LFXP20E-3F484C

The LFXP20E-3F484C is a LatticeXP family Field Programmable Gate Array (FPGA) in a 484-ball BBGA surface-mount package. It integrates approximately 20,000 logic elements and roughly 405,504 bits of on-chip RAM to address mid-density embedded logic and system-level integration needs.

Designed for commercial-grade applications, this non‑volatile, reconfigurable device targets systems requiring high I/O density and flexible memory resources while operating within a 0 °C to 85 °C temperature range and a 1.14 V to 1.26 V core supply range.

Key Features

• Core Capacity — Approximately 20,000 logic elements and 2,464 internal logic blocks provide the gate count and routing resources for complex mid-range FPGA designs.
• Embedded Memory — Total on-chip memory of 405,504 bits (approximately 0.4 Mbits) for block and distributed RAM usage within logic fabrics.
• High I/O Density — Up to 340 user I/Os to support wide sensor, peripheral and memory interfacing in a single device.
• Programmable I/O Standards — Family-level support for a broad set of interface standards (including LVDS and various LVCMOS and SSTL options) through programmable I/O buffers to accommodate multiple signaling requirements.
• Clocking — System-level clock management including up to four analog PLLs (per family documentation) for clock multiplication, division and phase control.
• Non-volatile, Reconfigurable Architecture — Instant-on, non-volatile configuration with in-system reconfiguration capability for field updates and secure designs without external configuration memory.
• Low-power Modes — Sleep mode capability reduces static current draw for power-sensitive applications (as described in the device family data).
• Package and Mounting — 484-ball BBGA (484-FPBGA, 23 × 23 mm) surface-mount package suitable for automated PCB assembly.
• Commercial Temperature and RoHS — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Embedded Controllers — Implement control logic, peripheral aggregation and custom interfaces in single-board systems using the device’s logic and memory resources.
• Communications Equipment — Support protocol bridging, packet handling and I/O-heavy front-end tasks with dense I/O and programmable I/O standards.
• Industrial Automation — Drive sensor aggregation, deterministic I/O tasks and intermediate processing in commercial automation equipment within the specified temperature range.

Unique Advantages

• Integrated On‑Chip Memory: Approximately 0.4 Mbits of embedded RAM reduces external memory needs and simplifies board-level design.
• High I/O Count: 340 I/Os allow consolidation of multiple interfaces and peripherals onto a single FPGA, reducing BOM and connector complexity.
• Non‑Volatile Instant‑On: Built-in non-volatile configuration removes the requirement for external configuration memory and enables rapid power-up behavior.
• Field Reconfigurability: In-system reconfiguration supports rapid updates and design iteration without hardware changes.
• Compact Surface-Mount Package: 484-ball BBGA (23 × 23 mm) provides a high-density solution for space-constrained PCBs.

Why Choose LFXP20E-3F484C?

The LFXP20E-3F484C positions itself as a mid-density, commercially graded FPGA that balances logic capacity, embedded memory and extensive I/O count in a single, non-volatile package. Its combination of approximately 20,000 logic elements, around 0.4 Mbits of on-chip RAM and 340 user I/Os makes it suitable for embedded systems, communications equipment and industrial automation projects that require board-level integration and in-field configurability.

Supported by the LatticeXP family architecture, this device offers system-level features such as PLL-based clocking and programmable I/O buffers, helping design teams scale functionality while controlling BOM and footprint. Choose this part when you need a reconfigurable, instant-on FPGA with a high pin-count package and commercial-grade operating parameters.

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