LFXP20E-4FN484I

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 1,694 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O340Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-4FN484I – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 484-BBGA

The LFXP20E-4FN484I from Lattice Semiconductor Corporation is a non-volatile, infinitely reconfigurable FPGA in a 484-ball BBGA package sized for high I/O density and industrial applications. Based on the LatticeXP family architecture, the device combines reconfigurable logic, on-chip memory and flexible I/O to support designs that require instant-on operation, field reconfiguration and a broad set of interface standards.

This surface-mount, industrial-grade device provides 20,000 logic elements, up to 340 I/O pins and approximately 0.41 Mbits of on-chip RAM, delivering a balance of capacity and system-level integration for demanding embedded and infrastructure designs.

Key Features

  • Core Architecture Non-volatile ispXP-based LatticeXP family architecture with instant-on operation and infinitely reconfigurable logic.
  • Logic Capacity Approximately 20,000 logic elements and 2,464 logic blocks (PFU/PFF) to implement medium-to-high complexity logic functions.
  • Embedded Memory Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) for embedded and distributed memory needs.
  • High-Density I/O Up to 340 I/O pins to support wide parallel interfaces and multi-channel designs.
  • Flexible I/O Standards Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards.
  • Reconfiguration & Security On-chip non-volatile configuration (no external configuration memory required), with TransFR™ in-field reconfiguration and programmable SRAM/non-volatile memory via system configuration and JTAG.
  • Low-Power Modes Sleep mode supports significant static current reduction for low-power standby operation.
  • System Support Up to four analog PLLs per device, IEEE 1149.1 boundary-scan and onboard oscillator for configuration and clocking flexibility.
  • DDR Memory Interface Dedicated DDR memory support with interface capability up to DDR333 (166 MHz).
  • Package & Temperature 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting, industrial operating range from -40 °C to 100 °C and supply voltage range of 1.14 V to 1.26 V.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial Control Reconfigurable control logic and I/O aggregation in industrial systems that require an extended temperature range (-40 °C to 100 °C) and industrial-grade components.
  • Communications Infrastructure High I/O count and dedicated DDR support enable channel interfacing, protocol bridging and memory-interfaced datapath functions for network and telecom equipment.
  • Embedded Systems & Prototyping Instant-on, non-volatile configuration and JTAG programmability simplify development and accelerate time-to-prototype for embedded platforms.
  • High-Density I/O Bridging Up to 340 I/Os make the device well-suited for applications requiring broad parallel connectivity or multi-channel sensor and interface aggregation.

Unique Advantages

  • Instant-on, Non-volatile Configuration: No external configuration memory required, enabling fast startup and improved design security.
  • Field Reconfiguration (TransFR™): In-field logic updates while the system operates, allowing incremental feature updates and field fixes.
  • Broad I/O Flexibility: Programmable sysIO supports many industry-standard signaling families, reducing the need for external level translation.
  • Compact, High-I/O Package: 484-ball FPBGA in a 23 × 23 mm footprint provides 340 I/Os in a compact surface-mount form factor.
  • Low-Power Standby: Sleep mode provides substantial static current reduction for power-sensitive systems.
  • Integrated System Resources: On-chip PLLs, onboard oscillator and boundary-scan support simplify clocking, debug and system integration.

Why Choose LFXP20E-4FN484I?

The LFXP20E-4FN484I positions itself as an industrial-grade, mid-to-high density FPGA that balances logic capacity, on-chip memory and flexible I/O in a compact 484-BBGA package. Its non-volatile architecture, instant-on behavior and in-field reconfiguration capabilities make it a practical choice for designs that require secure, fast-starting logic and the ability to update functionality in-system.

Designed with system integration in mind, the device benefits from multiple PLLs, extensive I/O signaling support and RoHS compliance. Development and migration are supported through the LatticeXP family ecosystem and available ispLEVER design tools and IP modules referenced in the family datasheet.

Request a quote or submit an inquiry to evaluate LFXP20E-4FN484I for your next design and to confirm pricing and availability.

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