LFXP20E-4FN484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 1,694 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-4FN484I – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 484-BBGA
The LFXP20E-4FN484I from Lattice Semiconductor Corporation is a non-volatile, infinitely reconfigurable FPGA in a 484-ball BBGA package sized for high I/O density and industrial applications. Based on the LatticeXP family architecture, the device combines reconfigurable logic, on-chip memory and flexible I/O to support designs that require instant-on operation, field reconfiguration and a broad set of interface standards.
This surface-mount, industrial-grade device provides 20,000 logic elements, up to 340 I/O pins and approximately 0.41 Mbits of on-chip RAM, delivering a balance of capacity and system-level integration for demanding embedded and infrastructure designs.
Key Features
- Core Architecture Non-volatile ispXP-based LatticeXP family architecture with instant-on operation and infinitely reconfigurable logic.
- Logic Capacity Approximately 20,000 logic elements and 2,464 logic blocks (PFU/PFF) to implement medium-to-high complexity logic functions.
- Embedded Memory Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) for embedded and distributed memory needs.
- High-Density I/O Up to 340 I/O pins to support wide parallel interfaces and multi-channel designs.
- Flexible I/O Standards Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards.
- Reconfiguration & Security On-chip non-volatile configuration (no external configuration memory required), with TransFR™ in-field reconfiguration and programmable SRAM/non-volatile memory via system configuration and JTAG.
- Low-Power Modes Sleep mode supports significant static current reduction for low-power standby operation.
- System Support Up to four analog PLLs per device, IEEE 1149.1 boundary-scan and onboard oscillator for configuration and clocking flexibility.
- DDR Memory Interface Dedicated DDR memory support with interface capability up to DDR333 (166 MHz).
- Package & Temperature 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting, industrial operating range from -40 °C to 100 °C and supply voltage range of 1.14 V to 1.26 V.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Reconfigurable control logic and I/O aggregation in industrial systems that require an extended temperature range (-40 °C to 100 °C) and industrial-grade components.
- Communications Infrastructure High I/O count and dedicated DDR support enable channel interfacing, protocol bridging and memory-interfaced datapath functions for network and telecom equipment.
- Embedded Systems & Prototyping Instant-on, non-volatile configuration and JTAG programmability simplify development and accelerate time-to-prototype for embedded platforms.
- High-Density I/O Bridging Up to 340 I/Os make the device well-suited for applications requiring broad parallel connectivity or multi-channel sensor and interface aggregation.
Unique Advantages
- Instant-on, Non-volatile Configuration: No external configuration memory required, enabling fast startup and improved design security.
- Field Reconfiguration (TransFR™): In-field logic updates while the system operates, allowing incremental feature updates and field fixes.
- Broad I/O Flexibility: Programmable sysIO supports many industry-standard signaling families, reducing the need for external level translation.
- Compact, High-I/O Package: 484-ball FPBGA in a 23 × 23 mm footprint provides 340 I/Os in a compact surface-mount form factor.
- Low-Power Standby: Sleep mode provides substantial static current reduction for power-sensitive systems.
- Integrated System Resources: On-chip PLLs, onboard oscillator and boundary-scan support simplify clocking, debug and system integration.
Why Choose LFXP20E-4FN484I?
The LFXP20E-4FN484I positions itself as an industrial-grade, mid-to-high density FPGA that balances logic capacity, on-chip memory and flexible I/O in a compact 484-BBGA package. Its non-volatile architecture, instant-on behavior and in-field reconfiguration capabilities make it a practical choice for designs that require secure, fast-starting logic and the ability to update functionality in-system.
Designed with system integration in mind, the device benefits from multiple PLLs, extensive I/O signaling support and RoHS compliance. Development and migration are supported through the LatticeXP family ecosystem and available ispLEVER design tools and IP modules referenced in the family datasheet.
Request a quote or submit an inquiry to evaluate LFXP20E-4FN484I for your next design and to confirm pricing and availability.

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