LFXP20C-5FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

Quantity 960 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-5FN388C – XP Field Programmable Gate Array (FPGA) IC, 20k Logic Elements, 388-BBGA

The LFXP20C-5FN388C is a non-volatile FPGA from the LatticeXP family offering 20,000 logic elements, 268 user I/Os and approximately 0.405 Mbits of on-chip RAM. Packaged in a 388-ball fpBGA (23 × 23 mm) and specified for commercial operation (0 °C to 85 °C), it targets cost‑effective system designs that require instant-on behavior, reconfigurable logic and flexible I/O support.

Key Features

  • Non-volatile, reconfigurable architecture – Instant-on operation with no external configuration memory required and support for in-system reconfiguration.
  • Logic density – 20,000 logic elements suitable for mid-density designs and on-chip implementation of complex logic functions.
  • Embedded memory – Total on-chip RAM of 405,504 bits (approximately 0.405 Mbits) combined with distributed RAM resources for data buffering and state storage.
  • High I/O count – 268 I/Os to support extensive peripheral and bus connectivity from a single device.
  • Flexible I/O and standards support – sysIO programmable buffer options include LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS, enabling a wide range of interface choices.
  • Dedicated memory interface – Implements interfaces up to DDR333 for connection to external DDR memory where required.
  • Clocking – Up to four analog PLLs for clock multiplication, division and phase shifting to simplify timing architectures.
  • Power and sleep – Supply range 1.71 V to 3.465 V with a sleep mode that enables substantial static current reduction for low-power states.
  • System-level debug and configuration – IEEE 1149.1 boundary scan and internal trace/logic analysis capabilities, plus an onboard oscillator to support configuration.
  • Package and mounting – Surface-mount 388-ball fpBGA (388-FPBGA, 23 × 23 mm) for compact board integration.
  • Commercial temperature grade – Rated for 0 °C to 85 °C operation.

Typical Applications

  • System control and peripheral interfacing – Use the 268 I/Os and programmable sysIO buffers to manage sensors, displays and multiple bus standards from a single FPGA.
  • Memory-interfaced designs – Leverage approximately 0.405 Mbits of embedded RAM and DDR333 interface capability for buffering, packet handling and temporary storage.
  • Field-upgradable logic – Instant-on non-volatile configuration and in-field reconfiguration support iterative firmware updates without external configuration memories.
  • Prototyping and mid-density integration – 20,000 logic elements and flexible clocking resources make this device suitable for prototyping and integration of mid-complexity digital subsystems.

Unique Advantages

  • Instant-on, no external config memory – Eliminates the BOM and board area needed for separate configuration flash while reducing system boot time.
  • High I/O capacity – 268 user I/Os enable consolidation of multiple interfaces and reduce the need for external glue logic or multiplexers.
  • Integrated memory resources – Approximately 0.405 Mbits of on-chip RAM plus distributed RAM options reduce external memory dependency for many applications.
  • Flexible interfacing – Broad sysIO support for common signaling standards simplifies board-level design across multiple subsystems.
  • Power management features – Sleep mode capability allows significant static current reduction for low-power product states.
  • Compact, surface-mount package – 388-ball fpBGA provides a high-pin-count footprint in a compact 23 × 23 mm package suitable for dense board designs.

Why Choose LFXP20C-5FN388C?

The LFXP20C-5FN388C delivers a balanced combination of mid-range logic capacity, substantial embedded memory and a high I/O count in a compact fpBGA package. Its non-volatile instant-on architecture and in-field reconfiguration enable flexible product design cycles and simplified system boot strategies.

This device is well-suited for designers seeking a commercial‑grade, reconfigurable platform for cost-sensitive system designs that require multiple interfaces, onboard memory resources and predictable power behavior. The LatticeXP family features and tool ecosystem support density migration and IP reuse across projects, helping protect design investment over time.

Request a quote or submit a pricing inquiry to get component availability and ordering details for the LFXP20C-5FN388C.

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