LFXP20E-4FN388I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA |
|---|---|
| Quantity | 625 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-4FN388I – XP FPGA, 388-FPBGA, ~20K Logic Elements, 268 I/Os
The LFXP20E-4FN388I is a non-volatile LatticeXP family FPGA in a 388-ball fpBGA (23 × 23 mm) package designed for industrial embedded applications. The device integrates approximately 20,000 logic elements, a high-density I/O count and on-chip memory to support system-level functions such as memory interfacing and high-speed I/O bridging.
Built for designs that require instant-on configuration, flexible I/O standards and in-field reconfiguration, this FPGA targets industrial and communications-oriented applications where integration, reconfigurability and thermal robustness are important.
Key Features
- Core Logic — 2,464 logic blocks and approximately 20,000 logic elements provide the programmable fabric for complex control, glue logic and protocol implementation.
- Embedded Memory — Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) for distributed and block memory usage within the design.
- I/O Density & Flexibility — 268 user I/O pins support a wide variety of external interfaces and high pin-count designs.
- Package & Mounting — 388-ball fpBGA (388-FPBGA, 23 × 23 mm) in a surface-mount package for compact board-level integration.
- Power — Core voltage supply range of 1.14 V to 1.26 V to match target system power rails.
- Temperature & Grade — Industrial-grade operation from −40 °C to 100 °C for deployment in thermally demanding environments.
- Non-volatile, Instant-On Configuration — Family-level features include non-volatile configuration with instant-on startup and no requirement for external configuration memory.
- In-field Reconfiguration & Power Modes — Support for in-field logic update and sleep mode capability to significantly reduce static current draw.
- Clocking & System Support — Family documentation indicates multiple PLL resources and system-level features such as IEEE 1149.1 boundary scan and internal logic analysis support.
Typical Applications
- Industrial Control & Automation — Implement control logic, sensor interfacing and protocol bridging in systems requiring industrial temperature operation.
- Communications & Networking — High I/O count and flexible I/O standards support interface adaptation, protocol conversion and I/O aggregation tasks.
- Memory Interface & Bus Bridging — On-chip memory and dedicated memory interface support enable DDR and system-memory related functions.
- Embedded Systems — Use as a compact, reconfigurable logic hub for embedded platforms that benefit from instant-on behavior and in-field updates.
Unique Advantages
- Integrated, Non-volatile Configuration: Instant-on behavior and no external configuration memory simplifies system boot-up and secures configuration data.
- Substantial Logic and Memory in a Compact Package: Roughly 20,000 logic elements and ~0.41 Mbits of embedded RAM in a 23 × 23 mm fpBGA reduce board area and BOM count.
- High I/O Count: 268 I/Os enable dense external connectivity for multi-channel interfaces and complex system interconnects.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh and thermally variable environments.
- Low-Voltage Core Operation: Core supply between 1.14 V and 1.26 V aligns with modern low-voltage power domains.
- In-field Update and Low-Power Modes: Reconfiguration while in-system plus sleep mode capability provide flexibility for field upgrades and power-sensitive designs.
Why Choose LFXP20E-4FN388I?
With a balance of logic capacity, embedded memory and a high I/O count in a compact fpBGA package, the LFXP20E-4FN388I is positioned for embedded and industrial applications that demand instant-on configuration, robust thermal performance and the ability to adapt hardware functionality in the field. The device’s non-volatile architecture and system-level features simplify board design by eliminating external configuration memory and supporting onboard debug and clocking resources.
This FPGA is suited to design teams needing a scalable, reconfigurable building block for communications, industrial control, memory interface logic and embedded system integration while maintaining industrial temperature capability and low-voltage operation.
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