LFXP20E-3FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA |
|---|---|
| Quantity | 925 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-3FN388C – XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA
The LFXP20E-3FN388C is a LatticeXP family FPGA delivering a non-volatile, instant-on programmable fabric with extensive on-chip memory and flexible I/O. Featuring 20,000 logic elements and approximately 0.406 Mbits of embedded RAM, this surface-mount 388-ball BGA device is suited for system designs that require reconfigurable logic with secure configuration and fast start-up.
Its combination of high I/O count (268), dedicated clocking resources, and support for in-field reconfiguration targets embedded applications and system-level designs that need on-chip memory, sophisticated I/O, and fast configuration behavior.
Key Features
- Core Logic — 20,000 logic elements provide a programmable fabric for implementing complex digital functions and custom logic.
- Embedded Memory — Total on-chip RAM of 405,504 bits (approximately 0.406 Mbits) for distributed and block memory requirements.
- I/O Capacity — 268 I/Os available in the 388-ball fpBGA (23 × 23 mm) package to support dense peripheral and bus interfaces.
- Non-volatile, Instant-on Architecture — Family-level features include non-volatile configuration with no external configuration memory required, enabling rapid power-up.
- Reconfiguration and In-field Updates — TransFR™ reconfiguration allows in-field logic updates while the system operates; JTAG and system configuration ports are supported for reprogramming.
- Low-Power Modes — Sleep mode capability enables large static current reductions (up to 1000× as specified for the family).
- Clocking — Up to four analog/sysCLOCK PLLs for clock multiply/divide and phase shifting.
- Voltage and Mounting — Core supply operating range from 1.14 V to 1.26 V; surface-mount package (388-FPBGA, 23×23 mm).
- Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
- Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — Implement control logic, protocol bridges or custom processing functions using the device’s on-chip memory and 20,000 logic elements.
- High-density I/O Interfaces — Use the 268 I/Os in the 388-BBGA package for parallel interfaces, bus arbitration, or multi-channel signal routing.
- Memory Interface and Timing — Dedicated PLLs and family-level DDR support enable integration with external memory interfaces and timing-sensitive designs.
- Field-upgradable Systems — TransFR reconfiguration and JTAG support allow in-field updates and iterative feature deployment without removing the device from the system.
Unique Advantages
- Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and enables rapid power-up behavior for systems that require immediate availability.
- High Logic and Memory Integration: 20,000 logic elements combined with approximately 0.406 Mbits of on-chip RAM reduce external component needs and simplify board-level design.
- Flexible I/O Density: 268 programmable I/Os in a compact 23 × 23 mm fpBGA package provide room for complex peripheral and bus connectivity.
- In-field Reconfiguration: TransFR capability supports live updates to logic while the system remains operational, improving maintainability and upgrade paths.
- Power Management Features: Sleep mode support (family-level) offers substantial static current reduction for power-sensitive designs.
- Commercial Temperature and RoHS Compliance: Designed for commercial applications with a 0 °C to 85 °C operating window and RoHS compliance for regulatory alignment.
Why Choose LFXP20E-3FN388C?
The LFXP20E-3FN388C positions itself as a versatile, non-volatile FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O in a compact surface-mount fpBGA package. Its family-level features—instant-on configuration, in-field reconfiguration, multiple PLLs, and broad I/O support—make it suited for system-level designs that demand secure configuration and flexible interfacing.
This device is appropriate for teams developing embedded and board-level solutions that benefit from reduced external components, fast start-up, and the ability to update logic in the field while maintaining a commercial-grade operating range.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP20E-3FN388C and to discuss volume options or lead times.

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