LFXP20C-4FN256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 421 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4FN256I – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA
The LFXP20C-4FN256I is a non-volatile LatticeXP family FPGA providing instant-on programmable logic with embedded memory and flexible I/O. The device integrates approximately 20,000 logic elements across 2,464 logic blocks and offers on-chip RAM totaling 405,504 bits (approximately 0.406 Mbits) for local data storage and buffering.
Designed for industrial-grade applications, this surface-mount 256-ball fpBGA (17 × 17 mm) package delivers up to 188 user I/Os, wide voltage support (1.71 V to 3.465 V) and an extended operating range from −40 °C to 100 °C, enabling compact system designs that require reconfigurable logic and versatile interface support.
Key Features
- Core Logic — Approximately 20,000 logic elements arranged across 2,464 logic blocks to implement combinational and sequential logic functions.
- Embedded Memory — Total on-chip RAM of 405,504 bits (≈0.406 Mbits) for distributed and block memory use within designs.
- I/O Flexibility — Up to 188 user I/Os in the 256-ball fpBGA package to support a broad set of external interfaces and peripherals.
- Supply Voltage Range — Operates from 1.71 V to 3.465 V to support multiple I/O standards and power domains.
- Industrial Temperature Grade — Specified for −40 °C to 100 °C operation for use in industrial environments.
- Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package for compact board-level integration.
- Non-volatile, Reconfigurable Architecture — Family-level features include instant-on non-volatile configuration and in-field reconfiguration capabilities.
- System Features — Family data highlights system-level support such as multiple PLLs, on-chip configuration options and debug capabilities for development and field updates.
- Regulatory — RoHS compliant.
Typical Applications
- Protocol Bridging and I/O Expansion — Use the device’s 188 I/Os and flexible voltage support to implement interface conversion and expansion functions.
- Embedded Processing and Control — Leverage ~20,000 logic elements and on-chip memory for real-time control, data preprocessing, and custom finite-state machines.
- Memory Interface and Buffering — Built-in memory resources and PLLs support designs that require local buffering and synchronized data paths.
- Field Upgrades and System Maintenance — Non-volatile configuration and family-level in-field reconfiguration capabilities enable updates without external configuration memory.
Unique Advantages
- Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and enables fast startup behavior.
- Compact, High-Density Package: 256-FPBGA (17 × 17 mm) package delivers a high I/O count and substantial logic density in a small footprint.
- Wide Voltage and Temperature Range: Flexible supply voltage (1.71 V–3.465 V) and −40 °C to 100 °C rating allow deployment across varied industrial environments.
- Significant On-chip Memory: Approximately 0.406 Mbits of embedded memory supports local data storage and efficient implementation of buffering and stateful logic.
- System-level Debug and Reconfiguration: Family features include programmable PLLs and in-field reconfiguration options to simplify development and long-term maintenance.
- RoHS Compliant: Conforms to RoHS environmental regulations for easier supply-chain integration.
Why Choose LFXP20C-4FN256I?
The LFXP20C-4FN256I positions itself as a compact, industrial-grade FPGA option for designs that demand non-volatile instant-on configuration, a substantial logic fabric, and flexible I/O in a 256-ball fpBGA package. Its combination of roughly 20,000 logic elements, approximately 0.406 Mbits of on-chip RAM, and 188 I/Os makes it suitable for embedded control, protocol bridging, and systems requiring in-field updates and tight board-space integration.
Choosing this device supports scalable design migration within the LatticeXP family and benefits development workflows that use family-level tools and IP blocks for faster time to market and maintainable field upgrades.
Request a quote or submit an inquiry to receive pricing and availability for LFXP20C-4FN256I and to discuss integration support for your design.