LFXP20E-3F484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 493 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-3F484I – LatticeXP FPGA, 20,000 logic elements, 340 I/O, 484-BBGA
The LFXP20E-3F484I is a non-volatile LatticeXP family FPGA in a 484-ball BGA (23 × 23 mm) package. It integrates 20,000 logic elements and 2,464 logic blocks with approximately 396 Kbits of embedded RAM, delivering a compact reconfigurable platform for system-level designs that require high I/O density, on-chip memory and instant-on configuration.
Designed for industrial operating conditions (-40°C to 100°C) and RoHS compliant, this device targets embedded systems and infrastructure applications that benefit from secure, instant-on operation, in-field reconfiguration and a broad set of I/O options.
Key Features
- Core Capacity — 20,000 logic elements and 2,464 logic blocks provide significant gate density for mid-range FPGA applications.
- On-chip Memory — Approximately 396 Kbits of embedded RAM (405,504 total bits) supports distributed and block memory implementations for buffering, FIFOs and local data storage.
- I/O Density and Package — Up to 340 I/Os in a 484-ball BGA (23 × 23 mm) footprint allows dense external interfacing in a compact package.
- Voltage and Power — Device core supply specified at 1.14 V to 1.26 V; family architecture supports multiple I/O voltage standards for flexible interfacing.
- Temperature and Grade — Industrial grade operation from -40°C to 100°C for deployment in demanding environments.
- Non-Volatile, Instant-On Architecture — Family-level ispXP non-volatile technology provides instant-on operation with no external configuration memory required and secure configuration storage.
- In-Field Reconfiguration and Sleep Mode — Supports in-field logic updates (TransFR™ Reconfiguration) and a sleep mode that can reduce static current by up to 1000× for power-sensitive systems.
- Clocking and Memory Interfaces — Up to four analog PLLs per device and dedicated DDR memory support (family-level) enable synchronized clock management and external memory interfacing.
- Standards and I/O Flexibility — Family-level programmable I/O buffers support a wide range of signaling standards to accommodate diverse interfaces.
- Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — Rapid, non-volatile configuration and substantial on-chip RAM make this device suitable for control and data-processing tasks where fast boot and secure configuration are important.
- Industrial Control — Industrial temperature range and high I/O count enable sensor interfacing, motor control and factory automation functions.
- Communications and Networking — High I/O density and flexible clocking support protocol bridging, interface adaptation and line-card functionality.
- Memory Interface Designs — Dedicated DDR memory support and multiple PLLs facilitate integration with external DDR devices for buffering and throughput-driven applications.
Unique Advantages
- Instant-on Non-Volatile Configuration: Eliminates the need for external configuration memory and enables rapid system startup.
- Secure, Reconfigurable Platform: Non-volatile architecture protects bitstream security and supports in-field logic updates without interrupting system operation.
- High Integration Density: 20,000 logic elements and ~396 Kbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
- Flexible I/O and Clocking: Up to 340 I/Os and up to four PLLs allow diverse interface support and precise clock management for multi-domain systems.
- Industrial Robustness: Rated for -40°C to 100°C operation and supplied in a compact 484-BBGA package for reliable deployment in harsh environments.
- Power Management Features: Sleep mode offering substantial static current reduction supports energy-sensitive applications.
Why Choose LFXP20E-3F484I?
The LFXP20E-3F484I positions itself as a versatile mid-range FPGA that balances logic capacity, on-chip memory and high I/O count in a compact industrial-grade package. Its non-volatile instant-on architecture, in-field reconfiguration capability and family-level system features (PLLs, DDR support and flexible I/O standards) make it well suited for embedded and system-level designs that require secure, reliable configurability and fast startup behavior.
This device is a compelling choice for engineers and procurement teams designing industrial control, communications, and embedded systems who need a reconfigurable, integrated solution with proven family-level capabilities and industrial temperature support.
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