LFXP20E-5F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 575 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-5F256C – LatticeXP FPGA, 20,000 logic elements, 188 I/Os, 256-ball BGA

The LFXP20E-5F256C is a commercial-grade, non-volatile LatticeXP field programmable gate array (FPGA) delivered in a 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 20,000 logic elements, extensive on-chip RAM, and up to 188 I/Os to support compact, reconfigurable digital designs.

Designed for systems that require instant-on non‑volatile configuration and flexible I/O support, this device targets embedded and commercial applications where in-field reconfiguration, dense logic integration, and controlled power behavior are important considerations.

Key Features

  • Core Logic Approximately 20,000 logic elements with an architecture based on the LatticeXP family.
  • Embedded Memory Total on-chip RAM of 405,504 bits (approximately 405.5 Kbits) for distributed and block memory usage.
  • I/O Density & Flexibility Up to 188 I/Os in the 256-ball fpBGA package to support multiple interface signals and board routing density.
  • Non‑volatile, Instant‑on Configuration ispXP non-volatile technology provides instant-on power-up with no external configuration memory required and options for reconfiguration through system and JTAG ports.
  • In-field Reconfiguration TransFR™ reconfiguration enables logic updates while the system is operating, supporting iterative development and field updates.
  • Clocking Up to four analog sysCLOCK™ PLLs per device for clock multiplication, division and phase shifting.
  • Dedicated Memory Interface Support On-device support for DDR memory interfaces (dedicated DDR memory support described in family data).
  • Power and Sleep Modes Core voltage support specified at 1.14 V to 1.26 V and a sleep mode that allows substantial static current reduction.
  • Package & Temperature 256-ball fpBGA (17 × 17 mm) supplier device package; commercial operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant Meets RoHS environmental requirements.

Typical Applications

  • Embedded Systems Acts as a reconfigurable logic backbone for commercial embedded platforms that require high logic density and flexible I/O.
  • Memory Interface and Controller Integration Supports designs that implement DDR memory interfaces and require on-chip memory and PLL-based clock management.
  • Communications and Interface Bridging High I/O count and programmable I/O buffers make the device suitable for protocol bridging and multi‑standard interface tasks.
  • Field‑Upgradeable Products Non-volatile configuration with TransFR reconfiguration enables in-field updates for long-lived commercial products.

Unique Advantages

  • Instant-on, non‑volatile configuration: Eliminates external configuration memory and enables rapid power-up.
  • High logic density in a compact package: ~20,000 logic elements in a 256-ball fpBGA simplifies board-level integration for space‑constrained designs.
  • Ample on-chip memory: Approximately 405.5 Kbits of embedded RAM supports local buffering, state storage, and memory-mapped logic functions.
  • Flexible clocking and memory support: Up to four PLLs and dedicated DDR memory interface capability help implement synchronized, high-performance subsystems.
  • Rich I/O complement: 188 I/Os provide the signal density required for multi-interface commercial designs.
  • Commercial-grade thermal range and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial deployments.

Why Choose LFXP20E-5F256C?

The LFXP20E-5F256C positions itself as a compact, high‑density FPGA choice for commercial embedded designs that require non-volatile instant-on behavior, significant on-chip memory, and a high I/O count in a 17 × 17 mm fpBGA footprint. Its combination of approximately 20,000 logic elements, TransFR in-field reconfiguration, multiple PLLs, and dedicated memory interface support makes it suitable for platforms that need reconfigurability, flexible clocking, and dense interfacing.

For engineering teams and procurement targeting scalable commercial designs, this device offers a balance of integration and configurability—helping reduce system BOM while providing the on-board resources to implement complex logic, interface bridging, and in-field updates.

Request a quote or submit a purchase inquiry to receive pricing and availability information for LFXP20E-5F256C.

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