LFXP20C-4FN484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 360 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4FN484C – LatticeXP FPGA, 20,000 logic elements, 340 I/O, 484‑BBGA
The LFXP20C-4FN484C is a LatticeXP family field programmable gate array (FPGA) provided in a 484‑ball BGA package (23 × 23 mm). It combines 20,000 logic elements, extensive on‑chip memory and up to 340 I/O pins to address dense system designs that require flexible I/O, embedded memory and in-field reconfiguration.
Built on the LatticeXP architecture, the device supports non‑volatile, reconfigurable operation and features system‑level capabilities such as multiple PLLs and dedicated DDR memory interface support, making it suitable for complex embedded and communications-oriented applications that need fast start‑up and in‑system updates.
Key Features
- Logic Capacity 20,000 logic elements for implementing complex combinational and sequential logic functions.
- Embedded Memory Approximately 0.4 Mbits of on‑chip RAM (405,504 total RAM bits) for distributed and block memory requirements.
- I/O Density Up to 340 I/O pins in the 484‑BBGA package, enabling high‑pin‑count interfaces and board‑level routing flexibility.
- Non‑volatile, Instant‑on Architecture LatticeXP family technology provides non‑volatile configuration and instant power‑up without external configuration memory.
- In‑field Reconfiguration Supports TransFR™ reconfiguration for updating logic while the system is operating and reprogramming through system configuration and JTAG ports.
- Flexible I/O Standards Programmable I/O buffer supports a wide range of interfaces including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS (as supported by the family).
- Dedicated DDR Support and PLLs Device supports dedicated DDR interfaces (up to DDR333 as supported by the family) and provides up to four analog PLLs for clock management and phase control.
- Power and Temperature Operates from 1.71 V to 3.465 V and is specified for commercial temperature operation from 0 °C to 85 °C.
- Package and Mounting 484‑BBGA (supplier device package 484‑FPBGA, 23 × 23 mm) in a surface‑mount form factor; RoHS compliant.
Typical Applications
- Embedded systems and control Implements complex control logic, protocol handling and system glue in compact embedded platforms using the device’s logic density and on‑chip memory.
- Memory interface and buffering Dedicated DDR support and on‑chip RAM make this FPGA well suited for designs that require DDR interfaces, buffering and memory controllers.
- High‑pin‑count I/O bridging With up to 340 I/Os, the device can serve as an I/O concentrator or protocol bridge between multiple subsystems and external peripherals.
- In‑field updates and system upgrades TransFR™ reconfiguration enables in‑system logic updates and feature additions without removing the device from the board.
Unique Advantages
- Instant‑on, non‑volatile configuration: Reduces system initialization time and removes the need for external configuration memory.
- High logic and memory integration: 20,000 logic elements combined with approximately 0.4 Mbits of embedded RAM reduce external component count for many designs.
- Extensive I/O support: 340 I/Os and programmable sysIO buffers accommodate a broad set of interface standards to simplify board design and interoperability.
- Field reconfigurability: TransFR™ capability allows updates to logic while the system is operating, enabling post‑deployment feature enhancement and bug fixes.
- Flexible power rails: Wide supply range (1.71 V to 3.465 V) supports multiple I/O voltage domains and mixed‑voltage designs.
- Clocking and memory support: Up to four PLLs and dedicated DDR interface support enable robust timing control and high‑speed memory interfacing.
Why Choose LFXP20C-4FN484C?
The LFXP20C-4FN484C positions itself as a high‑density, non‑volatile FPGA option in a compact 484‑ball BGA package for commercial‑grade applications. Its combination of 20,000 logic elements, substantial on‑chip RAM and 340 I/Os delivers a balanced platform for embedded systems, memory interfaces and complex I/O bridging, while family features such as instant‑on configuration and in‑field reconfiguration support practical system development and lifecycle updates.
Designers seeking a reconfigurable solution with flexible I/O standards, integrated clocking and dedicated DDR capabilities will find the LFXP20C‑4FN484C well suited for projects that require fast startup, on‑board memory resources and the ability to update logic in the field.
Request a quote or submit a product inquiry to check availability and pricing for LFXP20C-4FN484C.

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