LFXP20E-4FN388I

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

Quantity 625 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-4FN388I – XP FPGA, 388-FPBGA, ~20K Logic Elements, 268 I/Os

The LFXP20E-4FN388I is a non-volatile LatticeXP family FPGA in a 388-ball fpBGA (23 × 23 mm) package designed for industrial embedded applications. The device integrates approximately 20,000 logic elements, a high-density I/O count and on-chip memory to support system-level functions such as memory interfacing and high-speed I/O bridging.

Built for designs that require instant-on configuration, flexible I/O standards and in-field reconfiguration, this FPGA targets industrial and communications-oriented applications where integration, reconfigurability and thermal robustness are important.

Key Features

  • Core Logic — 2,464 logic blocks and approximately 20,000 logic elements provide the programmable fabric for complex control, glue logic and protocol implementation.
  • Embedded Memory — Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) for distributed and block memory usage within the design.
  • I/O Density & Flexibility — 268 user I/O pins support a wide variety of external interfaces and high pin-count designs.
  • Package & Mounting — 388-ball fpBGA (388-FPBGA, 23 × 23 mm) in a surface-mount package for compact board-level integration.
  • Power — Core voltage supply range of 1.14 V to 1.26 V to match target system power rails.
  • Temperature & Grade — Industrial-grade operation from −40 °C to 100 °C for deployment in thermally demanding environments.
  • Non-volatile, Instant-On Configuration — Family-level features include non-volatile configuration with instant-on startup and no requirement for external configuration memory.
  • In-field Reconfiguration & Power Modes — Support for in-field logic update and sleep mode capability to significantly reduce static current draw.
  • Clocking & System Support — Family documentation indicates multiple PLL resources and system-level features such as IEEE 1149.1 boundary scan and internal logic analysis support.

Typical Applications

  • Industrial Control & Automation — Implement control logic, sensor interfacing and protocol bridging in systems requiring industrial temperature operation.
  • Communications & Networking — High I/O count and flexible I/O standards support interface adaptation, protocol conversion and I/O aggregation tasks.
  • Memory Interface & Bus Bridging — On-chip memory and dedicated memory interface support enable DDR and system-memory related functions.
  • Embedded Systems — Use as a compact, reconfigurable logic hub for embedded platforms that benefit from instant-on behavior and in-field updates.

Unique Advantages

  • Integrated, Non-volatile Configuration: Instant-on behavior and no external configuration memory simplifies system boot-up and secures configuration data.
  • Substantial Logic and Memory in a Compact Package: Roughly 20,000 logic elements and ~0.41 Mbits of embedded RAM in a 23 × 23 mm fpBGA reduce board area and BOM count.
  • High I/O Count: 268 I/Os enable dense external connectivity for multi-channel interfaces and complex system interconnects.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh and thermally variable environments.
  • Low-Voltage Core Operation: Core supply between 1.14 V and 1.26 V aligns with modern low-voltage power domains.
  • In-field Update and Low-Power Modes: Reconfiguration while in-system plus sleep mode capability provide flexibility for field upgrades and power-sensitive designs.

Why Choose LFXP20E-4FN388I?

With a balance of logic capacity, embedded memory and a high I/O count in a compact fpBGA package, the LFXP20E-4FN388I is positioned for embedded and industrial applications that demand instant-on configuration, robust thermal performance and the ability to adapt hardware functionality in the field. The device’s non-volatile architecture and system-level features simplify board design by eliminating external configuration memory and supporting onboard debug and clocking resources.

This FPGA is suited to design teams needing a scalable, reconfigurable building block for communications, industrial control, memory interface logic and embedded system integration while maintaining industrial temperature capability and low-voltage operation.

Request a quote or submit an inquiry for the LFXP20E-4FN388I to check availability and pricing for your next design.

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