LFXP20C-4FN256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 421 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-4FN256I – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

The LFXP20C-4FN256I is a non-volatile LatticeXP family FPGA providing instant-on programmable logic with embedded memory and flexible I/O. The device integrates approximately 20,000 logic elements across 2,464 logic blocks and offers on-chip RAM totaling 405,504 bits (approximately 0.406 Mbits) for local data storage and buffering.

Designed for industrial-grade applications, this surface-mount 256-ball fpBGA (17 × 17 mm) package delivers up to 188 user I/Os, wide voltage support (1.71 V to 3.465 V) and an extended operating range from −40 °C to 100 °C, enabling compact system designs that require reconfigurable logic and versatile interface support.

Key Features

  • Core Logic — Approximately 20,000 logic elements arranged across 2,464 logic blocks to implement combinational and sequential logic functions.
  • Embedded Memory — Total on-chip RAM of 405,504 bits (≈0.406 Mbits) for distributed and block memory use within designs.
  • I/O Flexibility — Up to 188 user I/Os in the 256-ball fpBGA package to support a broad set of external interfaces and peripherals.
  • Supply Voltage Range — Operates from 1.71 V to 3.465 V to support multiple I/O standards and power domains.
  • Industrial Temperature Grade — Specified for −40 °C to 100 °C operation for use in industrial environments.
  • Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package for compact board-level integration.
  • Non-volatile, Reconfigurable Architecture — Family-level features include instant-on non-volatile configuration and in-field reconfiguration capabilities.
  • System Features — Family data highlights system-level support such as multiple PLLs, on-chip configuration options and debug capabilities for development and field updates.
  • Regulatory — RoHS compliant.

Typical Applications

  • Protocol Bridging and I/O Expansion — Use the device’s 188 I/Os and flexible voltage support to implement interface conversion and expansion functions.
  • Embedded Processing and Control — Leverage ~20,000 logic elements and on-chip memory for real-time control, data preprocessing, and custom finite-state machines.
  • Memory Interface and Buffering — Built-in memory resources and PLLs support designs that require local buffering and synchronized data paths.
  • Field Upgrades and System Maintenance — Non-volatile configuration and family-level in-field reconfiguration capabilities enable updates without external configuration memory.

Unique Advantages

  • Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and enables fast startup behavior.
  • Compact, High-Density Package: 256-FPBGA (17 × 17 mm) package delivers a high I/O count and substantial logic density in a small footprint.
  • Wide Voltage and Temperature Range: Flexible supply voltage (1.71 V–3.465 V) and −40 °C to 100 °C rating allow deployment across varied industrial environments.
  • Significant On-chip Memory: Approximately 0.406 Mbits of embedded memory supports local data storage and efficient implementation of buffering and stateful logic.
  • System-level Debug and Reconfiguration: Family features include programmable PLLs and in-field reconfiguration options to simplify development and long-term maintenance.
  • RoHS Compliant: Conforms to RoHS environmental regulations for easier supply-chain integration.

Why Choose LFXP20C-4FN256I?

The LFXP20C-4FN256I positions itself as a compact, industrial-grade FPGA option for designs that demand non-volatile instant-on configuration, a substantial logic fabric, and flexible I/O in a 256-ball fpBGA package. Its combination of roughly 20,000 logic elements, approximately 0.406 Mbits of on-chip RAM, and 188 I/Os makes it suitable for embedded control, protocol bridging, and systems requiring in-field updates and tight board-space integration.

Choosing this device supports scalable design migration within the LatticeXP family and benefits development workflows that use family-level tools and IP blocks for faster time to market and maintainable field upgrades.

Request a quote or submit an inquiry to receive pricing and availability for LFXP20C-4FN256I and to discuss integration support for your design.

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