LFXP20C-4FN388I

The LFXP20C-4FN388I is a Lattice XP family Field Programmable Gate Array (FPGA) provided in a 388-ball BGA (23 × 23 mm) surface-mount package. It integrates 20,000 logic elements, approximately 0.41 Mbits of on-chip RAM, and 268 general-purpose I/Os, delivering a balance of logic density, embedded memory and flexible interfacing for industrial-grade embedded systems.

Built on the LatticeXP architecture, this device offers non-volatile, instant-on configuration and in-field reconfiguration capabilities, making it suitable for designs that require fast start-up, secure configuration and the ability to update logic while a system is operating.

Key Features

• Logic Capacity – 20,000 logic elements for implementing medium-to-large combinational and sequential logic designs.
• On-chip Memory – Total RAM bits: 405,504 (approximately 0.41 Mbits) of embedded memory for buffering, temporary storage and local data paths.
• I/O Density and Flexibility – 268 I/Os provided in a 388-ball BGA package; sysIO buffer supports a wide range of interface standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Non-volatile, Instant-on Architecture – LatticeXP family features non-volatile configuration with instant-on operation and no external configuration memory required, improving security and reducing BOM.
• In-field Reconfiguration (TransFR™) – Supports reconfiguration of SRAM-based logic in milliseconds while the system remains operational for rapid feature updates.
• Clocking and Memory Support – Up to four analog PLLs per device for clock multiply/divide and phase shifting; dedicated DDR memory interface support (family-level support up to DDR333).
• Power and Low-Power Modes – Supports sleep mode with up to 1000× static current reduction (family feature) and operates across multiple core/I/O voltage rails within the 1.71 V to 3.465 V supply range.
• Industrial Temperature Grade – Specified operating temperature from −40 °C to 100 °C for use in temperature-demanding environments.
• Packaging and Mounting – 388-ball fpBGA / FPBGA (23 × 23 mm) surface-mount package suitable for compact, high-density board layouts.

Typical Applications

• Industrial control and automation – Industrial temperature rating and flexible I/O support sensor interfacing, control logic and protocol bridging in factory or process systems.
• Interface consolidation and protocol translation – High I/O count and multi-standard sysIO buffers enable consolidation of multiple interfaces and custom protocol conversion.
• Embedded signal processing and buffering – On-chip embedded RAM and 20,000 logic elements support local data processing, buffering and mid-range DSP/logic tasks.
• Systems requiring fast start-up and secure configuration – Non-volatile instant-on architecture removes external configuration memory and protects bit-stream security for systems with rapid boot requirements.

Unique Advantages

• Non-volatile instant-on operation: Eliminates external configuration memory and enables rapid power-up for faster system availability.
• Reconfigurable in-field updates: TransFR™ reconfiguration lets you update SRAM-based logic while a system is running, reducing downtime for feature and bug fixes.
• Wide I/O standard support: sysIO buffer compatibility with numerous standards simplifies multi-protocol designs and reduces the need for external transceivers.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• High integration in compact package: 20,000 logic elements, substantial embedded RAM and 268 I/Os in a 23 × 23 mm 388-ball BGA minimize board area and BOM complexity.

Why Choose LFXP20C-4FN388I?

The LFXP20C-4FN388I delivers a combination of non-volatile instant-on architecture, substantial logic and memory resources, and broad I/O flexibility in an industrial temperature-rated BGA package. It is well suited for engineers building mid-to-high complexity embedded systems that require secure configuration, fast startup, and the ability to evolve functionality in the field.

For designs that demand scalable performance, reliable operation across a wide temperature range, and a compact, high-I/O footprint, this LatticeXP device provides a practical, integrated solution supported by family-level features such as multi-standard I/O buffers, PLLs and DDR interface capability.

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