interface and buffering  Built-in DDR support and on-chip RAM enable interface logic, memory buffering and local data staging for systems using external DRAM.
  • Multi-protocol I/O and protocol bridging  Programmable sysIO buffers and 188 I/Os support mixed signaling standards for communications, interface conversion and protocol aggregation.
  • In-field upgradeable designs  TransFR reconfiguration allows updates to FPGA logic while the system remains operational, useful for deployed systems needing feature updates.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid power-up without external boot steps.
  • In-field reconfigurability: TransFR™ reconfiguration enables logic updates during operation, reducing maintenance downtime and enabling field feature upgrades.
  • Integrated memory reduces BOM: Approximately 405,504 bits of on-chip RAM minimize external memory requirements for many buffering and processing tasks.
  • Flexible I/O and clocking: Extensive sysIO programmability and up to four PLLs let designers adapt signaling and timing to diverse system needs.
  • Compact, high-density package: 256-FPBGA with 188 I/Os provides a small-footprint solution for space-constrained boards requiring significant I/O.
  • Power management features: Sleep Mode with large static current reduction helps reduce power draw in standby or low-activity conditions.

Why Choose LFXP20C-4F256C?

The LFXP20C-4F256C delivers a balance of logic capacity, embedded memory, flexible I/O and non-volatile instant-on operation for commercial-grade designs. Its combination of 20,000 logic elements, roughly 405,504 bits of on-chip RAM, 188 I/Os and 256-FPBGA packaging makes it a practical choice for mid-range FPGA tasks where rapid startup, in-field reconfigurability and compact integration are priorities.

Designers benefit from the LatticeXP family’s system-level features—clocking PLLs, boundary-scan and internal logic analysis—along with vendor-supplied design tools and IP to accelerate development and migration within the family.

Request a quote or submit an inquiry to check current availability, lead times and pricing for the LFXP20C-4F256C.

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