LFXP20E-3FN484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 30 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-3FN484C – XP Field Programmable Gate Array, 20,000 logic elements, 340 I/Os, 484-BBGA
The LFXP20E-3FN484C from Lattice Semiconductor is a non‑volatile LatticeXP family FPGA in a 484‑ball BGA (23×23 mm) package. It integrates approximately 20,000 logic elements, 405,504 bits of on‑chip RAM, and up to 340 I/O pins to address high‑density glue logic, protocol bridging, and system control in commercial electronic designs.
Designed for surface‑mount assembly and commercial temperature operation (0 °C to 85 °C), this device provides flexible I/O support, on‑chip memory resources and system‑level features suitable for a wide range of embedded applications where instant configuration and reconfigurability are required.
Key Features
- Core Capacity — Approximately 20,000 logic elements and 2,464 logic blocks provide substantial programmable fabric for mid‑to‑high complexity logic implementations.
- Embedded Memory — Total on‑chip RAM of 405,504 bits (396 Kbits) supporting distributed and block memory implementations for buffers, FIFOs and small data stores.
- High I/O Count — Up to 340 I/O pins enable broad interfacing options for parallel buses, high‑speed interfaces and multiple peripherals.
- Non‑volatile, Instant‑on Architecture — LatticeXP family non‑volatile technology allows fast power‑up without external configuration memory and supports in‑field reconfiguration.
- Flexible I/O Standards — Family-level flexible sysIO buffer support (documented in the LatticeXP datasheet) enables multiple interface standards across supply domains.
- Analog PLLs — On‑chip sysCLOCK PLL resources support clock multiplication, division and phase adjustments for system timing and memory interfaces.
- Power and Supply — Specified supply voltage range for this part is 1.14 V to 1.26 V, enabling integration in targeted power domains.
- Package and Assembly — 484‑ball FPBGA (23×23) package, surface‑mount mounting type for compact board integration.
- Commercial Grade & RoHS Compliant — Operates across a commercial temperature range (0 °C to 85 °C) and is RoHS compliant.
Typical Applications
- Protocol Bridging and Glue Logic — Use the device to consolidate multiple protocol translators or custom bus interfaces leveraging its high I/O count and dense logic resources.
- Custom Control and State Machines — Implement complex control logic and sequencing tasks utilizing the 20,000 logic elements and on‑chip memory for state storage.
- Embedded System Interfaces — Integrate multiple peripheral interfaces and timing domains with the device’s PLLs and flexible I/O options.
Unique Advantages
- Instant‑on Non‑volatile Operation: Eliminates the need for external configuration memory and enables fast power‑up behavior.
- High Integration Density: 20,000 logic elements and extensive on‑chip RAM reduce external component count and simplify board design.
- Large I/O Availability: Up to 340 I/Os allow direct interfacing to multiple buses and peripherals without additional I/O expanders.
- Flexible Clocking: On‑chip PLLs enable precise clock domain management for memory interfaces and system timing requirements.
- Compact BGA Package: 484‑ball FPBGA (23×23) provides a space‑efficient form factor for dense board layouts.
- Commercial Temperature and RoHS Compliance: Designed for standard commercial environments while meeting RoHS environmental requirements.
Why Choose LFXP20E-3FN484C?
The LFXP20E-3FN484C delivers a balanced combination of density, I/O capacity and non‑volatile reconfigurability for commercial embedded designs that require reliable instant‑on behavior and mid‑to‑high complexity logic. Its on‑chip memory and PLL resources make it suitable for designs that need integrated buffering and flexible clocking without extensive external components.
This part is well suited to engineers and teams building compact, highly integrated systems where board space, configuration security and the ability to reprogram logic in the field are key considerations. Backed by Lattice’s ecosystem and documented family features, the device supports scalable design choices across a range of commercial applications.
Request a quote or submit an inquiry for LFXP20E-3FN484C to discuss pricing, lead times and volume availability.