LFXP20E-3FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

Quantity 925 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-3FN388C – XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

The LFXP20E-3FN388C is a LatticeXP family FPGA delivering a non-volatile, instant-on programmable fabric with extensive on-chip memory and flexible I/O. Featuring 20,000 logic elements and approximately 0.406 Mbits of embedded RAM, this surface-mount 388-ball BGA device is suited for system designs that require reconfigurable logic with secure configuration and fast start-up.

Its combination of high I/O count (268), dedicated clocking resources, and support for in-field reconfiguration targets embedded applications and system-level designs that need on-chip memory, sophisticated I/O, and fast configuration behavior.

Key Features

  • Core Logic — 20,000 logic elements provide a programmable fabric for implementing complex digital functions and custom logic.
  • Embedded Memory — Total on-chip RAM of 405,504 bits (approximately 0.406 Mbits) for distributed and block memory requirements.
  • I/O Capacity — 268 I/Os available in the 388-ball fpBGA (23 × 23 mm) package to support dense peripheral and bus interfaces.
  • Non-volatile, Instant-on Architecture — Family-level features include non-volatile configuration with no external configuration memory required, enabling rapid power-up.
  • Reconfiguration and In-field Updates — TransFR™ reconfiguration allows in-field logic updates while the system operates; JTAG and system configuration ports are supported for reprogramming.
  • Low-Power Modes — Sleep mode capability enables large static current reductions (up to 1000× as specified for the family).
  • Clocking — Up to four analog/sysCLOCK PLLs for clock multiply/divide and phase shifting.
  • Voltage and Mounting — Core supply operating range from 1.14 V to 1.26 V; surface-mount package (388-FPBGA, 23×23 mm).
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded Systems — Implement control logic, protocol bridges or custom processing functions using the device’s on-chip memory and 20,000 logic elements.
  • High-density I/O Interfaces — Use the 268 I/Os in the 388-BBGA package for parallel interfaces, bus arbitration, or multi-channel signal routing.
  • Memory Interface and Timing — Dedicated PLLs and family-level DDR support enable integration with external memory interfaces and timing-sensitive designs.
  • Field-upgradable Systems — TransFR reconfiguration and JTAG support allow in-field updates and iterative feature deployment without removing the device from the system.

Unique Advantages

  • Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and enables rapid power-up behavior for systems that require immediate availability.
  • High Logic and Memory Integration: 20,000 logic elements combined with approximately 0.406 Mbits of on-chip RAM reduce external component needs and simplify board-level design.
  • Flexible I/O Density: 268 programmable I/Os in a compact 23 × 23 mm fpBGA package provide room for complex peripheral and bus connectivity.
  • In-field Reconfiguration: TransFR capability supports live updates to logic while the system remains operational, improving maintainability and upgrade paths.
  • Power Management Features: Sleep mode support (family-level) offers substantial static current reduction for power-sensitive designs.
  • Commercial Temperature and RoHS Compliance: Designed for commercial applications with a 0 °C to 85 °C operating window and RoHS compliance for regulatory alignment.

Why Choose LFXP20E-3FN388C?

The LFXP20E-3FN388C positions itself as a versatile, non-volatile FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O in a compact surface-mount fpBGA package. Its family-level features—instant-on configuration, in-field reconfiguration, multiple PLLs, and broad I/O support—make it suited for system-level designs that demand secure configuration and flexible interfacing.

This device is appropriate for teams developing embedded and board-level solutions that benefit from reduced external components, fast start-up, and the ability to update logic in the field while maintaining a commercial-grade operating range.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP20E-3FN388C and to discuss volume options or lead times.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up