LFXP20E-3FN484C

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 30 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O340Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-3FN484C – XP Field Programmable Gate Array, 20,000 logic elements, 340 I/Os, 484-BBGA

The LFXP20E-3FN484C from Lattice Semiconductor is a non‑volatile LatticeXP family FPGA in a 484‑ball BGA (23×23 mm) package. It integrates approximately 20,000 logic elements, 405,504 bits of on‑chip RAM, and up to 340 I/O pins to address high‑density glue logic, protocol bridging, and system control in commercial electronic designs.

Designed for surface‑mount assembly and commercial temperature operation (0 °C to 85 °C), this device provides flexible I/O support, on‑chip memory resources and system‑level features suitable for a wide range of embedded applications where instant configuration and reconfigurability are required.

Key Features

  • Core Capacity — Approximately 20,000 logic elements and 2,464 logic blocks provide substantial programmable fabric for mid‑to‑high complexity logic implementations.
  • Embedded Memory — Total on‑chip RAM of 405,504 bits (396 Kbits) supporting distributed and block memory implementations for buffers, FIFOs and small data stores.
  • High I/O Count — Up to 340 I/O pins enable broad interfacing options for parallel buses, high‑speed interfaces and multiple peripherals.
  • Non‑volatile, Instant‑on Architecture — LatticeXP family non‑volatile technology allows fast power‑up without external configuration memory and supports in‑field reconfiguration.
  • Flexible I/O Standards — Family-level flexible sysIO buffer support (documented in the LatticeXP datasheet) enables multiple interface standards across supply domains.
  • Analog PLLs — On‑chip sysCLOCK PLL resources support clock multiplication, division and phase adjustments for system timing and memory interfaces.
  • Power and Supply — Specified supply voltage range for this part is 1.14 V to 1.26 V, enabling integration in targeted power domains.
  • Package and Assembly — 484‑ball FPBGA (23×23) package, surface‑mount mounting type for compact board integration.
  • Commercial Grade & RoHS Compliant — Operates across a commercial temperature range (0 °C to 85 °C) and is RoHS compliant.

Typical Applications

  • Protocol Bridging and Glue Logic — Use the device to consolidate multiple protocol translators or custom bus interfaces leveraging its high I/O count and dense logic resources.
  • Custom Control and State Machines — Implement complex control logic and sequencing tasks utilizing the 20,000 logic elements and on‑chip memory for state storage.
  • Embedded System Interfaces — Integrate multiple peripheral interfaces and timing domains with the device’s PLLs and flexible I/O options.

Unique Advantages

  • Instant‑on Non‑volatile Operation: Eliminates the need for external configuration memory and enables fast power‑up behavior.
  • High Integration Density: 20,000 logic elements and extensive on‑chip RAM reduce external component count and simplify board design.
  • Large I/O Availability: Up to 340 I/Os allow direct interfacing to multiple buses and peripherals without additional I/O expanders.
  • Flexible Clocking: On‑chip PLLs enable precise clock domain management for memory interfaces and system timing requirements.
  • Compact BGA Package: 484‑ball FPBGA (23×23) provides a space‑efficient form factor for dense board layouts.
  • Commercial Temperature and RoHS Compliance: Designed for standard commercial environments while meeting RoHS environmental requirements.

Why Choose LFXP20E-3FN484C?

The LFXP20E-3FN484C delivers a balanced combination of density, I/O capacity and non‑volatile reconfigurability for commercial embedded designs that require reliable instant‑on behavior and mid‑to‑high complexity logic. Its on‑chip memory and PLL resources make it suitable for designs that need integrated buffering and flexible clocking without extensive external components.

This part is well suited to engineers and teams building compact, highly integrated systems where board space, configuration security and the ability to reprogram logic in the field are key considerations. Backed by Lattice’s ecosystem and documented family features, the device supports scalable design choices across a range of commercial applications.

Request a quote or submit an inquiry for LFXP20E-3FN484C to discuss pricing, lead times and volume availability.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up