LFXP20C-4F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 266 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4F256C – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA
The LFXP20C-4F256C is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, delivered in a 256-ball fpBGA (17 × 17 mm) surface-mount package. It integrates 2,464 logic blocks (20,000 logic elements), approximately 405,504 bits of on-chip RAM, and 188 I/Os to support reconfigurable system logic with dense I/O and embedded memory.
This device is designed for applications that require instant-on configuration, flexible I/O standards, and in-field reconfigurability while operating over a commercial temperature range and a wide supply range.
Key Features
- Core / Logic 2,464 logic blocks and 20,000 logic elements provide capacity for mid-range FPGA designs and complex glue logic integration.
- Embedded Memory Approximately 405,504 bits of on-chip RAM (embedded block and distributed memory) for buffering, FIFOs and local data storage.
- I/O and Package 188 programmable I/Os in a 256-FPBGA (17 × 17 mm) package; surface-mount mounting for compact board integration.
- Non-volatile Configuration ispXP non-volatile technology enables instant-on power-up without external configuration memory and provides design security.
- Reconfiguration and Power Modes TransFR™ in-field reconfiguration for updating logic while the system operates, plus a Sleep Mode that enables up to 1000× static current reduction.
- Clocking and Memory Interfaces Up to four analog PLLs for clock multiply/divide and phase shifting; dedicated DDR memory support up to DDR333 (166 MHz).
- Flexible sysIO™ Buffers Programmable I/O buffer support for a wide range of signaling standards as defined by the family architecture.
- Supply and Temperature Supply range: 1.71 V to 3.465 V. Operating temperature: 0 °C to 85 °C. Commercial grade and RoHS compliant.
- System Level Support IEEE 1149.1 boundary-scan (JTAG), ispTRACY internal logic analyzer capability, and on-board oscillator support for configuration.
Typical Applications
- Embedded systems Instant-on non-volatile configuration and on-chip memory are well suited for embedded control, signal preprocessing, and system glue logic.
- Memory interface and buffering Built-in DDR support and on-chip RAM enable interface logic, memory buffering and local data staging for systems using external DRAM.
- Multi-protocol I/O and protocol bridging Programmable sysIO buffers and 188 I/Os support mixed signaling standards for communications, interface conversion and protocol aggregation.
- In-field upgradeable designs TransFR reconfiguration allows updates to FPGA logic while the system remains operational, useful for deployed systems needing feature updates.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid power-up without external boot steps.
- In-field reconfigurability: TransFR™ reconfiguration enables logic updates during operation, reducing maintenance downtime and enabling field feature upgrades.
- Integrated memory reduces BOM: Approximately 405,504 bits of on-chip RAM minimize external memory requirements for many buffering and processing tasks.
- Flexible I/O and clocking: Extensive sysIO programmability and up to four PLLs let designers adapt signaling and timing to diverse system needs.
- Compact, high-density package: 256-FPBGA with 188 I/Os provides a small-footprint solution for space-constrained boards requiring significant I/O.
- Power management features: Sleep Mode with large static current reduction helps reduce power draw in standby or low-activity conditions.
Why Choose LFXP20C-4F256C?
The LFXP20C-4F256C delivers a balance of logic capacity, embedded memory, flexible I/O and non-volatile instant-on operation for commercial-grade designs. Its combination of 20,000 logic elements, roughly 405,504 bits of on-chip RAM, 188 I/Os and 256-FPBGA packaging makes it a practical choice for mid-range FPGA tasks where rapid startup, in-field reconfigurability and compact integration are priorities.
Designers benefit from the LatticeXP family’s system-level features—clocking PLLs, boundary-scan and internal logic analysis—along with vendor-supplied design tools and IP to accelerate development and migration within the family.
Request a quote or submit an inquiry to check current availability, lead times and pricing for the LFXP20C-4F256C.

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